Summary: DNP has successfully developed a photomask manufacturing process for 3-nanometer EUV lithography, with plans to further advance the technology and support the semiconductor industry's demands for miniaturization.
1. DNP is a leading Japanese company in the printing and information services industry. 2. They have successfully developed a process that can accommodate the 3-nanometer lithography process, crucial for semiconductor manufacturing. 3. DNP is constantly pushing the boundaries of lithography technology through collaborations with esteemed partners like imec.
Dai Nippon Printing Co., Ltd. (DNP), a leading Japanese company in the printing and information services industry, has made a significant breakthrough in photomask manufacturing. The company has successfully developed a process that can accommodate the 3-nanometer (nm) lithography process, which supports Extreme Ultra-Violet (EUV) lithography. This technology is crucial for semiconductor manufacturing.
DNP has been at the forefront of meeting the demands of semiconductor manufacturers when it comes to performance and quality. In 2016, they became the first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW). This tool, capable of irradiating with approximately 260,000 electron beams, has significantly reduced lithography time, even for complex pattern shapes.
In 2020, DNP developed a photomask manufacturing process for 5 nm EUV lithography processes, meeting the needs of the semiconductor market. And now, in response to the constant drive for miniaturization, they have successfully developed a photomask for EUV lithography capable of supporting 3 nm processes.
To achieve this milestone, DNP leveraged the characteristics of their equipment and optimized data correction technology and processing conditions to match the complex curved pattern structure of photomasks for EUV lithography. They have also installed a new MBMW and plan to begin operations in the second half of 2024. This move further strengthens their support for semiconductor manufacturing in advanced areas such as photomasks for EUV lithography.
DNP is not stopping there. They are partnering with Interuniversity Microelectronics Center (imec), an international research organization based in Belgium, to jointly develop EUV photomasks for next-generation EUV exposure equipment. This collaboration will contribute to pushing the boundaries of lithography technology.
Looking ahead, DNP aims to provide the newly developed photomask capable of supporting 3 nm EUV lithography to semiconductor manufacturers worldwide. Additionally, they are committed to supporting the development of peripheral technologies for EUV lithography. With these efforts, DNP targets annual sales of 10 billion yen in 2030.
Through collaborations with esteemed partners like imec, DNP will continue to push the boundaries of photomask technology. Their goal is to develop even more advanced photomasks that can support processes finer than 3 nm, and possibly even beyond 2 nm. This constant pursuit of innovation is crucial for the future of semiconductor manufacturing and the tech industry as a whole.
EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.
- Arm and Samsung Partner to Develop Advanced 2nm GAA-Optimized Cortex Cores
- Intel introduces Xeon “Sierra Forest” 288 E-core Processor for Telecom at MWC 2024
- AMD Resolves STAPM Throttling, Prompts Reevaluation of Ryzen 7 8700G and Ryzen 5 8600G
- Qualcomm introduces FastConnect 7900, AI-Optimized Wi-Fi 7 System for Enhanced Connectivity
- Supermicro boosts 5G and Telco Cloud performance with expanded infrastructure solutions.
- NZXT about to launch the H6 Flow RGB, a HYTE Y60’ish Mid tower case
- HYTE teases the “HYTE Y70 Touch” case with large touch screen
- Intel’s CPU Roadmap: 15th Gen Arrow Lake Arriving Q4 2024, Panther Lake and Nova Lake Follow
- NZXT set to launch a non RGB version of the H6 Flow case
- Tech giants collaborate to establish standardized narrow precision data formats for AI.