Rapidus Incorporates Chip Packaging Services into $32B 2nm Fab Blueprint

The global Foundry market is experiencing unprecedented growth, driven by the demand for advanced process technologies in AI and HPC applications. With Intel entering the contract chipmaking game, competition in this market segment is heating up. Rapidus, a foundry startup backed by the Japanese government and major Japanese companies, is set to enter this competitive landscape in 2027 when its first fab comes online.

In an exciting update on the progress of its first leading-edge fab, Rapidus has announced its intention to venture into the chip packaging game as well. Once completed, the ¥5 trillion ($32 billion) fab will offer both chip lithography on a 2nm node and packaging services for chips produced within the facility. This is a notable separateion in an industry where chip packaging is typically outsourced or handled at dedicated facilities.

Rapidus aims to serve the same clients as industry giants TSMC, Samsung, and Intel Foundry. However, the company plans to differentiate itself by taking a unique approach to accelerate chipmaking from design to production.

Henri Richard, general manager and president of Rapidus’s U.S. subsidiary, expressed pride in the company’s Japanese roots while highlighting its focus on speed and flexibility. Atsuyoshi Koike, the head of Rapidus, brings a blend of Japanese quality and American thinking to the table, making him a unique and highly focused executive.

One of the most significant differences between Rapidus and traditional foundries is its commitment to offering only leading-edge manufacturing technologies. In 2027, Rapidus will start with a 2nm fabrication process, followed by a future transition to 1.4nm. This contrasts with other contract fabs that provide a full range of fabrication processes to attract more clients. Rapidus believes that there will be enough demand from Japanese and American chip developers for its 2nm process. However, it remains to be seen whether this business model will succeed, as the number of chip designers using the most advanced production nodes is relatively small.

Despite the dominance of TSMC in the industry, Rapidus is confident in its positioning. The company anticipates significant market growth and believes there is room for an independent foundry like itself. Richard noted that the entire industry is seeking alternative supply options, making Rapidus a welcome addition to the ecosystem.

In terms of advanced process technologies, Rapidus has made an interesting choice. Unlike other foundries, it does not plan to use ASML’s High-NA Twinscan EXE lithography scanners for 2nm production. Instead, Rapidus will utilize ASML’s proven Low-NA scanners, which will reduce costs but require EUV double patterning. This decision could prove economically viable, considering the high cost of High-NA EUV litho tools.

Looking ahead, Rapidus is also prepared to offer advanced packaging technologies within its leading-edge fab. This sets the company apart from its competitors, who typically have separate facilities for chip manufacturing and packaging. By integrating both processes on one campus, Rapidus aims to simplify the supply chain and streamline production.

Rapidus plans to reinvent the way chip design, front end, and back end work together to complete a project. The company aims to achieve fast production, high quality, high yield, and short cycle times.

As Rapidus prepares to enter the booming foundry market, it brings a fresh perspective and innovative approach that could disrupt the industry. With its focus on speed, flexibility, and integrated chip packaging, Rapidus aims to carve out a successful niche alongside established players like TSMC, Samsung, and Intel Foundry.

Background Information

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About ASML: ASML is an innovation leader in the global semiconductor industry. ASML provide chipmakers with hardware, software and services to mass produce patterns on silicon through lithography. Their lithography systems use ultraviolet light to create billions of tiny structures on silicon that together make up a microchip. Founded in 1984 in the Netherlands with just a handful of employees, ASML hass now grown to over 40,000 employees, 143 nationalities and more than 60 locations around the world.

  

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About Intel: Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

  

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About Samsung: Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

  

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About TSMC: TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

  

Technology Explained

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EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.