MediaTek introduces ASIC design platform featuring co-packaged optics solutions.

In anticipation of the upcoming Optical Fiber Communication Conference (OFC) in 2024, MediaTek has made an exciting announcement. The tech company is set to launch a custom ASIC design platform that brings together high-speed electrical and optical I/Os in the same ASIC implementation. This next-generation platform will be showcased through a serviceable socketed implementation, combining 8x800G electrical links and 8x800G optical links for enhanced deployment flexibility.

What sets this platform apart is its integration of MediaTek’s in-house SerDes for electrical I/O and co-packaged Odin optical engines from Ranovus for optical I/O. By leveraging this heterogeneous solution, which includes both 112G LR SerDes and optical modules, MediaTek’s CPO demonstration delivers a range of benefits. These include reduced board space and device costs, increased bandwidth density, and a remarkable 50% reduction in system power compared to existing solutions.

One notable feature of Ranovus’ Odin optical engine is its versatility. It offers the option to provide either internal or external laser optical modules, allowing for better alignment with practical usage scenarios. MediaTek’s extensive experience and capabilities in advanced processes like 3 nm, advanced packaging techniques such as 2.5D and 3D, thermal management, and reliability, combined with its optical expertise, enable customers to access the latest technology for high-performance computing (HPC), AI/ML, and data center networking.

Jerry Yu, Senior Vice President at MediaTek, emphasized the growing demand for higher memory bandwidth and capacity, as well as higher I/O density and speeds driven by the emergence of Generative AI. He stated, “Integration of electrical and optical I/O is the latest technology that allows MediaTek to deliver the most flexible leading edge data center ASIC solutions.”

MediaTek’s ASIC design platform solution offers a comprehensive package from design to production, incorporating the industry’s latest technologies. These include die-to-die interfaces like MLink and UCIe, packaging technologies such as InFO, CoWoS, and Hybrid CoWoS, high-speed interfaces like PCIe and HBM, and integration of thermal and mechanical designs. This ensures that MediaTek can meet the most stringent needs of its customers.

To showcase its new co-packaged optics solution for the AI/ML and HPC markets, MediaTek will be joining forces with Ranovus at OFC 2024. Visitors can experience this technology firsthand at Booth 5744 in SAN Diego from March 26-28.

Background Information

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About MediaTek: MediaTek Inc. is a Taiwanese semiconductor company that designs and manufactures a wide range of system-on-chip (SoC) solutions for various consumer electronics, including smartphones, tablets, smart TVs, wearables, and IoT (Internet of Things) devices. Founded in 1997, MediaTek has become a important player in the semiconductor industry, known for its innovative chipsets that offer a balance of performance, power efficiency, and affordability.

  

Technology Explained

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CoWoS: CoWoS, or Chip-on-Wafer-on-Substrate, is a recent advancement in chip packaging that allows for more powerful processors in a compact size. This technology stacks multiple chips on a silicon interposer, enabling denser connections and improved performance. Developed for high-performance computing, CoWoS promises faster processing, lower power consumption, and the ability to pack more processing power into smaller devices.

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HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.

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PCIe: PCIe (Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard for connecting components such as graphics cards, sound cards, and network cards to a motherboard. It is the most widely used interface in the computer industry today, and is used in both desktop and laptop computers. PCIe is capable of providing up to 16 times the bandwidth of the older PCI standard, allowing for faster data transfer speeds and improved performance. It is also used in a variety of other applications, such as storage, networking, and communications. PCIe is an essential component of modern computing, and its applications are only expected to grow in the future.

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SAN: A Storage Area Network (SAN) is a high-speed and specialized network architecture designed to facilitate the connection of storage devices, such as disk arrays and tape libraries, to servers. Unlike traditional network-attached storage (NAS), which is file-based, SAN operates at the block level, enabling direct access to storage resources. SANs are known for their performance, scalability, and flexibility, making them ideal for data-intensive applications, large enterprises, and environments requiring high availability. SANs typically employ Fibre Channel or iSCSI protocols to establish dedicated and fast communication paths between servers and storage devices. With features like centralized management, efficient data replication, and snapshot capabilities, SANs offer advanced data storage, protection, and management options. Overall, SAN technology has revolutionized data storage and management, enabling organizations to efficiently handle complex storage requirements and ensure reliable data access.