TSMC

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a prominent player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its cutting-edge semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

July 2024

22 JulyAvnet ASIC Team introduces Ultra-Low-Power Design Services for TSMC’s 4nm Nodes

17 JulyAI Server Demand Surge to Propel 2024 Market Value to $187B; Dominates Server Market

9 JulyApplied Materials Reveals Chip Wiring Advances for Greener Computing

4 JulyAMD and NVIDIA Fuel FOPLP Development, Mass Production Set for 2027-2028

June 2024

18 JuneSemiconductor Fab Capacity Set to Surge: 6% Growth in 2024, 7% in 2025

8 JuneIntel’s P-Core Architectures Compared: Skylake, Sunny Cove, Golden Cove, Redwood...

6 JuneTaiwanese Chipmakers Seize Global Opportunities Amidst Shifting Geopolitics and...

5 JuneIntel’s Panther Lake shines at Computex 2024, while Intel gears up for 18A wafer...

4 JuneIntel Introduces Lunar Lake Architecture: Enhanced P and E Cores, Xe2-LPG Graphics,...

3 JuneAMD introduces Zen 5-powered EPYC “Turin” CPUs: Boasting 192 Cores, Arriving...

3 JuneAMD Introduces Ryzen 9000 Processors for Desktop, Zen 5 Steals Spotlight at Computex 2024

May 2024

31 MayTSMC’s 3D Stacked SoIC Packaging Advances Rapidly, Aims for Ultra-Dense 3μm Pitch...

31 MayTSMC Nears 2nm Milestone: On Track for Mass Production in 2025

30 MayBlackwell Shipments Set to Boost CoWoS Capacity, Anticipated 70% Surge by 2025

25 MayRapidus Incorporates Chip Packaging Services into $32B 2nm Fab Blueprint

24 MayIntel’s 2024 CPU Roadmap: Lunar Lake & Arrow Lake Forge Path to Innovation

23 MayTSMC introduces Future Roadmap: N3X, N2P, A16 Set to Debut in 2025/2026

23 MayTSMC introduces ‘Global Gigafab’ Program, Provides Glimpse into Revolutionary...

19 MayLeaked: Intel’s Lunar Lake-Powered Handheld Gaming PC Boasts Impressive 1200p...

17 MayTSMC’s EUV Triumph: Amplifying Tools, Boosting Wafers, and Unmatched Pellicles

17 MayTSMC’s Specialized Capacity to Surge by 50%, Unveiling 4nm N4e Low-Power Node

16 MayTSMC Prepares Next-Gen HBM4 Base Dies, Leveraging 12nm and 5nm Nodes

16 MayTSMC’s 3nm N3P Process Aims for Mass Production in 2022, Promising Enhanced...

16 MayAMD Zen 6 Embraces TSMC’s 2nm Process: Unveiling Standard, Dense Classic &...

12 MayApple introduces M4 SoC for 2024 iPad Pro: A Technological Marvel Emerges

11 MayIntel’s 15th Gen CPUs: Unveiling 3 Intriguing Architectures Within a Single...

11 MayIntel introduces Arrow Lake Specs: Core Ultra 9 285K, Core Ultra 7 265K, and Core Ultra 5...

2 MaySamsung’s Latest Foundry Update: June Reveal of 2nm, Production of Second-Gen SF3...

2 MayIntel’s 15th Gen Arrow Lake CPUs Launched: Introducing Core Ultra 9 285K, Ultra 7...

April 2024

30 AprilTSMC Prepares Massive 8x Reticle Super Carrier Interposer for Next-Gen Chips,...

30 AprilIntel’s 15th Gen Core i5-15400F (Core Ultra 5 240F) Specs Leak: A Glimpse into...

29 AprilTSMC introduces Affordable 4nm N4C Process, Targeting 8.5% Cost Cut by 2025

28 AprilTSMC Ventures into Silicon Photonics, introduces 12.8 Tbps COUPE On-Package Interconnect...

27 AprilTSMC introduces CoW-SoW: A 3D System-on-Wafer Platform for Stacked Chip Innovation

26 AprilTSMC’s 30th North America Technology Symposium: Silicon Leadership Empowers AI...

26 AprilTSMC introduces 1.6nm Tech for Late 2026: A16 Empowered by “Super Power Rail”

26 AprilSK hynix bolsters AI memory dominance and collaboration at TSMC’s 2024 Tech...

25 AprilTSMC’s 2nm Tech: N2 Set for 2025, N2P Drops Backside Power, and NanoFlex Enhances...

21 AprilTSMC’s Q1’24 Report: 3nm Revenue Share Plummets, HPC Share Surges

21 AprilSK Hynix and TSMC Collaborate on HBM4 Development

19 AprilSK hynix teams up with TSMC to revolutionize HBM4 chip packaging.

18 April“Intel’s Lunar Lake: Unveiling the Intel Core Ultra 200V – A Promising...

17 AprilSamsung Secures $6.4B Funding for $40B Texas Fab in CHIPS Act Deal

16 AprilNVIDIA’s Blackwell Platform to Propel TSMC’s CoWoS Capacity by 150% in 2024

15 AprilIntel’s Core Ultra 2 introduces: i9-15900K/i7-15700K Surface Boasts Up to 24 Cores...

15 AprilIntel introduces Core Ultra 2: i9-15900K/i7-15700K with Up to 24 Cores, No Hyper-Threading

12 AprilAMD discreetly introduces the powerful Ryzen 7 8700F and Ryzen 5 8400F processors

9 AprilIntel introduces Gaudi 3 AI Accelerator: Scaling Up and Setting Sights on AI Market...

9 AprilTSMC Secures $6.6B Funding via US CHIPS Act, introduces Arizona 2nm Fab Construction

5 AprilSK hynix introduces $3.87B Memory Packaging Fab in the U.S., Paving the Way for HBM4 and...

March 2024

30 MarchIntel’s Latest: Core i9-15900K Arrow Lake-S, Lunar Lake-MX & Arc Battlemage...

30 MarchIntel’s 20A/18A CPUs Delayed: Core Ultra 3, Arrow & Lunar Lake on TSMC’s...

23 MarchIntel’s 15th Gen Core i9-15900H Emerges: 24 Cores, TSMC 3nm Fabrication, Diverging...

22 MarchNvidia CEO Affirms Strong Alliance with TSMC, Ensuring Solid Tech Collaboration

20 MarchArizona State University and Deca Technologies to Establish North America’s First...

19 MarchTSMC and Synopsys Collaborate to Introduce NVIDIA’s Revolutionary Computational...

19 MarchNVIDIA’s Blackwell Platform releases Next-Gen Computing, Ushering in a New Era

19 MarchNVIDIA introduces Blackwell Architecture and B200/B100 Accelerators: Revolutionizing Data...

19 MarchNVIDIA’s CuLitho Secures Backing from TSMC and Synopsys, Paving the Way for...

18 MarchQualcomm introduces Snapdragon 8s Gen 3: Affordable Chip Empowering High-End Phones