TSMC’s EUV Triumph: Amplifying Tools, Boosting Wafers, and Unmatched Pellicles

TSMC has emerged as a leader in EUV tooling, increasing their tool count and wafer production significantly since 2019, while also making advancements in productivity, power consumption, and pellicle technology. TSMC has become a leader in EUV tooling, increasing tool count and wafer production while making advancements in productivity, power consumption, and pellicle technology.

TSMC is the world's largest fab, giving them a significant advantage in the industry.
TSMC has emerged as a leader in EUV tooling, securing a majority share of the global EUV installed base.
TSMC has made significant advancements in productivity and energy efficiency through in-house innovations, allowing them to continue producing chips.

TSMC, the world’s largest fab, has been making significant strides in the use of extreme ultraviolet (EUV) lithography. While they may not be the first to adopt this technology (that honor goes to Samsung), TSMC has emerged as a leader in EUV tooling. During their European Technology Symposium, the company shared insights into their EUV usage history and their plans for integrating it into future process nodes.

Back in 2019, TSMC started using EUV lithography on its N7+ process, securing 42% of the global EUV tool installations. Even as ASML increased shipments of EUV scanners in 2020, TSMC’s share actually grew to 50%. Fast forward to 2024, and TSMC now holds a staggering 56% of the global EUV installed base, despite competition from Samsung and Intel. It’s clear that TSMC made a strategic decision to invest heavily in EUV early on, and it’s paying off.

Not only has TSMC increased its EUV tool count by tenfold since 2019, but its EUV wafer production has skyrocketed by a factor of 30. This impressive jump in production highlights TSMC’s ability to enhance productivity, reduce service times, and minimize tool downtimes. These achievements can be attributed to the company’s in-house innovations.

TSMC has managed to double the productivity of its EUV systems since 2019 by optimizing the exposure dose and photoresist used. Additionally, the company has made significant advancements in its pellicles for EUV reticles. These improvements have resulted in a fourfold increase in pellicle lifespan, a 4.5 times increase in output per pellicle, and an 80-fold reduction in defectivity. While TSMC doesn’t disclose the specifics of its pellicle technology, it’s possible that they may share this knowledge with academia in the future.

In addition to productivity enhancements, TSMC has also focused on reducing the power consumption of its EUV scanners. Through undisclosed energy-saving techniques, the company has achieved a 24% reduction in power consumption. Looking ahead, TSMC aims to further improve energy efficiency per wafer per EUV tool by 1.5 times by 2030.

With their extensive experience and advancements in Low-NA EUV lithography, TSMC is confident in their ability to continue producing chips. While rival Intel has chosen to embrace High-NA EUV for their future nodes, TSMC plans to leverage their optimized Low-NA EUV tooling. This approach allows them to avoid potential pitfalls associated with a major technology transition while reaping the cost benefits of using well-established tooling.

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Background Information

About ASML:

ASML is an innovation leader in the global semiconductor industry. ASML provide chipmakers with hardware, software and services to mass produce patterns on silicon through lithography. Their lithography systems use ultraviolet light to create billions of tiny structures on silicon that together make up a microchip. Founded in 1984 in the Netherlands with just a handful of employees, ASML hass now grown to over 40,000 employees, 143 nationalities and more than 60 locations around the world.

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

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About Samsung:

Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

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Technology Explained

EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.