Summary: Intel is making impressive strides in their IDM 2.0 plans, with successful launches of their Core Ultra and upcoming Arrow Lake processors, as well as advancements in backside power delivery and gate-all-around transistors, positioning them as leaders in technology and AI performance.
- Successful launch of Core Ultra "Meteor Lake" processors
- Integration of backside power delivery in upcoming 15th Gen Arrow Lake lineup
- Incorporation of both gate-all-around and backside power delivery in a single process node, ahead of competition
Intel is making significant progress with its IDM 2.0 plans, as the company recently launched its Core Ultra “Meteor Lake” processors, which are built on the 4nm-class (Intel 4) chips. This successful launch has paved the way for the upcoming 15th Gen Arrow Lake lineup, set to debut later this year with the integration of backside power delivery, a first for the industry. But Intel’s advancements don’t stop there. The company has already started production on its 18A Clearwater Forest CPUs, with the 16th Gen Panther Lake CPUs scheduled for a 2025 launch.
Intel CEO Pat Gelsinger confirmed that the Panther Lake CPUs will leverage the 18A process, making them the most advanced chips at the time of their release. Intel is proud to be the first in the industry to incorporate both gate-all-around and backside power delivery in a single process node, with backside power delivery arriving two years ahead of their competition. The Arrow Lake processors, built on the 20A node, are also on track for launch later this year.
Gelsinger emphasized that Intel has learned from past challenges, particularly the 10nm debacle, and is taking steps to ensure a seamless transition to the 20A/18A node. The switch to Extreme Ultraviolet Litho (EUV) technology was successfully implemented with the 4nm-class node, and backside power has been thoroughly tested on an internal node. This testing involved running many Intel 3 wafers with backside power to mitigate any potential risks. Gelsinger expressed confidence in the elegant and high-yield introduction of backside power on the 18A process.
Intel’s commitment to innovation is further demonstrated by their development of PowerVia, which has seamlessly integrated into the chipmaker’s existing process nodes with high yield. The RibbonFET (Gate All Around) transistors are also making progress, with the 1.0 Process Design Kit (PDK) on track for release in Q2 2024. These advancements will be introduced alongside the 18A Clearwater Forest CPUs in the second half of 2025.
Overall, Intel’s IDM 2.0 plans are exceeding expectations, with the successful launch of the Core Ultra processors and the upcoming releases of the Arrow Lake, Clearwater Forest, and Panther Lake CPUs. The incorporation of backside power delivery and gate-all-around transistors in the 18A process showcases Intel’s commitment to pushing the boundaries of technology. With these advancements, Intel aims to deliver leadership AI performance, with future platforms such as Lunar Lake and Arrow Lake tripling AI performance and Panther Lake set to provide an additional 2x boost in AI performance by 2025.
Intel’s progress in manufacturing readiness and process leadership is a significant achievement for the company, positioning them at the forefront of technological innovation. As Intel continues to push boundaries and develop CPUs, the future of computing looks promising with increased AI capabilities and improved performance on the horizon.
About Intel: Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.Intel Website: https://www.intel.com/
Intel LinkedIn: https://www.linkedin.com/company/intel-corporation/
EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.
IDM 2.0: Intel IDM 2.0 is Intel's integrated device manufacturing (IDM) strategy introduced at 2021. It is a major evolution of the company's traditional IDM model, which has been in place since its founding in 1968. Under the IDM 2.0 strategy, Intel will continue to design and manufacture its own chips, but it will also become a major provider of foundry services to other companies. This will allow Intel to tap into the growing demand for semiconductor manufacturing capacity, while also generating new revenue streams.
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