Broadcom introduces 3.5D F2F Tech for Next-Gen AI Processing Units

Broadcom introduces Game-Changing 3.5D XDSiP Technology

Today, Broadcom Inc. made waves in the tech world with the launch of its innovative 3.5D eXtreme Dimension System in Package (XDSiP) platform. This new technology is set to revolutionize how consumer AI companies develop custom accelerators, or XPUs, pushing the boundaries of what’s possible in high-efficiency, low-power computing. Imagine packing over 6000 mm² of silicon and up to 12 high bandwidth memory (HBM) stacks into a single device. That’s precisely what the 3.5D XDSiP aims to achieve, and it’s a significant leap forward for AI at scale.

Why XPUs Are the Future of AI

The demand for computational power in training generative AI models is skyrocketing. We’re talking about massive clusters that can range from 100,000 to a staggering 1 million XPUs. But here’s the catch: as these XPUs become more powerful, they also require increasingly sophisticated integration of compute, memory, and I/O capabilities. Traditional methods like Moore’s Law just can’t keep pace anymore. Have you ever wondered how tech companies will tackle these challenges? The answer lies in advanced system-in-package (SiP) integration, which is becoming essential for the next generation of XPUs.

Over the past decade, 2.5D integration has been a game-changer, allowing for the combination of multiple chiplets and HBM modules on an interposer. But as we introduce more complex large language models (LLMs), we need to think bigger—literally. This is where 3D silicon stacking comes into play, offering better size, power, and cost efficiencies. Broadcom’s 3.5D integration combines the best of both worlds, making it the go-to technology for XPUs in the upcoming decade.

What Makes Broadcom’s 3.5D XDSiP Stand Out?

Broadcom’s 3.5D XDSiP platform is not just another upgrade; it’s a significant advancement in interconnect density and power efficiency. By adopting a Face-to-Face (F2F) stacking method, Broadcom has achieved a remarkable 7x increase in signal density between stacked dies compared to the traditional Face-to-Back (F2B) approach. This means faster communication between components, which is crucial for performance.

But that’s not all. The platform also boasts a 10x reduction in power consumption when it comes to die-to-die interfaces, thanks to its innovative use of 3D high-speed chip-to-chip (HCB) technology. And if you’re worried about Latency, you can breathe easy—the 3D stack minimizes delays between compute, memory, and I/O components, making everything run smoother. Plus, a more compact form factor means less space is required, leading to cost savings and improved package warpage.

Collaboration Is Key

Broadcom’s lead F2F 3.5D XPU integrates four compute dies, one I/O die, and six HBM modules, all utilizing TSMC’s process nodes and 2.5D CoWoS packaging technologies. The collaboration between Broadcom and TSMC has been a powerhouse of innovation. Frank Ostojic, Senior Vice President and General Manager of Broadcom’s ASIC Products Division, emphasized the importance of this partnership, stating, “By stacking chip components vertically, we enable chip designers to pair the right fabrication processes for each component while shrinking the interposer and package size.”

Dr. Kevin Zhang from TSMC echoed this sentiment, highlighting how their advanced logic processes and 3D chip stacking technologies complement Broadcom’s design expertise. This synergy is vital for unleashing AI innovations and paving the way for future growth.

Looking Ahead: Broadcom’s Vision for AI

With over five 3.5D products in the pipeline, Broadcom is clearly committed to pushing the envelope. Their consumer AI customers are already on board, with production shipments expected to kick off in February 2026. Naoki Shinjo from Fujitsu noted that Broadcom’s latest 3.5D platform will enable their next-generation 2-nanometer ARM-based processor, FUJITSU-MONAKA, to achieve remarkable performance while keeping power consumption and costs low.

As we stand on the brink of what could be a transformative era for AI, Broadcom’s 3.5D XDSiP technology is set to play a pivotal role. So, are you ready to see how these advancements will shape the future of artificial intelligence?

Background Information

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About ARM:

ARM, originally known as Acorn RISC Machine, is a British semiconductor and software design company that specializes in creating energy-efficient microprocessors, system-on-chip (SoC) designs, and related technologies. Founded in 1990, ARM has become a important player in the global semiconductor industry and is widely recognized for its contributions to mobile computing, embedded systems, and Internet of Things (IoT) devices. ARM's microprocessor designs are based on the Reduced Instruction Set Computing (RISC) architecture, which prioritizes simplicity and efficiency in instruction execution. This approach has enabled ARM to produce highly efficient and power-saving processors that are used in a vast array of devices, ranging from smartphones and tablets to IoT devices, smart TVs, and more. The company does not manufacture its own chips but licenses its processor designs and intellectual property to a wide range of manufacturers, including Qualcomm, Apple, Samsung, and NVIDIA, who then integrate ARM's technology into their own SoCs. This licensing model has contributed to ARM's widespread adoption and influence across various industries.

  

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About Broadcom:

Founded in 1961, Broadcom is a leading global technology company headquartered in the United States. They specialize in semiconductor and infrastructure software solutions. Broadcom's innovations in connectivity, networking, and storage technologies have made them a key player in the industry, with a focus on enabling seamless communication and connectivity in the digital world.

  

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About Fujitsu:

Fujitsu is a important Japanese technology company for its wide array of computing solutions. With a history dating back to 1935, Fujitsu excels in producing personal computers, laptops, and tablets that combine innovation and reliability. In addition to consumer-focused products, Fujitsu is a key player in enterprise solutions, offering servers, storage systems, and data center services. The company's emphasis on quality, advanced features, and IT services has solidified its position as a significant player in the global computing industry.

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

  

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Technology Explained

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

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CoWoS: CoWoS, or Chip-on-Wafer-on-Substrate, is a recent advancement in chip packaging that allows for more powerful processors in a compact size. This technology stacks multiple chips on a silicon interposer, enabling denser connections and improved performance. Developed for high-performance computing, CoWoS promises faster processing, lower power consumption, and the ability to pack more processing power into smaller devices.

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Latency: Technology latency is the time it takes for a computer system to respond to a request. It is an important factor in the performance of computer systems, as it affects the speed and efficiency of data processing. In the computer industry, latency is a major factor in the performance of computer networks, storage systems, and other computer systems. Low latency is essential for applications that require fast response times, such as online gaming, streaming media, and real-time data processing. High latency can cause delays in data processing, resulting in slow response times and poor performance. To reduce latency, computer systems use various techniques such as caching, load balancing, and parallel processing. By reducing latency, computer systems can provide faster response times and improved performance.

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XPU: XPU is a type of processor technology developed by Intel that is designed to provide high performance computing capabilities for a variety of applications. It is based on the x86 instruction set architecture and is capable of running multiple threads simultaneously. XPUs are used in a variety of computer systems, including desktop PCs, servers, and embedded systems. They are also used in gaming consoles, such as the Xbox One and PlayStation 4. XPUs are designed to provide faster processing speeds, improved power efficiency, and better multitasking capabilities. They are also capable of running multiple operating systems, allowing for more flexibility in the types of applications that can be run on the system. XPUs are becoming increasingly popular in the computer industry due to their ability to provide high performance computing capabilities at a relatively low cost.

Latest Articles about XPU