Samsung showcases new CXL features, unveils memory module for scalable, composable infrastructure.

Samsung Electronics introduces new memory solutions and HBM3E technology, solidifying its position as a leader in high-performance and high-capacity solutions for AI applications.

Leader in advanced semiconductor technology
Commitment to advancing innovation and unlocking the full potential of the AI era
Collaboration with industry leaders and ongoing research efforts

Samsung Electronics, a global leader in advanced semiconductor technology, has launched its latest advancements in memory modules and showcased its HBM3E technology. These developments solidify Samsung’s position as a leader in high-performance and high-capacity solutions for AI applications.

During a keynote address at the Computer History Museum in Santa Clara, Samsung executives Jin-Hyeok Choi and SangJoon Hwang introduced new memory solutions and discussed the company’s role in driving innovation in HBM and CXL technologies for the AI era. They were joined on stage by representatives from VMware by Broadcom and Red Hat, who highlighted the collaboration between software solutions and Samsung’s hardware technology in pushing the boundaries of memory innovation.

Choi emphasized the importance of memory technology innovation for AI advancements, stating that Samsung, as the market leader in memory, is committed to advancing innovation and unlocking the full potential of the AI era through collaboration with partners and serving customers.

One of the highlights of Samsung’s presentation was the introduction of its CXL Memory Module – Box (CMM-B), a state-of-the-art CXL DRAM memory pooling product. The CMM-B can accommodate up to eight CMM-D devices of E3.S form factor, providing a massive two terabytes (TB) of capacity. With high performance capabilities of up to 60 gigabytes-per-second (GB/s) bandwidth and low Latency of 596 nanoseconds (ns), the CMM-B is ideal for applications requiring high-capacity memory, such as AI, in-memory databases (IMDB), and data analytics.

Samsung also demonstrated its partnership with Supermicro to showcase the industry’s first Rack-Level memory solution for highly scalable and composable disaggregated infrastructure. This solution utilizes Samsung’s CMM-B to increase memory capacity and bandwidth, enabling data centers to handle demanding workloads more efficiently compared to standard architectures.

Furthermore, Samsung and VMware by Broadcom introduced project Peaberry, which is the world’s first FPGA-based tiered memory solution for hypervisors called CXL Memory Module Hybrid for Tiered Memory (CMM-H TM). This innovative hybrid solution combines DRAM and NAND media in an Add-in Card (AIC) form factor, addressing memory management challenges, optimizing scheduling for tiered memory, and improving performance while reducing total cost of ownership (TCO).

The event also showcased Samsung’s CXL Memory Module – DRAM (CMM-D) technology, which integrates Samsung’s DRAM technology with the CXL open standard interface. Last year, Red Hat successfully validated Samsung’s CMM-D devices with its enterprise software, marking an industry first. The collaboration between the two companies will continue through the Samsung Memory Research (SMRC) in developing CXL open-source and reference models, as well as partnering on various storage and memory products.

Additionally, Samsung provided attendees with a demo of its latest HBM3E 12H chip, which is the world’s first 12-stack HBM3E DRAM. This breakthrough technology achieves the highest capacity ever in HBM technology. The HBM3E 12H utilizes Samsung’s advanced thermal compression non-conductive film (TC NCF) technology, increasing the chip’s vertical density by over 20% compared to its predecessor while improving product yield. Samsung plans to start mass production of the HBM3E 12H within the first half of this year after sampling it to customers.

Samsung’s latest advancements in memory modules and HBM3E technology demonstrate the company’s commitment to pushing the boundaries of memory innovation and providing high-performance and high-capacity solutions for AI applications. Through collaborations with industry leaders and ongoing research efforts, Samsung aims to unlock the full potential of the AI era and drive advancements in memory technology.

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Background Information

About Broadcom: Founded in 1961, Broadcom is a leading global technology company headquartered in the United States. They specialize in semiconductor and infrastructure software solutions. Broadcom's innovations in connectivity, networking, and storage technologies have made them a key player in the industry, with a focus on enabling seamless communication and connectivity in the digital world.

About Samsung: Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

About Supermicro: Supermicro is a reputable American technology company founded in 1993 and headquartered in San Jose, California. Specializing in high-performance server and storage solutions, Supermicro has become a trusted name in the data center industry. The company offers a wide range of innovative and customizable server hardware, including motherboards, servers, storage systems, and networking equipment, catering to the needs of enterprise clients, cloud service providers, and businesses seeking reliable infrastructure solutions.

Technology Explained

CMM-D: CMM-D is a memory technology from Samsung designed for AI and 5G applications that require a lot of processing power. It combines high-performance DRAM memory with a CXL interface for fast data transfer, and acts as a CPU-less memory expansion module that can be scaled up to meet the needs of data-intensive tasks.

FPGA: Field Programmable Gate Arrays (FPGAs) are a type of technology used in the computer industry. They are integrated circuits that can be programmed to perform specific tasks. FPGAs are used in a variety of applications, including digital signal processing, networking, and embedded systems. They are also used in the development of artificial intelligence and machine learning algorithms. FPGAs are advantageous because they can be reprogrammed to perform different tasks, allowing for greater flexibility and faster development times. Additionally, FPGAs are more energy efficient than traditional processors, making them ideal for applications that require low power consumption.

HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

Latency: Technology latency is the time it takes for a computer system to respond to a request. It is an important factor in the performance of computer systems, as it affects the speed and efficiency of data processing. In the computer industry, latency is a major factor in the performance of computer networks, storage systems, and other computer systems. Low latency is essential for applications that require fast response times, such as online gaming, streaming media, and real-time data processing. High latency can cause delays in data processing, resulting in slow response times and poor performance. To reduce latency, computer systems use various techniques such as caching, load balancing, and parallel processing. By reducing latency, computer systems can provide faster response times and improved performance.

NAND: NAND technology is a type of non-volatile memory that is used in many computer applications. It is a type of flash memory that is used to store data in a non-volatile manner, meaning that the data is not lost when the power is turned off. NAND technology is used in many computer applications, such as solid-state drives, USB flash drives, digital cameras, and memory cards. It is also used in many embedded systems, such as cell phones, tablets, and other consumer electronics. NAND technology is a reliable and cost-effective way to store data, making it a popular choice for many computer applications.

VMware: VMware is an industry leader in virtualization technology, allowing for the effective virtualization of computer hardware, networks, and operating systems. Any organization needing to quickly and efficiently deploy complex network environments can utilize VMware, allowing for greater flexibility than physical solutions. VMware products are especially popular in the enterprise segment, as they offer cost savings through increased worker productivity and improved resource utilization. Virtualized services hosted on VMware offer better scaleability and reliability, as well as improved fault-tolerance and cost savings associated with server consolidation. VMware also provides support for the latest hardware and software components, ensuring compatibility with a wide range of applications and services. Furthermore, VMware products provide a secure computing environment, as virtual machines are isolated from each other, preventing the spread of viruses and other threats from one virtual machine to another.