DNP pioneers advanced 3nm EUV lithography with photomask process.

Dai Nippon Printing Co., Ltd. (DNP), a leading Japanese company in the printing and information services industry, has made a significant breakthrough in photomask manufacturing. The company has successfully developed a process that can accommodate the 3-nanometer (nm) lithography process, which supports Extreme Ultra-Violet (EUV) lithography. This technology is crucial for semiconductor manufacturing.

DNP has been at the forefront of meeting the demands of semiconductor manufacturers when it comes to performance and quality. In 2016, they became the first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW). This tool, capable of irradiating with approximately 260,000 electron beams, has significantly reduced lithography time, even for complex pattern shapes.

In 2020, DNP developed a photomask manufacturing process for 5 nm EUV lithography processes, meeting the needs of the semiconductor market. And now, in response to the constant drive for miniaturization, they have successfully developed a photomask for EUV lithography capable of supporting 3 nm processes.

To achieve this milestone, DNP leveraged the characteristics of their equipment and optimized data correction technology and processing conditions to match the complex curved pattern structure of photomasks for EUV lithography. They have also installed a new MBMW and plan to begin operations in the second half of 2024. This move further strengthens their support for semiconductor manufacturing in advanced areas such as photomasks for EUV lithography.

DNP is not stopping there. They are partnering with Interuniversity Microelectronics Center (imec), an international research organization based in Belgium, to jointly develop EUV photomasks for next-generation EUV exposure equipment. This collaboration will contribute to pushing the boundaries of lithography technology.

Looking ahead, DNP aims to provide the newly developed photomask capable of supporting 3 nm EUV lithography to semiconductor manufacturers worldwide. Additionally, they are committed to supporting the development of peripheral technologies for EUV lithography. With these efforts, DNP targets annual sales of 10 billion yen in 2030.

Through collaborations with esteemed partners like imec, DNP will continue to push the boundaries of photomask technology. Their goal is to develop even more advanced photomasks that can support processes finer than 3 nm, and possibly even beyond 2 nm. This constant pursuit of innovation is crucial for the future of semiconductor manufacturing and the tech industry as a whole.

Technology Explained

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EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.