Arizona State University and Deca Technologies to Establish North America’s First Advanced Fan-Out Wafer-Level Packaging R&D Center

Arizona State University and Deca Technologies partner to establish a fan-out wafer-level packaging research and development center, focusing on expanding domestic semiconductor manufacturing, and advancing fields such as artificial intelligence and high-performance computing.

Establishes North America's first FOWLP research and development center
Drives innovation in the United States and expands domestic semiconductor manufacturing capabilities
Provides state-of-the-art technology, equipment, processes, materials, expertise, and training for new capabilities

Arizona State University (ASU) and Deca Technologies have joined forces to establish North America’s inaugural fan-out wafer-level packaging (FOWLP) research and development center. This collaboration aims to drive innovation in the United States, expand domestic semiconductor manufacturing capabilities, and advance fields like artificial intelligence, machine learning, automotive electronics, and high-performance computing. The Center for Advanced Wafer-Level Packaging Applications and Development will provide state-of-the-art technology, equipment, processes, materials, expertise, and training to foster the development of new capabilities from proof of concept to pilot scale.

ASU becomes the first university to implement Deca’s M-Series fan-out and Adaptive Patterning technologies under the Microelectronics Commons, a network of regional technology hubs working on projects requested by the Department of Defense as part of the CHIPS and Science Act. This federal legislation aims to enhance America’s global leadership in microelectronics. The new center will integrate with ASU’s MacroTechnology Works center at ASU Research Park in Tempe, enhancing the capabilities of the ASU-led Southwest Advanced Prototyping (SWAP) Hub, which is part of the Microelectronics Commons.

Zak Holman, vice dean for research and innovation for ASU’s Ira A. Fulton Schools of Engineering, expressed excitement about the collaboration, stating, “This is at the heart of the next generation of innovation in microelectronics and everything it enables. Deca has developed a unique technology, and ASU brings extraordinary capacity that will provide the resources to leverage Deca’s technology in ways that will differentiate our work through the SWAP Hub.”

Furthermore, this initiative presents a workforce development opportunity, with ASU faculty and students actively participating in the research and providing training for technicians required domestically. This is particularly relevant in metro Phoenix, home to major semiconductor companies like Intel, TSMC, and Amkor.

ASU and Deca are committed to establishing onshore access to advanced-packaging capabilities, which involves acquiring, installing, and implementing a comprehensive set of process and metrology equipment at the facility. The equipment will be capable of accommodating both 200 mm and 300 mm device wafer formats, as well as 300 mm M-Series molded fan-out wafers, providing unmatched flexibility for various customers and applications.

Tim Olson, Deca’s founder and CEO, expressed his enthusiasm for the new center, stating, “With the industry’s leading fan-out technology as a foundation, we’re excited about the possibilities this new center brings to Arizona as well as the broader U.S. semiconductor industry. Through ASU and Deca’s collaboration, unprecedented access for industry, academia, government, and others opens the door to accelerate innovation and bolster U.S. technology leadership.”

Deca’s first-generation M-Series FOWLP is already widely adopted in leading smartphones worldwide. The Gen 2 M-Series, which includes Adaptive Patterning technology, brings unparalleled scaling to higher densities for heterogeneous integration and chiplet applications.

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Background Information

About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

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