Texas Instruments Commences Construction of Semiconductor Plant in Utah

Texas Instruments (TI), a leading semiconductor company, has announced the of its new semiconductor wafer fabrication plant in Lehi, Utah. The new fab, LFAB2, will be connected to TI’s existing wafer fab in Lehi and will significantly increase the company’s manufacturing capacity. Once completed, the two Utah fabs will produce millions of analog and embedded processing chips daily.
The construction of LFAB2 marks an important milestone in TI’s expansion plans in Utah. The company aims to meet the growing demand for semiconductors by building long-term manufacturing capabilities. TI’s President and CEO, Haviv Ilan, stated, “Our passion is to create a better world by making electronics more affordable through semiconductors. We are proud to be a part of the Utah community and manufacture vital semiconductors for various electronic systems.”
With an $11 billion investment, TI’s presence in Utah is set to have a transformative impact on the state’s economy. LFAB2 alone will create around 800 new jobs at TI and thousands of indirect jobs. The first production from LFAB2 is expected to be available as early as 2026.
In addition to economic growth, TI is committed to supporting education in the community. The company plans to invest $9 million in the Alpine School District to establish the state’s first Science, Technology, Engineering, and Math (STEM) learning community for students from kindergarten to 12th grade. This program aims to enhance STEM education by integrating STEM concepts into the curriculum and providing professional development for teachers and administrators.
TI is also dedicated to sustainable manufacturing practices. LFAB2 is designed to meet the highest levels of structural efficiency and sustainability, aiming for LEED Gold version 4 certification. The fab will strive to be powered by 100% renewable electricity and will implement advanced equipment and processes to minimize waste, water, and energy consumption. Additionally, LFAB2 is expected to recycle water at a rate twice as high as TI’s existing fab in Lehi.
LFAB2 is part of TI’s broader strategy to strengthen its semiconductor manufacturing capabilities. The company already operates several 300-mm wafer fabs, including LFAB1 in Lehi, DMOS6 in Dallas, and RFAB1 and RFAB2 in Richardson, Texas. TI is also constructing four new 300-mm wafer fabs in Sherman, Texas, with the first fab expected to begin production in 2025. These expansions, combined with potential support from the CHIPS and Science Act, will ensure a reliable supply of analog and embedded processing products and demonstrate TI’s commitment to long-term capacity planning.