SK Hynix Explores Innovative HBM Memory as AI Enthusiasm Grows

SK Hynix is exploring developing differentiated HBM products tailored to the AI industry, aiming to cater to the evolving needs of its customers with the upcoming HBM4 and advanced packaging technologies.

SK Hynix and AMD were pioneers in the memory industry with their introduction of high bandwidth memory (HBM), showing their expertise and innovation in the field.
SK Hynix continues to dominate the market share for HBM, indicating their strong position and reputation in the industry.
The company is actively exploring ways to develop differentiated HBM products to meet the evolving needs of its customers, particularly in the AI space, showing their commitment to meeting customer demands and staying ahead of the competition.

SK hynix and AMD were pioneers in the memory industry with their introduction of high bandwidth memory (HBM) back in 2013 – 2015. SK Hynix continues to dominate this market in terms of market share. In order to maintain its position and cater to the needs of its customers, particularly in the AI space, SK Hynix is exploring ways to develop “differentiated” HBM products for large customers.

According to Hoyoung Son, the head of Advanced Package Development at SK Hynix, the development of customer-specific AI memory requires a new approach that emphasizes flexibility and scalability of the technology.

In terms of performance, HBM memory with a 1024-bit interface has been rapidly evolving. It started with a data transfer rate of 1 GT/s in 2014 – 2015 and has now reached speeds of 9.2 GT/s – 10 GT/s with the introduction of HBM3E memory devices. With the upcoming HBM4, the memory will transition to a 2048-bit interface, ensuring further improvements in bandwidth.

However, there are customers who may benefit from differentiated or semi-custom HBM-based solutions, according to Hoyoung Son. He stated that in order to implement diverse AI applications, the characteristics of AI memory need to become more varied. SK Hynix aims to provide differentiated solutions that can meet the specific needs of its customers.

With a 2048-bit interface, it is likely that many HBM4 solutions will be custom or semi-custom based on available information. Some customers may choose to use interposers, although this option may become expensive. Others may opt for direct bonding techniques, which also come at a higher cost.

Developing differentiated HBM products requires advanced packaging techniques, such as SK Hynix’s Advanced Mass Reflow Molded Underfill (MR-RUF) technology. The company’s extensive experience with HBM suggests that they may introduce additional innovations to cater to specific customer requirements.

In conclusion, SK Hynix is actively exploring ways to develop differentiated HBM products to meet the evolving needs of its customers, particularly in the AI space. With the upcoming HBM4, the company aims to provide advanced packaging technologies that can respond to the changing technological landscape and offer tailored solutions to meet customer demands.

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Background Information

About AMD:

AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.

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About SK hynix:

SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

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Technology Explained

HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.