SK hynix teams up with TSMC to revolutionize HBM4 chip packaging.

April 19, 2024 by our News Team

  • Collaboration between two industry leaders in AI memory and logic foundry
  • Potential for significant advancements and breakthroughs in HBM technology
  • Optimization of HBM integration with advanced packaging technology

In an exciting development for the tech industry, SK hynix Inc. has announced a collaboration with TSMC to produce next-generation High Bandwidth Memory (HBM) and enhance logic and HBM integration through advanced packaging technology. This partnership aims to drive innovation in HBM technology and deliver breakthroughs in memory performance.

The collaboration between SK hynix, a global leader in AI memory, and TSMC, a top global logic Foundry, holds great promise for the industry. By leveraging their respective expertise, the two companies can explore new possibilities for HBM technology. This trilateral collaboration, involving product design, foundry, and memory provider, is expected to pave the way for significant advancements.

The initial focus of the collaboration will be on improving the performance of the base die in the HBM package. HBM is created by stacking a core DRAM die on top of a base die using Through-Silicon Via (TSV) technology. The base die, located at the bottom, is connected to the GPU that controls the HBM. SK hynix has been using its proprietary technology for base dies up to HBM3E. However, for HBM4, they plan to adopt TSMC’s advanced logic process to maximize functionality within limited space. This will enable SK hynix to produce customized HBM solutions that cater to a wide range of customer demands for performance and power efficiency.

Additionally, SK hynix and TSMC will collaborate to optimize the integration of SK hynix’s HBM with TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) technology. This partnership will also involve joint efforts in addressing customer requests related to HBM.

Justin Kim, President and Head of AI Infra at SK hynix, expressed his optimism about the partnership, stating that it will accelerate their open collaboration with customers and solidify their position as the leading AI memory provider. Dr. Kevin Zhang, Senior Vice President of TSMC’s Business Development and Overseas Operations Office, and Deputy Co-Chief Operating Officer, echoed this sentiment, emphasizing the strong partnership between the two companies and their commitment to delivering integrated solutions for AI innovation.

This collaboration between SK hynix and TSMC marks an important step forward in the development of HBM technology. With their combined expertise and resources, they are poised to make significant contributions to the industry and unlock new possibilities for AI applications.

SK hynix teams up with TSMC to revolutionize HBM4 chip packaging.

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Background Information

About SK hynix: SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

SK hynix website  SK hynix LinkedIn

About TSMC: TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

TSMC website  TSMC LinkedIn

Technology Explained

CoWoS: CoWoS, or Chip-on-Wafer-on-Substrate, is a recent advancement in chip packaging that allows for more powerful processors in a compact size. This technology stacks multiple chips on a silicon interposer, enabling denser connections and improved performance. Developed for high-performance computing, CoWoS promises faster processing, lower power consumption, and the ability to pack more processing power into smaller devices.

Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

GPU: GPU stands for Graphics Processing Unit and is a specialized type of processor designed to handle graphics-intensive tasks. It is used in the computer industry to render images, videos, and 3D graphics. GPUs are used in gaming consoles, PCs, and mobile devices to provide a smooth and immersive gaming experience. They are also used in the medical field to create 3D models of organs and tissues, and in the automotive industry to create virtual prototypes of cars. GPUs are also used in the field of artificial intelligence to process large amounts of data and create complex models. GPUs are becoming increasingly important in the computer industry as they are able to process large amounts of data quickly and efficiently.

HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

Substrate: The technology substrate is a layer of material that provides a foundation for the components of a computer system. It is the foundation upon which the components of a computer system are built. It is usually made of a material such as silicon, which is a semiconductor material. The technology substrate is used to create the circuits and pathways that allow the components of a computer system to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components. The technology substrate is essential for the functioning of a computer system, as it provides the necessary pathways for the components to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components.

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