Intel Foundry Showcases New Innovations at IEDM 2024 Conference

Intel Foundry’s Bold Moves at IEDM 2024

Today at the IEEE International Electron Devices Meeting (IEDM) 2024, Intel Foundry took center stage with some announcements that promise to propel the semiconductor industry into an exciting new era. The company launched a series of innovative material advancements designed to enhance chip interconnections, boasting a remarkable 25% reduction in capacitance thanks to the introduction of subtractive ruthenium. But that’s just the tip of the iceberg.

In a stunning first, Intel Foundry reported a jaw-dropping 100x improvement in throughput using a heterogeneous integration solution for advanced packaging. This leap forward could revolutionize the way we think about chip-to-chip assembly, making it faster and more efficient than ever. And let’s not overlook the strides made in gate-all-around (GAA) scaling, with Intel showcasing their work on silicon RibbonFET CMOS and advanced gate oxide modules for scaled 2D FETs. This isn’t just tech jargon; it’s a roadmap to better device performance.

A Vision for the Future

As Sanjay Natarajan, Intel’s senior vice president and general manager of Intel Foundry Technology Research, put it, these breakthroughs are a testament to Intel’s commitment to leading the charge in semiconductor innovation. “Our latest breakthroughs underscore the company’s commitment to delivering technology developed in the U.S.,” he said. This is particularly important as the industry gears up to pack a staggering 1 trillion transistors onto a single chip by 2030. To meet this challenge, advancements in transistor and interconnect scaling are not just beneficial—they’re essential.

The push toward energy-efficient, high-performance computing applications, especially in fields like AI, is relentless. But the industry isn’t just focused on scaling up; it’s also about ensuring that these advancements are sustainable. Intel Foundry is looking at new materials to enhance their PowerVia backside power delivery system, which aims to alleviate interconnect crowding and keep Moore’s Law alive and well.

Innovations That Matter

So, what exactly is Intel Foundry bringing to the table? Let’s break it down:

–

Subtractive Ruthenium (Ru)

: This new metallization material is a game changer. By utilizing thin film resistivity and airgaps, Intel has created a practical, cost-effective process that could replace traditional copper damascene in tight pitch layers. Imagine achieving a 25% reduction in line-to-line capacitance at pitches of 25 nanometers or less. That’s not just a statistic; it’s a significant leap forward in chip design.

–

Selective Layer Transfer (SLT)

: Intel Foundry is pioneering SLT, which enables ultra-thin chiplets to be bonded more flexibly and efficiently than ever before. This method can deliver up to 100x higher throughput for chip-to-chip assembly, making it a critical innovation for AI applications that demand speed and performance.

–

Silicon RibbonFET CMOS

: Intel showcased transistors at a gate length of just 6 nanometers. This level of scaling is not just impressive; it’s essential for pushing the boundaries of what’s possible in semiconductor technology.

–

Gate Oxide for Scaled GAA 2D FETs

: Intel is also exploring the potential of 2D transition metal dichalcogenide semiconductors as a future replacement for silicon. This could open new avenues for transistor processes, making them even more efficient.

And let’s not forget the exciting developments in

gallium nitride (GaN)

technology. Intel Foundry is leading the charge with the industry’s first 300 mm GaN technology, which promises enhanced performance for power and RF electronics. This innovation could significantly reduce signal loss and improve signal linearity, paving the way for advanced integration schemes.

Looking Ahead

At IEDM, Intel Foundry didn’t just stop at showcasing their innovations; they laid out a vision for the future of advanced packaging and transistor scaling. They identified three key areas where innovation is crucial:

1.

Advanced memory integration

to tackle capacity, bandwidth, and Latency issues.
2.

Hybrid bonding

to optimize interconnect bandwidth.
3.

Modular system expansion

to enhance connectivity solutions.

Intel Foundry is also calling for a collective effort to push the boundaries of transistor scaling as we enter the trillion-transistor era. One ambitious goal? Developing transistors capable of operating at ultra-low voltages—less than 300 millivolts. This could dramatically improve energy efficiency and thermal management in future computing applications.

Curious to learn more about Intel Foundry’s technical papers and innovations presented at this year’s IEDM? Check out the IEDM website for all the details. The future of semiconductors is bright, and Intel Foundry is leading the charge!

Background Information

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

  

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Technology Explained

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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Latency: Technology latency is the time it takes for a computer system to respond to a request. It is an important factor in the performance of computer systems, as it affects the speed and efficiency of data processing. In the computer industry, latency is a major factor in the performance of computer networks, storage systems, and other computer systems. Low latency is essential for applications that require fast response times, such as online gaming, streaming media, and real-time data processing. High latency can cause delays in data processing, resulting in slow response times and poor performance. To reduce latency, computer systems use various techniques such as caching, load balancing, and parallel processing. By reducing latency, computer systems can provide faster response times and improved performance.

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