SK Hynix Commences Mass Production of HBM3E, Delivering Impressive 9.2 GT/s Speed

SK Hynix starts mass production of HBM3E memory, positioning itself as the second DRAM producer, offering healthy competition for ultra-high-performance memory, benefitting companies using HBM3E in products.

Introduces healthy competition in the market for ultra-high-performance memory
Features impressive specifications, surpassing the capabilities of HBM3
Implementation of advanced Mass Reflow Molded Underfill technology for improved heat dissipation

SK hynix has announced that it has commenced volume production of its HBM3E memory and will begin supplying it to a customer later this month. This move positions the South Korean company as the second DRAM producer to enter mass production of HBM3E, thereby introducing healthy competition into the market for ultra-high-performance memory. This development is particularly beneficial for companies planning to utilize HBM3E in their products.

In terms of specifications, SK Hynix’s HBM3E features known good stack dies (KGSDs) with a data transfer rate of 9.2 GT/s, a 1024-bit interface, and an impressive bandwidth of 1.18 TB/s. These figures significantly surpass the capabilities of HBM3, which offers a data transfer rate of 6.4 GT/s and a bandwidth of 819 GB/s. While SK Hynix has not explicitly stated whether it will mass produce 8Hi 24GB HBM3E memory modules or 12Hi 36GB HBM3E devices, it is likely that the company will initially focus on lower-capacity products for ease of production.

One notable feature of SK Hynix’s HBM3E stacks is the implementation of their advanced Mass Reflow Molded Underfill (MR-RUF) technology, which promises a 10% reduction in heat dissipation. This technology involves the use of an enhanced underfill material between DRAM layers, resulting in improved heat dissipation and reduced thickness of HBM stacks. Consequently, it becomes possible to construct 12-Hi HBM stacks that are the same height as 8-Hi modules. However, it should be noted that the current mass-produced stacks may not necessarily be 12-Hi HBM3E stacks.

While SK Hynix has not officially confirmed this, it is expected that their 24GB HBM3E stacks will be well-suited for nVidia’s H200 GPU, which is designed for artificial intelligence and high-performance computing applications.

Sungsoo Ryu, Head of HBM business at SK Hynix, expressed confidence in the company’s position as a leading provider of AI memory, stating, “With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider.” This means that Nvidia will have access to HBM3E memory from both Micron and SK Hynix.

Additionally, AMD has recently confirmed its plans to expand its Instinct MI300-series lineup for AI and HPC applications with higher-performance memory configurations. Therefore, it is possible that SK Hynix’s HBM3E memory could also find application in AMD’s products.

Source: SK Hynix

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Background Information

About AMD: AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.

About nVidia: NVIDIA has firmly established itself as a leader in the realm of client computing, continuously pushing the boundaries of innovation in graphics and AI technologies. With a deep commitment to enhancing user experiences, NVIDIA's client computing business focuses on delivering solutions that power everything from gaming and creative workloads to enterprise applications. for its GeForce graphics cards, the company has redefined high-performance gaming, setting industry standards for realistic visuals, fluid frame rates, and immersive experiences. Complementing its gaming expertise, NVIDIA's Quadro and NVIDIA RTX graphics cards cater to professionals in design, content creation, and scientific fields, enabling real-time ray tracing and AI-driven workflows that elevate productivity and creativity to unprecedented heights. By seamlessly integrating graphics, AI, and software, NVIDIA continues to shape the landscape of client computing, fostering innovation and immersive interactions in a rapidly evolving digital world.

About SK hynix: SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

Technology Explained

GPU: GPU stands for Graphics Processing Unit and is a specialized type of processor designed to handle graphics-intensive tasks. It is used in the computer industry to render images, videos, and 3D graphics. GPUs are used in gaming consoles, PCs, and mobile devices to provide a smooth and immersive gaming experience. They are also used in the medical field to create 3D models of organs and tissues, and in the automotive industry to create virtual prototypes of cars. GPUs are also used in the field of artificial intelligence to process large amounts of data and create complex models. GPUs are becoming increasingly important in the computer industry as they are able to process large amounts of data quickly and efficiently.

HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.