AMD and NVIDIA Fuel FOPLP Development, Mass Production Set for 2027-2028

TSMC's InFO FOWLP technology has sparked interest in the industry, with OSAT providers, foundries, and panel makers collaborating to explore its use in chip packaging for consumer ICs and AI GPUs, but challenges and uncertainties remain before it can reach mass production.

Revolutionized chip packaging, making it more cost-effective
Opens up new opportunities for growth in the packaging and testing industry
Offers lower unit costs and larger packaging sizes

In 2016, TSMC (Taiwan Semiconductor Manufacturing Company) introduced a technology called InFO FOWLP (Fan-Out Wafer-Level Packaging) and utilized it in the A10 processor for the iPhone 7. This move revolutionized chip packaging, making it more cost-effective. Since then, other OSAT (Outsourced Semiconductor Assembly and Test) providers have been working hard to develop similar technologies like FOPLP (Fan-Out Panel-Level Packaging).

Now, in the second quarter of this year, chip companies like AMD have been actively collaborating with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging. This has sparked a lot of interest in the industry. According to TrendForce, there are three main ways in which FOPLP packaging technology is being introduced.

The first model involves OSAT providers transitioning from traditional consumer IC (Integrated Circuit) packaging methods to FOPLP. This means they are adopting this new technology to package chips used in consumer electronic devices. For example, AMD has been in talks with PTI and ASE about using FOPLP for their PC CPU products. Qualcomm is also exploring FOPLP packaging options for their PMIC (Power Management Integrated Circuit) products.

However, there is a limitation to the current applications of FOPLP due to its linewidth and spacing not yet matching the level of FOWLP. As a result, FOPLP is mainly being used for mature processes and cost-sensitive products such as PMICs. But once the technology matures, it is expected to be adopted by mainstream consumer IC products.

The second model focuses on foundries and OSAT providers packaging AI GPUs (Graphics Processing Units) that are transitioning from wafer-level packaging to panel-level packaging. Companies like AMD and nVidia are discussing this transition with TSMC and SPIL. The goal here is to increase the chip packaging size under the existing 2.5D (two-and-a-half-dimensional) model. However, there are technical challenges that need to be addressed before this transition can be fully realized.

Lastly, panel makers are also getting in on the action by packaging consumer ICs. NXP and STMicroelectronics, for example, are in talks with Innolux to package PMIC products. This represents a new direction for panel makers, as they venture into the semiconductor packaging business.

The impact of FOPLP technology on the packaging and testing industry is significant. Firstly, OSAT providers can now offer low-cost packaging solutions, allowing them to gain more market share in existing consumer ICs. They may even expand their services to include multi-chip packaging and heterogeneous integration businesses. Secondly, panel makers can enter the semiconductor packaging market, opening up new opportunities for growth. Thirdly, foundries and OSAT providers can reduce the cost structure of 2.5D packaging models, potentially extending their services from the AI GPU market to the consumer IC market. Lastly, GPU providers can take advantage of FOPLP by increasing the packaging size of their AI GPUs.

However, it’s important to note that FOPLP technology has both advantages and disadvantages, along with its fair share of challenges. On the plus side, it offers lower unit costs and larger packaging sizes. But there is still a need for further development in terms of technology and equipment systems. The commercialization process is also highly uncertain at this stage.

TrendForce predicts that FOPLP packaging technology will reach mass production in the second half of 2024 to 2026 for consumer IC applications and in 2027-28 for AI GPU applications. So while the future looks promising for FOPLP, there is still some time before we see it fully integrated into our devices.

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Background Information

About AMD: AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.

About nVidia: NVIDIA has firmly established itself as a leader in the realm of client computing, continuously pushing the boundaries of innovation in graphics and AI technologies. With a deep commitment to enhancing user experiences, NVIDIA's client computing business focuses on delivering solutions that power everything from gaming and creative workloads to enterprise applications. for its GeForce graphics cards, the company has redefined high-performance gaming, setting industry standards for realistic visuals, fluid frame rates, and immersive experiences. Complementing its gaming expertise, NVIDIA's Quadro and NVIDIA RTX graphics cards cater to professionals in design, content creation, and scientific fields, enabling real-time ray tracing and AI-driven workflows that elevate productivity and creativity to unprecedented heights. By seamlessly integrating graphics, AI, and software, NVIDIA continues to shape the landscape of client computing, fostering innovation and immersive interactions in a rapidly evolving digital world.

About NXP: NXP Semiconductors is a global leader in secure connectivity solutions for embedded applications, empowering the world's most innovative companies to create new ways to connect, secure, and power the world. With a rich heritage of technological expertise spanning over six decades, NXP continues to drive innovation in automotive, industrial, IoT, mobile, and communication infrastructure markets. Their commitment to delivering secure, reliable, and efficient solutions has established them as a trusted partner for businesses worldwide.

About Qualcomm: Qualcomm, a leading American global semiconductor and telecommunications equipment company, has played a pivotal role in shaping the modern technology landscape. Founded in 1985, Qualcomm has been at the forefront of innovation, particularly in the realm of mobile communications and wireless technology. The company's advancements have been instrumental in the evolution of smartphones, powering devices with their Snapdragon processors that deliver exceptional performance and efficiency. With a strong commitment to research and development, Qualcomm has enabled the growth of 5G technology, paving the way for faster and more connected experiences.

About TSMC: TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

Technology Explained

CPU: The Central Processing Unit (CPU) is the brain of a computer, responsible for executing instructions and performing calculations. It is the most important component of a computer system, as it is responsible for controlling all other components. CPUs are used in a wide range of applications, from desktop computers to mobile devices, gaming consoles, and even supercomputers. CPUs are used to process data, execute instructions, and control the flow of information within a computer system. They are also used to control the input and output of data, as well as to store and retrieve data from memory. CPUs are essential for the functioning of any computer system, and their applications in the computer industry are vast.

GPU: GPU stands for Graphics Processing Unit and is a specialized type of processor designed to handle graphics-intensive tasks. It is used in the computer industry to render images, videos, and 3D graphics. GPUs are used in gaming consoles, PCs, and mobile devices to provide a smooth and immersive gaming experience. They are also used in the medical field to create 3D models of organs and tissues, and in the automotive industry to create virtual prototypes of cars. GPUs are also used in the field of artificial intelligence to process large amounts of data and create complex models. GPUs are becoming increasingly important in the computer industry as they are able to process large amounts of data quickly and efficiently.