TSMC introduces 1.6nm Tech for Late 2026: A16 Empowered by “Super Power Rail”

TSMC, the Taiwanese pure play Foundry, kicked off its annual technology symposium series in Santa Clara yesterday, unveiling several new technologies and providing a glimpse into its updated foundry plans for the coming years. The highlight of the event was the announcement of TSMC’s A16 process node, which is set to offer improved performance and energy efficiency compared to its previous N2P fabrication process.

The A16 process technology will utilize gate-all-around (GAAFET) nanosheet transistors and introduce a backside power rail, resulting in enhanced power delivery and a moderate increase in transistor density. TSMC estimates that A16 will deliver a performance improvement of 8% to 10% at the same voltage and complexity, or a 15% to 20% reduction in power consumption at the same frequency and transistor count. While detailed density parameters have not been disclosed, TSMC anticipates a chip density increase of 1.07x to 1.10x.

One of the key innovations of the A16 node is its Super Power Rail (SPR) backside power delivery network, specifically designed for high-performance computing products with complex signal routes and dense power circuitry. Interestingly, the introduction of backside power capabilities was originally planned for TSMC’s N2P node in 2026 but has now been shifted to A16 for reasons that remain unclear.

TSMC’s decision to pursue backside power delivery aligns with a trend in the industry, with other fabs also exploring variations of the technique. Imec’s Buried Power Rail places the power delivery network on the backside of the wafer, while Intel’s PowerVia connects power to the cell or transistor contact. TSMC’s Super Power Rail technology directly connects a backside power network to each transistor’s source and drain, offering the most efficient area scaling but also the most complexity and cost in production.

With the introduction of A16, TSMC is ushering in a new era of process node naming conventions. As the industry moves beyond single-digit nanometer nodes, TSMC and Intel have both adopted new naming conventions. A16 will mark the next generation node beyond TSMC’s 2nm-class products.

TSMC plans to begin volume production on A16 in the second half of 2026, with products based on this technology expected to hit the market in 2027. While it is likely to compete against Intel’s 14A node, it’s important to note that plans and roadmaps can still evolve significantly over the next two years.

Background Information

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

  

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

  

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Technology Explained

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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