Samsung Electronics Co., Ltd. has announced the development of the industry's first and highest-capacity 32Gb DDR5 DRAM using 12nm-class process technology, allowing for DRAM modules of up to 1TB and double the capacity of 16Gb DDR5 DRAM in the same package size.
- Samsung has successfully mass produced 12nm-class 16Gb DDR5 DRAM
- The new 32Gb DRAM allows for DRAM modules of up to 1-terabyte (TB)
- Samsung's 32Gb DRAM eliminates the need for the Through Silicon Via (TSV) process
Samsung Electronics Co., Ltd., a global leader in advanced memory technology, has announced the development of the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology. This breakthrough follows Samsung’s successful mass production of its 12nm-class 16Gb DDR5 DRAM earlier this year, solidifying their position as leaders in next-generation DRAM technology.
The new 32Gb DRAM allows for DRAM modules of up to 1-terabyte (TB), catering to the increasing demand for high-capacity memory in the era of AI and big data. SangJoon Hwang, Executive Vice President of DRAM Product & Technology at Samsung Electronics, stated that they will continue to push the boundaries of memory technology through differentiated process and design technologies.
Samsung’s achievement is even more remarkable when considering the significant increase in DRAM capacity over the past four decades. Since developing its first 64-kilobit (Kb) DRAM in 1983, Samsung has managed to enhance its DRAM capacity by a factor of 500,000. The latest memory product boasts the industry’s highest capacity for a single DRAM chip and offers double the capacity of 16Gb DDR5 DRAM in the same package size.
Furthermore, Samsung’s 32Gb DRAM eliminates the need for the Through Silicon Via (TSV) process, which was previously required for manufacturing DDR5 128GB DRAM modules using 16Gb DRAM. This breakthrough not only simplifies production but also reduces power consumption by approximately 10%, making it an ideal solution for power-efficient enterprises like data centers.
Samsung plans to expand its lineup of high-capacity DRAM to meet the current and future demands of the computing and IT industry. They will supply the 12nm-class 32Gb DRAM to data centers and customers requiring AI and next-generation computing applications, solidifying their position as leaders in the next-generation DRAM market.
Mass production of the new 12nm-class 32Gb DDR5 DRAM is set to begin by the end of this year. For more information about Samsung’s DRAM products, visit the Samsung Semiconductor website.
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Background Information
About Samsung:
Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.Latest Articles about Samsung
Technology Explained
DDR5: DDR5 (Double Data Rate 5) is the next generation of memory technology for the computer industry. It is a modern day improvement on earlier DDR technologies, with faster speeds, greater bandwidth and higher capacities. DDR5 enables higher resolution, seamless gaming experiences and faster data transfer rates, making it an ideal choice for high-performance computing and 4K gaming. With its greater RAM compatibility, DDR5 provides faster buffering times and raised clock speeds, giving users an improved overall work system. DDR5 is also optimized for multi-tasking, allowing users to multitask without experiencing a significant drop in performance, increasing the productivity of digital tasks. As an ever-evolving technology, DDR5 is paving the way for the computer industry into a new and powerful era.
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