Intel’s 17th Gen Nova Lake Processors May Embrace TSMC’s 2nm Process Node by 2026

Intel partners with TSMC to utilize their 2nm process for its Nova Lake processors, showcasing a shift in the industry towards collaborations and external foundries for advanced process nodes.

Intel's collaboration with TSMC highlights the trend of chip manufacturers relying on external foundries for certain components, showcasing the company's willingness to adapt and stay competitive in the industry.
TSMC's 2nm process is expected to offer improved performance, power efficiency, and transistor density, which will likely result in high-performance chips for Intel's customers.
This strategic move by Intel allows the company to stay at the forefront of technological advancements and compete more effectively with its rivals, ultimately benefiting consumers with innovative products.

Intel, one of the giants in the semiconductor industry, is reportedly planning to embrace TSMC’s 2nm process node for its 17th Gen Nova Lake processors. This surprising move comes despite Intel’s long-standing reputation for having “undisputed process leadership.” TSMC’s 2nm process is set to enter mass production in 2025, and the development of this GAA-based node is said to be progressing smoothly.

According to industry sources, Intel has already secured a portion of the first batch of 2nm chips from TSMC, alongside other important clients like Apple. This collaboration between Intel and TSMC highlights the growing trend of chip manufacturers relying on external foundries for certain components of their products.

Intel’s strategy with the Nova Lake processors is to continue leveraging its internal process nodes, specifically IDM 2.0 (18A or higher), for the CPU tile. This means that Intel will handle the manufacturing of the central processing unit itself, while leaving the tGPU (integrated graphics) and SoC (system-on-a-chip) dies to be produced by TSMC. The tGPU tile for Nova Lake is expected to be fabbed on TSMC’s 2nm node, while the upcoming Arrow Lake chips will utilize TSMC’s 3nm process for its tGPU chiplets.

TSMC is actively expanding its production capacity for the 2nm process, with multiple factories being constructed simultaneously. The third phase of this expansion is scheduled to begin in the third quarter of 2026, with a capacity of up to six fabs. The first factory is anticipated to launch as early as April.

This collaboration between Intel and TSMC marks a significant shift in the semiconductor industry. While Intel has traditionally been known for its in-house manufacturing capabilities, this move demonstrates the company’s willingness to partner with external foundries to leverage their advanced process nodes. TSMC’s 2nm process is expected to offer improved performance, power efficiency, and transistor density, which are crucial factors in the highly competitive market of processors.

By embracing TSMC’s 2nm process for its Nova Lake processors, Intel aims to stay at the forefront of technological advancements and deliver high-performance chips to its customers. This strategic move will likely enable Intel to compete more effectively with its rivals and meet the increasing demands of modern computing applications.

As the semiconductor industry continues to evolve, collaborations like this one between Intel and TSMC are becoming more common. The sharing of expertise and resources allows companies to leverage each other’s strengths and deliver innovative products to consumers. With TSMC’s 2nm process on the horizon, it will be fascinating to see how Intel’s Nova Lake processors perform and how this partnership shapes the future of chip manufacturing.

About Our Team

Our team comprises industry insiders with extensive experience in computers, semiconductors, games, and consumer electronics. With decades of collective experience, we’re committed to delivering timely, accurate, and engaging news content to our readers.

Background Information

About Apple:

Apple Inc., known for its iconic products, was founded by Steve Jobs, Steve Wozniak, and Ronald Wayne in 1976. The company has since revolutionized the technology landscape with innovations like the Macintosh computer, iPod, iPhone, iPad, and more. for its emphasis on design, user experience, and ecosystem integration, Apple's devices and software have made a profound impact on various industries. With a commitment to quality and innovation, Apple remains a global technology leader.

Latest Articles about Apple

About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

Latest Articles about Intel

About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

Latest Articles about TSMC

Technology Explained

chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

Latest Articles about chiplets

CPU: The Central Processing Unit (CPU) is the brain of a computer, responsible for executing instructions and performing calculations. It is the most important component of a computer system, as it is responsible for controlling all other components. CPUs are used in a wide range of applications, from desktop computers to mobile devices, gaming consoles, and even supercomputers. CPUs are used to process data, execute instructions, and control the flow of information within a computer system. They are also used to control the input and output of data, as well as to store and retrieve data from memory. CPUs are essential for the functioning of any computer system, and their applications in the computer industry are vast.

Latest Articles about CPU

IDM 2.0: Intel IDM 2.0 is Intel's integrated device manufacturing (IDM) strategy introduced at 2021. It is a major evolution of the company's traditional IDM model, which has been in place since its founding in 1968. Under the IDM 2.0 strategy, Intel will continue to design and manufacture its own chips, but it will also become a major provider of foundry services to other companies. This will allow Intel to tap into the growing demand for semiconductor manufacturing capacity, while also generating new revenue streams.

Latest Articles about IDM 2.0

SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.