Zero ASIC has revolutionized traditional chip design with their ChipMaker platform, offering a 100X reduction in chip development costs and 3D chiplet composability, automated no-code chiplet-based chip design, and zero-install interactive RTL-based chip emulation.
- ChipMaker platform showcases several world-first achievements, including 3D chiplet composability, fully automated no-code chiplet-based chip design, and zero-install interactive RTL-based chip emulation.
- ChipMaker platform revolutionizes traditional chip design, which typically costs over $100 million and requires expert teams to spend 2-3 years to go from concept to production.
- eBrick 3D chiplets enable plug-and-play chiplet composability.
Zero ASIC, a semiconductor startup, has emerged from stealth mode with an exciting announcement about its ChipMaker platform. This platform showcases several world-first achievements, including 3D chiplet composability, fully automated no-code chiplet-based chip design, and zero-install interactive RTL-based chip emulation. Moreover, Zero ASIC has laid out an ambitious roadmap to achieve a remarkable 100X reduction in chip development costs.
Andreas Olofsson, CEO and founder of Zero ASIC, explains the significance of Custom Application Specific Integrated Circuits (ASICs) in offering a significant cost and energy advantage over commercial off-the-shelf devices. However, the exorbitant development costs associated with ASICs have made them unfeasible for most applications. To overcome this barrier, Zero ASIC’s mission is to simplify the process of ordering an ASIC to the level of ordering catalog parts from an electronics distributor.
The ChipMaker Platform developed by Zero ASIC revolutionizes traditional chip design, which typically costs over $100 million and requires expert teams to spend 2-3 years to go from concept to production. By leveraging chiplet-based design, Zero ASIC addresses both the time and cost challenges associated with custom ASICs. The platform allows users to design, validate, and assemble System-in-Packages using a catalog of pre-validated chiplets. With the help of cloud FPGAs, users can test their custom designs quickly and accurately before ordering physical devices.
To address the limitations of existing 2D/2.5D chiplet design approaches, Zero ASIC introduces eFabric, an active grid-like 3D interposer. This innovative technology enhances die-to-die communication efficiency and composability. The eFabric enables integration of ultra-critical processing blocks using 3D attached eBrick chiplets and off-package IO functions using 2D attached ioBrick chiplets. With these advancements, Zero ASIC achieves unprecedented levels of chiplet-based performance and flexibility.
Zero ASIC’s eBrick 3D chiplets play a crucial role in enabling plug-and-play chiplet composability. These chiplets adhere to a set of electrical and mechanical 3D chiplet standards specifications. Some examples of eBricks include a quad-core RISC-V Linux capable dual-issue processor, a 5K LUT embedded FPGA, and a 3MB SRAM -3 TOPS machine learning accelerator.
Zero ASIC’s composable chiplet ASICs find their ideal applications in various sectors facing energy and supply chain challenges. These include robotics, automotive safety, aerospace and defense, 5G/6G communication, test and measurement, software-defined radio, smart manufacturing, medical diagnostics, and high-performance computing.
The ChipMaker design and emulation platform is available for immediate access on zeroasic.com. Additionally, Zero ASIC will be showcasing live demonstrations of the ChipMaker platform at the Open Compute Platform Summit (Open Chiplet Economy Center) from October 17-19 in SAN Jose, CA. Customized ASICs are expected to begin sampling in Q3 2024.
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Technology Explained
chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.
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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.
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FPGA: Field Programmable Gate Arrays (FPGAs) are a type of technology used in the computer industry. They are integrated circuits that can be programmed to perform specific tasks. FPGAs are used in a variety of applications, including digital signal processing, networking, and embedded systems. They are also used in the development of artificial intelligence and machine learning algorithms. FPGAs are advantageous because they can be reprogrammed to perform different tasks, allowing for greater flexibility and faster development times. Additionally, FPGAs are more energy efficient than traditional processors, making them ideal for applications that require low power consumption.
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