Applied Materials Reveals Chip Wiring Advances for Greener Computing

Applied Materials, Inc. has just made a major breakthrough in materials engineering that could revolutionize computer systems. By enabling copper wiring to scale down to the 2 nm logic node and beyond, they are paving the way for more energy-efficient computing in the AI era. Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, emphasized the importance of chip wiring and stacking in improving performance and power consumption.

To understand the significance of this innovation, we need to delve into the challenges posed by classic Moore’s Law scaling. Today’s most advanced logic chips contain billions of transistors connected by miles of microscopic copper wiring. Each layer of a chip’s wiring starts with a thin film of dielectric material, which is etched to create channels that are then filled with copper. For decades, chipmakers have relied on low-k dielectrics and copper as their go-to combination for wiring, as it allows for improvements in scaling, performance, and power efficiency with each generation.

However, as we scale down to 2 nm and below, thinner dielectric materials make chips mechanically weaker, and narrowing the copper wires leads to a steep increase in electrical resistance. These factors can reduce chip performance and increase power consumption, posing significant challenges for the industry.

This is where Applied Materials’ enhanced low-k dielectric material, known as Black Diamond, comes into play. Black Diamond has been a leading material in the industry for years, as it reduces the buildup of electrical charges that increase power consumption and cause interference between electrical signals. The latest version of Black Diamond takes things up a notch by reducing the minimum k-value, enabling scaling to 2 nm and below. It also offers increased mechanical strength, which is crucial as chipmakers and systems companies explore new heights with 3D logic and memory stacking.

The adoption of this new Black Diamond technology has been swift, with all leading logic and DRAM chipmakers embracing it. This is a testament to its effectiveness in addressing the challenges posed by scaling down to the nanometer level.

Another key aspect of Applied Materials’ innovation lies in their new binary metal liner, which enables the use of ultrathin copper wires. To scale chip wiring, chipmakers etch each layer of low-k film to create trenches and then deposit a barrier layer to prevent copper migration into the chip. A liner is then applied to ensure adhesion during the final copper reflow deposition sequence. However, as chip wiring scales further, the barrier and liner take up more space, making it physically impossible to create low-resistance, void-free copper wiring.

Applied Materials’ solution to this problem is their Integrated Materials Solution (IMS), which combines six different technologies in one high-vacuum system. The standout feature of this solution is the binary metal combination of ruthenium and cobalt (RuCo). This combination reduces the liner’s thickness by 33 percent to 2 nm, improves surface properties for void-free copper reflow, and reduces electrical line resistance by up to 25 percent. These improvements lead to enhanced chip performance and reduced power consumption.

The new Applied Endura Copper Barrier Seed IMS with Volta Ruthenium CVD is already being adopted by leading logic chipmakers and has started shipping to customers at the 3 nm node. This technology promises to push the boundaries of what is possible in chip wiring.

The response from industry leaders has been overwhelmingly positive. Sunjung Kim, VP & Head of Foundry Development Team at Samsung Electronics, highlighted the importance of overcoming challenges in interconnect wiring resistance, capacitance, and reliability. Dr. Y.J. Mii, Executive Vice President and Co-Chief Operating Officer at TSMC, emphasized the need for new materials that reduce interconnect resistance to drive improvements in energy-efficient performance.

Applied Materials’ dominance in chip wiring process technologies positions them as the industry leader in this field. As interconnect wiring steps have tripled from the 7 nm node to the 3 nm node, their served available market opportunity in wiring has increased by over $1 billion per 100,000 wafer starts per month. Looking ahead, the introduction of backside power delivery is expected to further increase their wiring opportunity by another $1 billion per 100,000 wafer starts per month.

In conclusion, Applied Materials’ materials engineering innovations have the potential to reshape the computer systems of the future. By enabling copper wiring to scale down to the nanometer level, they are addressing the challenges posed by classic Moore’s Law scaling. With their enhanced low-k dielectric material and binary metal liner, they are pushing the boundaries of performance, power consumption, and chip stacking. The industry is taking notice, and leading chipmakers are already adopting these technologies. The future of computing looks brighter than ever.

Background Information

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About Samsung:

Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

  

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

  

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Technology Explained

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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