JEDEC and Open Compute Project Collaborate, Unleashing a Chiplet Innovation Revolution


October 11, 2023

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Summary: OCP and JEDEC have joined forces to revolutionize the chiplet industry by merging OCP's CDXML and JEDEC's JEP30 PartModel Guidelines, creating a unified platform for chiplet and electronic part integration.

  • Unified structure that supports both chiplets and general electronic parts
  • Standardized digital part models to drive digitalization and automation in the industry
  • Integration of OCP CDXML and JEDEC JEP30 standards to enhance efficiency, compatibility, and customization


In a collaboration, the Open Compute Project Foundation (OCP) and JEDEC are joining forces to revolutionize the chiplet industry. By merging OCP’s Chiplet Data Extensible Markup Language (CDXML) and JEDEC’s JEP30 PartModel Guidelines, this partnership promises to transform chiplet design, manufacturing, and integration. The result will be a unified structure that supports both chiplets and general electronic parts within JEDEC’s purview.

A significant milestone has been reached with the integration of OCP CDXML into JEP30, allowing chiplet builders to provide standardized chiplet part descriptions electronically. This advancement paves the way for automating System in Package (SiP) design and assembly using chiplets. The chiplet descriptions include crucial information such as thermal properties, physical requirements, behavior specifications, power and signal integrity properties, testing in-package, and security parameters.

Michael Durkan, JEDEC Task Group Chair and PartModel Sponsor, described the integration of JEDEC JEP30 and OCP CDXML as a endeavor that creates a unified platform for chiplet and electronic part integration. He emphasized the potential of standardized digital part models to drive digitalization and automation in the industry.

The Chiplet Design Exchange (CDX), an open-source working group within the Open Compute Project’s Open Domain-Specific Architecture (ODSA) sub-project, consists of experts from various fields. Their mission is to foster an open chiplet economy. At the IEEE 3DIC 2021 conference, the CDX group presented standardized chiplet models for 3D IC designs, including machine-readable models for electrical and mechanical properties that have evolved into the JEDEC JEP30 PartModels. These models form the foundation of a Chiplet Design Kit (CDK).

Cliff Grossner, Chief Innovation Officer with OCP, highlighted the power of integrating OCP CDXML and JEDEC JEP30 standards, which empowers engineers, manufacturers, and designers with a comprehensive framework that enhances efficiency, compatibility, and customization. This collaboration reflects OCP’s commitment to driving progress and elevating the chiplet industry.

Looking ahead, there are exciting opportunities for further integration efforts between the Open Compute Project Foundation and JEDEC. Both organizations are dedicated to ongoing innovation as they explore ways to enhance the chiplet industry.

To learn more about the chiplet economy, don’t miss the sessions at the upcoming 2023 OCP Global Summit, taking place at the SAN Jose Convention Center from October 17 to 19. Visit www.opencompute.org/summit/global-summit for the full schedule and registration details.

JEDEC and Open Compute Project Collaborate, Unleashing a Chiplet Innovation Revolution

JEDEC and Open Compute Project Collaborate, Unleashing a Chiplet Innovation Revolution

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Technology Explained


chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.


chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.


SAN: A Storage Area Network (SAN) is a high-speed and specialized network architecture designed to facilitate the connection of storage devices, such as disk arrays and tape libraries, to servers. Unlike traditional network-attached storage (NAS), which is file-based, SAN operates at the block level, enabling direct access to storage resources. SANs are known for their performance, scalability, and flexibility, making them ideal for data-intensive applications, large enterprises, and environments requiring high availability. SANs typically employ Fibre Channel or iSCSI protocols to establish dedicated and fast communication paths between servers and storage devices. With features like centralized management, efficient data replication, and snapshot capabilities, SANs offer advanced data storage, protection, and management options. Overall, SAN technology has revolutionized data storage and management, enabling organizations to efficiently handle complex storage requirements and ensure reliable data access.



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