TSMC Unveils Future Roadmap: N3X, N2P, A16 Set to Debut in 2025/2026

TSMC plans to introduce advanced fabrication processes, including N3X and N2, in the second half of 2025, with N2 utilizing gate-all-around nanosheet transistors for improved performance and power efficiency, while N3X offers a 7% reduction in power consumption and 5% increase in performance at the same area compared to N3P.

TSMC is the leading semiconductor manufacturer, known for its advanced technology and high-quality products.
The upcoming production nodes, N3X and N2, promise significant improvements in power efficiency, performance, and chip density.
TSMC's roadmap showcases its commitment to pushing the boundaries of semiconductor technology, catering to a wide range of applications.

TSMC, the leading semiconductor manufacturer, has recently announced its plans for future fabrication processes. Later this year, TSMC will begin high-volume manufacturing on its N3P process, which is touted as the company’s most advanced node for the time being. However, things will get even more intriguing next year as TSMC prepares to introduce two competing process technologies in the second half of 2025.

The upcoming production nodes include N3X, a 3nm-class process focused on extreme performance, and N2, a 2nm-class process. TSMC claims that chips manufactured on N3X can achieve a 7% reduction in power consumption at the same frequency by lowering Vdd from 1.0V to 0.9V, a 5% increase in performance at the same area, or a 10% increase in transistor density at the same frequency compared to N3P. Notably, N3X stands out with its maximum voltage of 1.2V, making it ideal for high-performance applications like desktop or datacenter GPUs.

On the other hand, N2 will be TSMC’s first production node to utilize gate-all-around (GAA) nanosheet transistors, promising significant improvements in performance, power efficiency, and chip density. When compared to N3E, chips produced on N2 can achieve a 25% to 30% reduction in power consumption (at the same transistor count and frequency), a 10% to 15% increase in performance (at the same transistor count and power), and a 15% increase in transistor density (at the same speed and power).

While N2 excels in power consumption and transistor density, N3X may pose a challenge in terms of performance, particularly at high voltages. Additionally, N3X offers the advantage of using proven FinFET transistors, making it a compelling choice for customers. As a result, N2 may not automatically be the superior option among TSMC’s nodes in the second half of 2025.

Looking ahead to 2026, TSMC has plans to introduce two more nodes targeting smartphone and high-performance computing applications: N2P (performance-enhanced 2nm-class) and A16 (1.6nm-class with backside power delivery). N2P is expected to deliver a 5% to 10% reduction in power consumption or a 5% to 10% increase in performance compared to the original N2. Meanwhile, A16 aims to offer up to a 20% reduction in power consumption, up to a 10% increase in performance, and up to a 10% higher transistor density compared to N2P. Notably, A16 features an enhanced backside power delivery network, making it an attractive choice for chip designers focused on performance. However, it should be noted that the use of A16 comes at a higher cost due to the additional process steps required for backside power delivery.

TSMC’s roadmap showcases its commitment to pushing the boundaries of semiconductor technology. With its upcoming nodes, the company aims to deliver improvements in power efficiency, performance, and chip density, catering to a wide range of applications from high-performance computing to smartphones. As TSMC continues to innovate, the industry eagerly awaits the arrival of these advanced fabrication processes.

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Background Information

About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.