JEDEC and Open Compute Project Collaborate, Unleashing a Chiplet Innovation Revolution

In a collaboration, the Open Compute Project Foundation (OCP) and JEDEC are joining forces to revolutionize the chiplet industry. By merging OCP’s Chiplet Data Extensible Markup Language (CDXML) and JEDEC’s JEP30 PartModel Guidelines, this partnership promises to transform chiplet design, manufacturing, and integration. The result will be a unified structure that supports both chiplets and general electronic parts within JEDEC’s purview.

A significant milestone has been reached with the integration of OCP CDXML into JEP30, allowing chiplet builders to provide standardized chiplet part descriptions electronically. This advancement paves the way for automating System in Package (SiP) design and assembly using chiplets. The chiplet descriptions include crucial information such as thermal properties, physical requirements, behavior specifications, power and signal integrity properties, testing in-package, and security parameters.

Michael Durkan, JEDEC Task Group Chair and PartModel Sponsor, described the integration of JEDEC JEP30 and OCP CDXML as a endeavor that creates a unified platform for chiplet and electronic part integration. He emphasized the potential of standardized digital part models to drive digitalization and automation in the industry.

The Chiplet Design Exchange (CDX), an open-source working group within the Open Compute Project’s Open Domain-Specific Architecture (ODSA) sub-project, consists of experts from various fields. Their mission is to foster an open chiplet economy. At the IEEE 3DIC 2021 conference, the CDX group presented standardized chiplet models for 3D IC designs, including machine-readable models for electrical and mechanical properties that have evolved into the JEDEC JEP30 PartModels. These models form the foundation of a Chiplet Design Kit (CDK).

Cliff Grossner, Chief Innovation Officer with OCP, highlighted the power of integrating OCP CDXML and JEDEC JEP30 standards, which empowers engineers, manufacturers, and designers with a comprehensive framework that enhances efficiency, compatibility, and customization. This collaboration reflects OCP’s commitment to driving progress and elevating the chiplet industry.

Looking ahead, there are exciting opportunities for further integration efforts between the Open Compute Project Foundation and JEDEC. Both organizations are dedicated to ongoing innovation as they explore ways to enhance the chiplet industry.

To learn more about the chiplet economy, don’t miss the sessions at the upcoming 2023 OCP Global Summit, taking place at the SAN Jose Convention Center from October 17 to 19. Visit www.opencompute.org/summit/global-summit for the full schedule and registration details.

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