“Intel’s Lunar Lake: Unveiling the Intel Core Ultra 200V – A Promising Leap in Computing Power!”


April 18, 2024 by our News Team

Intel's highly anticipated Lunar Lake processors, featuring a chiplet design and powerful CPU and GPU performance, are set to revolutionize the world of computing and redefine the industry's standards.

  • Revolutionary chiplet design with three disaggregated dies
  • Impressive CPU and GPU performance
  • Innovative features like Foveros 3D packaging


Intel’s Lunar Lake: Unveiling the Intel Core Ultra 200V – A Promising Leap in Computing Power!

Intel, the technology giant, is set to revolutionize the world of computing with its highly anticipated Lunar Lake processors. The specifications of these processors have recently been leaked, giving us a glimpse into the incredible power and capabilities they possess. Thanks to the diligent work of 金猪升级包, we now have access to the complete specs-sheet of the Lunar Lake lineup.

The highlight of the Lunar Lake processors is undoubtedly the Core Ultra 200V (Core Ultra Series 2 “V”) model. This flagship processor boasts a chiplet (tiled) design, featuring three disaggregated dies. The first die is a compute + tGPU die, fabricated on TSMC’s 3nm (N3B) process. The second die is an I/O die, and finally, there is a dummy die on the bottom left.

Let’s delve into the specifications of the Core Ultra 200V CPU. It is equipped with 4x Lion Cove P-Cores and 4x Skymont LPE-Cores, resulting in a total of 8 CPU cores (4P + 4LPE). The base clock speed ranges from 1.8GHz to 2.10GHz, ensuring swift and efficient performance. The L2 cache stands at an impressive 2.5MB per P-core, with a total of 14MB overall. Additionally, the L3 cache exceeds 14MB and is shared among all cores.

Memory-wise, the Core Ultra 200V supports 32GB of LPDDR5X-8533 RAM, ensuring smooth multitasking and seamless operation. When it comes to power consumption, Intel has managed to strike a balance between performance and efficiency. The TDP (thermal design power) ranges from 17W to 30W, depending on the specific model.

The graphics capabilities of the Core Ultra 200V are equally impressive. It features the Xe2 (Battlemage) GPU architecture, which delivers exceptional visual performance. With 8 Xe Cores, 64 Vector Engines (SIMD16), and a shader count of 1024, this processor is a powerhouse when it comes to graphics-intensive tasks. The GPU clock speed is estimated to be around 2GHz, further enhancing its capabilities.

One notable aspect of the Lunar Lake lineup is the transition from E-Cores to LPE cores. Lunar Lake will be Intel’s first CPU lineup to entirely replace the E-cores with the SoC-centric LPE cores. While both core architectures are similar, the LPE cores are optimized for lower power consumption and operate independently of the compute die. This change will be particularly evident in the upcoming Meteor Lake.

Lunar Lake also introduces Foveros 3D packaging, a technology that allows for stacking the DRAM dies on top of the SoC. This innovative approach reduces motherboard complexity while limiting modularity. However, it opens up new possibilities for compact and efficient designs.

Intel has taken a unique approach to segmentation with the Lunar Lake lineup. All variants of Lunar Lake will feature the same core count (4P + 4LPE), but differentiation will be based on core clocks and the L3 cache. Lower-end models will have a reduced iGPU, while fanless designs will have a TDP of 15W to 28W. On the other hand, higher-end models will range from 17W to 30W, catering to users with varying performance requirements.

The Lunar Lake processors are poised to be the spiritual successors to Lakefield, offering unparalleled computing power and efficiency. Intel’s commitment to pushing the boundaries of technology is evident in these processors, which promise to redefine the computing landscape.

As we eagerly await the official release of the Lunar Lake lineup, it’s clear that Intel has once again raised the bar for the industry. With its chiplet design, powerful CPU and GPU performance, and innovative features like Foveros 3D packaging, the Core Ultra 200V is set to make a significant impact in the world of computing. Stay tuned for more information on Intel’s Lunar Lake processors, as they are sure to shape the future of computing as we know it.

