AsiaTSMC is expanding its CoWoS packaging capacity to meet the increasing demand for compute GPUs, FPGAs, and accelerators used for AI and HPC applications, with the company expecting the shortage to be alleviated within 1.5 years.
Asia
- TSMC is expanding its CoWoS capacity to alleviate the shortage within 1.5 years.
- TSMC is responsible for producing the majority of processors that power popular AI services.
- TSMC is investing billions of dollars in upcoming advanced packaging facilities.
Reports of a shortage in compute GPUs used for AI and HPC servers have been circulating in recent months, as the demand for GPUs to power generative AI applications continues to skyrocket. TSMC, one of the leading chip manufacturers, has acknowledged that the main bottleneck in GPU supply is its CoWoS packaging capacity, which is utilized by nearly all players in the AI and HPC industries. While TSMC is expanding its CoWoS capacity, it anticipates that the shortage will persist for approximately 1.5 years.
Mark Liu, Chairman of TSMC, explained, “It’s not a shortage of AI chips; it’s a shortage of our CoWoS capacity. Currently, we are unable to meet 100% of our customers’ demands, but we strive to support around 80%. We view this as a temporary situation, and once we expand our advanced chip packaging capacity, it should alleviate the issue within 1.5 years.”
TSMC is responsible for producing the majority of processors that power popular AI services, including compute GPUs like AMD’s Instinct MI250 and nVidia’s A100 and H100, as well as FPGAs, specialized ASICs from companies like d-Matrix and Tenstorrent, and proprietary processors from cloud service providers such as AWS’s Trainium and Inferentia, and Google’s TPU.
It’s worth noting that compute GPUs, FPGAs, and accelerators from cloud service providers all utilize HBM memory to achieve optimal bandwidth and rely on TSMC’s interposer-based chip-on-wafer-on-Substrate packaging. While other outsourced semiconductor assembly and test (OSAT) companies like ASE and Amkor also offer similar packaging technologies, TSMC seems to be receiving the majority of orders, making it difficult for them to keep up with the demand for their packaging services.
Industry analysts suggest that OSATs are less inclined to offer advanced packaging services due to the significant capital investment and higher financial risks associated with it compared to traditional packaging. For instance, if there’s an issue with a mainstream processor on an organic substrate, an OSAT would only lose one chip. However, if a package carrying four chiplets and eight HBM memory stacks encounters a problem, the losses could amount to hundreds or even thousands of dollars. Given that OSATs do not generate substantial margins from producing chiplets, they are more cautious about expanding their advanced packaging capacity, despite the higher costs involved.
Like its competitors, TSMC is investing billions of dollars in upcoming advanced packaging facilities. Recently, the company announced plans to spend approximately $2.9 billion on a packaging fab, rumored to be operational by 2027.
“We are rapidly increasing our capacity,” stated C.C. Wei, CEO of TSMC, during the company’s earnings call earlier this year. “We expect some relief from these constraints next year, likely towards the end of the year. […] I won’t provide you with the exact number [of processed wafers capacity], but CoWoS capacity will double in 2024 compared to 2023.”
Source: Nikkei
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AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.Latest Articles about AMD
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NVIDIA has firmly established itself as a leader in the realm of client computing, continuously pushing the boundaries of innovation in graphics and AI technologies. With a deep commitment to enhancing user experiences, NVIDIA's client computing business focuses on delivering solutions that power everything from gaming and creative workloads to enterprise applications. for its GeForce graphics cards, the company has redefined high-performance gaming, setting industry standards for realistic visuals, fluid frame rates, and immersive experiences. Complementing its gaming expertise, NVIDIA's Quadro and NVIDIA RTX graphics cards cater to professionals in design, content creation, and scientific fields, enabling real-time ray tracing and AI-driven workflows that elevate productivity and creativity to unprecedented heights. By seamlessly integrating graphics, AI, and software, NVIDIA continues to shape the landscape of client computing, fostering innovation and immersive interactions in a rapidly evolving digital world.Latest Articles about nVidia
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TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.Latest Articles about TSMC
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