Summary: Intel has announced the start of high-volume production of its Intel 4 technology at its new Fab 34 in Ireland, utilizing EUV technology to enable the development of AI PCs, Intel Core Ultra processors, and future-generation Intel Xeon processors. Intel is creating an end-to-end semiconductor manufacturing value chain in Europe, with investments in Ireland, Germany, and Poland, and is committed to reducing its environmental impact.
- Intel's commitment to a sustainable and secure global supply chain
- Intel's aim to deliver five nodes in four years and regain leadership in process technology by 2025
- Intel's corporate goals include achieving 100% renewable electricity use, net positive water balance, and zero waste to landfills by 2030
Intel has announced the start of high-volume production of its Intel 4 technology at its new fab in Ireland. This marks the first use of extreme ultraviolet lithography (EUV) in mass production in Europe. The milestone achieved by Intel’s Fab 34 demonstrates the company’s commitment to delivering five process nodes in four years and introducing a new generation of leadership products. With investments in Ireland, Germany, and Poland, Intel is creating an end-to-end semiconductor manufacturing value chain in Europe, fostering additional ecosystem investments and innovations across the European Union.
The arrival of Intel 4 technology, which utilizes EUV, sets the stage for upcoming products like Intel’s Intel Core Ultra processors (code-named Meteor Lake), enabling the development of AI PCs. Additionally, it paves the way for future-generation Intel Xeon processors slated for release in 2024, produced on the Intel 3 process node. EUV technology is widely adopted in semiconductor nodes that power demanding applications such as AI, advanced mobile networks, autonomous driving, and data center and cloud applications. It plays a crucial role in Intel’s aim to deliver five nodes in four years and regain leadership in process technology by 2025.
Pat Gelsinger, Intel CEO, expressed his pride in the Intel team and their collaborative efforts with customers, suppliers, and partners to achieve this milestone. He emphasized the significance of Fab 34’s opening in contributing to the European Union’s goal of establishing a resilient and sustainable semiconductor supply chain. Keyvan Esfarjani, Executive Vice President and Chief Global Operations Officer at Intel, highlighted the importance of Intel’s operations in Ireland as part of building an end-to-end semiconductor manufacturing value chain in Europe.
Dr. Ann Kelleher, Executive Vice President and General Manager of Technology Development at Intel, described the transfer of Intel 4 process technology into high-volume production in Ireland as a significant step toward enabling leading-edge manufacturing in Europe. The process development and early high-volume manufacturing of Intel 4 technology took place in Intel’s development fab in Oregon.
Intel’s commitment to a sustainable and secure global supply chain is evident through the opening of Fab 34 in Leixlip, Ireland, along with planned facilities in Germany and Poland. By supporting Europe’s technological ambitions, Intel aims to create a resilient and geographically balanced semiconductor supply chain. The company’s Ireland Climate Action Plan outlines its efforts to reduce greenhouse gas emissions, energy use, water consumption, and waste generation.
Intel’s dedication to minimizing its environmental impact is reflected in the design innovations of Fab 34, which is on track to achieve LEED Gold certification. The facility incorporates sustainable practices such as utilizing heat recovery systems and integrating recycled content into construction materials. Intel’s corporate goals include achieving 100% renewable electricity use, net positive water balance, and zero waste to landfills by 2030, as well as net-zero greenhouse gas emissions across global operations by 2040.
Intel’s Leixlip campus has been a part of the local community in Ireland for over 30 years. The ongoing development of the campus is made possible through the support and collaboration of the community. To further demonstrate its commitment, Intel announced a donation of 1 million euros to fund a community project in Leixlip.
About Intel: Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.Intel Website: https://www.intel.com/
Intel LinkedIn: https://www.linkedin.com/company/intel-corporation/
EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.
Xeon: The Intel Xeon processor is a powerful and reliable processor used in many computer systems. It is a multi-core processor that is designed to handle multiple tasks simultaneously. It is used in servers, workstations, and high-end desktop computers. It is also used in many embedded systems, such as routers and switches. The Xeon processor is known for its high performance and scalability, making it a popular choice for many computer applications. It is also used in many cloud computing applications, as it is capable of handling large amounts of data and providing high levels of performance. The Xeon processor is also used in many scientific and engineering applications, as it is capable of handling complex calculations and simulations.
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