MediaTek pioneers TSMC’s 3 nm process, revolutionizing chip production for 2024.

MediaTek and TSMC have successfully collaborated on the development of MediaTek's first chip using TSMC's 3 nm technology.
The partnership between MediaTek and TSMC brings together their respective strengths in chip design and manufacturing to create high-performance, low-power flagship SoCs.
TSMC's 3 nm process technology offers improved performance, power efficiency, and yield.

In a significant development for the tech industry, MediaTek and TSMC have announced their successful collaboration on the development of MediaTek’s first chip using TSMC’s 3 nm technology. This achievement paves the way for volume production of MediaTek’s flagship Dimensity system-on-chip (SoC) in the coming year.

The partnership between MediaTek and TSMC brings together their respective strengths in chip design and manufacturing to create high-performance, low-power flagship SoCs that will empower a range of global end devices. Joe Chen, President of MediaTek, expressed his commitment to leveraging advanced technology to create innovative products that enhance our lives. He also highlighted TSMC’s consistent and high-quality manufacturing capabilities as instrumental in showcasing MediaTek’s superior chip design.

Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, emphasized the significance of this collaboration, stating that it makes the power of the industry’s most advanced semiconductor process technology accessible to everyone. Over the years, TSMC and MediaTek have worked closely together to bring innovations to the market, and they are excited to continue their partnership into the 3 nm generation and beyond.

TSMC’s 3 nm process technology offers improved performance, power efficiency, and yield, making it ideal for both high-performance computing and mobile applications. Compared to TSMC’s N5 process, the 3 nm technology delivers an impressive 18% speed improvement at the same power or a 32% power reduction at the same speed. Additionally, it offers approximately 60% increase in logic density, enabling more efficient chip designs.

MediaTek’s Dimensity SoCs, built using industry-leading process technology, are designed to meet the growing demands of mobile computing, high-speed connectivity, artificial intelligence, and multimedia. The first flagship chipset from MediaTek utilizing TSMC’s 3 nm process is expected to power smartphones, Tablets, intelligent cars, and various other devices starting in the second half of 2024.

This collaboration between MediaTek and TSMC represents a significant step forward in the world of chip manufacturing, bringing together technology and design expertise to create innovative solutions that enhance the user experience across a range of devices.

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Background Information

About MediaTek:

MediaTek Inc. is a Taiwanese semiconductor company that designs and manufactures a wide range of system-on-chip (SoC) solutions for various consumer electronics, including smartphones, tablets, smart TVs, wearables, and IoT (Internet of Things) devices. Founded in 1997, MediaTek has become a important player in the semiconductor industry, known for its innovative chipsets that offer a balance of performance, power efficiency, and affordability.

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

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Technology Explained

SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.