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Background Information


About Intel: Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

Intel website  Intel LinkedIn

About TSMC: TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

TSMC website  TSMC LinkedIn

Technology Explained


chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.


CPU: The Central Processing Unit (CPU) is the brain of a computer, responsible for executing instructions and performing calculations. It is the most important component of a computer system, as it is responsible for controlling all other components. CPUs are used in a wide range of applications, from desktop computers to mobile devices, gaming consoles, and even supercomputers. CPUs are used to process data, execute instructions, and control the flow of information within a computer system. They are also used to control the input and output of data, as well as to store and retrieve data from memory. CPUs are essential for the functioning of any computer system, and their applications in the computer industry are vast.


E-Cores: E-Cores (Efficiency Cores) are a type of technology used in the computer industry to provide a more efficient and reliable way of powering and cooling computer components. They are made up of a combination of copper and aluminum, and are designed to be more efficient than traditional copper cores. E-Cores are used in a variety of applications, such as in CPUs, GPUs, and other computer components. They are also used in servers, laptops, and other electronic devices. The technology is designed to reduce heat and power consumption, while also providing a more reliable and efficient way of powering and cooling computer components.


GPU: GPU stands for Graphics Processing Unit and is a specialized type of processor designed to handle graphics-intensive tasks. It is used in the computer industry to render images, videos, and 3D graphics. GPUs are used in gaming consoles, PCs, and mobile devices to provide a smooth and immersive gaming experience. They are also used in the medical field to create 3D models of organs and tissues, and in the automotive industry to create virtual prototypes of cars. GPUs are also used in the field of artificial intelligence to process large amounts of data and create complex models. GPUs are becoming increasingly important in the computer industry as they are able to process large amounts of data quickly and efficiently.


iGPU: An integrated Graphics Processing Unit (iGPU) is a component built into a computer's central processing unit (CPU) or system-on-chip (SoC) that handles graphical tasks. Unlike dedicated graphics cards, which are separate components, an iGPU shares system resources with the CPU, allowing for basic graphics capabilities without the need for an additional card. While typically less powerful than dedicated GPUs, iGPUs are energy-efficient and well-suited for everyday computing tasks


L3 cache: L3 cache is a type of computer memory that is used to store frequently used data and instructions. It is located between the processor and main memory, and is used to reduce the amount of time it takes for the processor to access data from main memory. This helps to improve the overall performance of the computer. In the computer industry, L3 cache is used in many applications, such as gaming, video editing, and web browsing. It can also be used to improve the performance of servers and other high-performance computing tasks. By providing faster access to data, L3 cache can help to reduce the amount of time it takes for a computer to complete a task.


LPDDR5X: LPDDR5X is a type of computer memory technology that is used in many modern computers. It stands for Low Power Double Data Rate 5X and is a type of Random Access Memory (RAM). It is designed to be more efficient than its predecessors, allowing for faster data transfer speeds and lower power consumption. This makes it ideal for use in laptops, tablets, and other mobile devices. It is also used in gaming consoles and other high-end computers. LPDDR5X is capable of transferring data at up to 8400 megabits per second, making it one of the fastest types of RAM available. This makes it ideal for applications that require high performance, such as gaming, video editing, and 3D rendering.


P-Cores: P-Cores (Performance Cores) are a type of processor technology developed by Intel that is designed to improve the performance of computer systems. This technology is based on the concept of multi-core processors, which are processors that contain multiple cores or processing units. P-Cores are designed to increase the speed and efficiency of computer systems by allowing multiple cores to work together in parallel. This technology is used in a variety of applications, including gaming, video editing, and data analysis. P-Cores are also used in servers and other high-performance computing systems. The technology is also used in mobile devices, such as smartphones and tablets, to improve battery life and performance. P-Cores are an important part of the computer industry, as they allow for faster and more efficient computing.


SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.





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