Marvell introduces Advanced 2nm Silicon for Next-Gen Infrastructure Solutions

Marvell introduces 2 nm Silicon for AI and Cloud

Marvell Technology, Inc. is stirring up the tech world with its first 2 nm silicon IP, designed specifically for the next generation of AI and cloud infrastructure. This silicon, created using TSMC’s advanced 2 nm process, is part of Marvell’s robust platform aimed at empowering cloud service providers to boost their performance, efficiency, and economic viability on a global scale. With a staggering projected 45% annual growth in the total addressable market (TAM), custom silicon is set to capture around 25% of the accelerated compute market by 2028.

A Building Block Approach

So, what’s the secret sauce behind Marvell’s strategy? It’s all about a comprehensive portfolio of semiconductor intellectual property (IP). This includes everything from electrical and optical serializer/deserializers (SerDes) to advanced packaging technologies and custom high-bandwidth memory (HBM) architectures. Think of it as a toolbox for creating bespoke AI accelerators, CPUs, optical DSPs, and high-performance switches. By providing these essential building blocks, Marvell is paving the way for the next wave of tech innovation.

Leading the Charge in Advanced Technology

Marvell isn’t just playing catch-up; since launching its industry-leading 5 nm data infrastructure silicon platform in 2020, the company has consistently been ahead of the curve. They launched their 3 nm platform in 2022, and the first silicon from this initiative is already rolling out. “Our platform approach allows us to speed up the development of high-speed SerDes and other critical technologies,” explains Sandeep Bharathi, Marvell’s Chief Development Officer. This collaboration with TSMC is crucial, enabling Marvell to develop complex silicon solutions that boast top-notch performance and efficiency.

Exciting Innovations on the 2 nm Platform

But wait, there’s more! Marvell has also introduced a game-changing 3D simultaneous bidirectional I/O that operates at speeds up to 6.4 Gbits/second. This innovation allows for connections between vertically stacked die in chiplets to be bidirectional, effectively doubling the bandwidth or halving the number of required connections. Imagine the design flexibility this brings to chip designers!

As chip technology advances, many of today’s most sophisticated chips exceed the size of the reticle used to outline transistor patterns on silicon. To tackle this, it’s estimated that around 30% of all advanced node processors will adopt chiplet designs, combining multiple chips into a single package. With the new 3D simultaneous bidirectional I/O, designers can stack more die, creating 2.5D, 3D, and even 3.5D devices that deliver enhanced capabilities while still functioning seamlessly as a single unit.

A Bright Future Ahead

Dr. Kevin Zhang, TSMC’s Senior VP of Business Development, couldn’t be more enthusiastic about the collaboration: “We look forward to our continued partnership with Marvell to leverage TSMC’s best-in-class silicon technology and packaging to advance accelerated infrastructure for the AI era.” It’s clear that with innovations like these, Marvell is not just keeping pace; they’re leading the charge into a future where AI and cloud technologies are more powerful and efficient than ever before.

As we look ahead, one thing is certain: the race for advanced silicon is heating up, and Marvell is in the driver’s seat. Are you ready for what’s next?

Background Information

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

  

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Technology Explained

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

Latest Articles about chiplet

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

Latest Articles about chiplets