Intel IFS Direct Connect 2024 Keynote: Unveiling the Future of Technology

IFS Direct Connect

Intel's IFS Direct Connect event showcased updates on Intel's foundry business, process roadmap, and focus on AI, advanced packaging technologies, and collaboration with partners, as it transforms into a fully integrated systems foundry in the AI space.

High attendance and positive reception from industry leaders and customers
Rebranding as Intel Foundry reflects commitment to becoming a top player in the contract foundry space
Strong focus on AI, advanced packaging technologies, and partnerships to drive innovation and reshape the industry

This morning, Intel held its highly anticipated IFS Direct Connect event in Santa Clara, where the company provided updates on its Foundry business and process roadmap. Led by Intel CEO Pat Gelsinger and Stuart Pann, the Senior Vice President and General Manager of Intel Foundry Services, the event featured a lineup of notable guests including Sam Altman, CEO of OpenAI, Gina Raimondo, US Secretary of Commerce, and Satya Nadella, CEO of Microsoft.

The event kicked off with a packed audience, exceeding Intel’s expectations for attendance. As a newcomer to the contract foundry space, Intel faces the challenge of attracting customers in its early years. However, IFS Direct Connect served as a coming-out party for Intel’s foundry group, showcasing their progress in catching up on node development and building an external foundry ecosystem.

One of the major announcements of the day was the rebranding of Intel’s foundry group as Intel Foundry. This move reflects Intel’s transformation into a fully integrated systems foundry in the AI space. Gelsinger emphasized Intel’s commitment to reestablishing its process leadership position and launched plans to become the world’s #2 foundry by 2025.

AI was a central theme throughout the event, with Intel positioning itself as a key player in making chips for the AI era. Gelsinger highlighted Intel’s extensive portfolio of foundry technologies, including high-NA, glass substrates, and die stacking. He also emphasized Intel’s focus on developing advanced packaging technologies and securing partnerships with EDA and IP providers to support their ecosystem.

The event also touched on the geopolitical aspects of Intel Foundry’s plans. Intel aims to provide a resilient foundry option for business and government customers worldwide, reducing reliance on fabs located in regions with geopolitical risks. This move aligns with the US government’s efforts to diversify its supply chain and bring more leading-edge chip manufacturing to the US.

Intel’s roadmap for process nodes was a key highlight, with Gelsinger reaffirming the company’s commitment to Moore’s Law. Intel is on track with its 5 Nodes in 4 Years promise, with Intel 4 already shipping and Intel 3 ready for high-volume manufacturing. The upcoming Angstrom nodes, 20A and 18A, remain on schedule, and Intel has already taped out its first 18A product.

Intel Foundry’s focus on chiplets and tiling was also emphasized, with Pann highlighting the advantages of this approach in improving chip yields and enabling customers to customize their chips. The company showcased its success with chiplets through the Ponte Vecchio project and announced a new partnership with ARM to further expand its products.

Overall, Intel’s IFS Direct Connect event provided a comprehensive overview of the company’s foundry business and its vision for the future. With a strong emphasis on AI, advanced packaging technologies, and partnerships, Intel is positioning itself as a major player in the foundry space, aiming to drive innovation and reshape the industry.

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Background Information

About ARM: ARM, originally known as Acorn RISC Machine, is a British semiconductor and software design company that specializes in creating energy-efficient microprocessors, system-on-chip (SoC) designs, and related technologies. Founded in 1990, ARM has become a important player in the global semiconductor industry and is widely recognized for its contributions to mobile computing, embedded systems, and Internet of Things (IoT) devices. ARM's microprocessor designs are based on the Reduced Instruction Set Computing (RISC) architecture, which prioritizes simplicity and efficiency in instruction execution. This approach has enabled ARM to produce highly efficient and power-saving processors that are used in a vast array of devices, ranging from smartphones and tablets to IoT devices, smart TVs, and more. The company does not manufacture its own chips but licenses its processor designs and intellectual property to a wide range of manufacturers, including Qualcomm, Apple, Samsung, and NVIDIA, who then integrate ARM's technology into their own SoCs. This licensing model has contributed to ARM's widespread adoption and influence across various industries.

About Intel: Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

About Microsoft: Microsoft, founded by Bill Gates and Paul Allen in 1975 in Redmond, Washington, USA, is a technology giant known for its wide range of software products, including the Windows operating system, Office productivity suite, and cloud services like Azure. Microsoft also manufactures hardware, such as the Surface line of laptops and tablets, Xbox gaming consoles, and accessories.

Technology Explained

chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

EDA: EDA stands for Electronic Design Automation, and it refers to a category of software tools and solutions used in the design and development of electronic systems and integrated circuits. EDA tools assist engineers and designers in creating complex electronic designs, from individual components to entire systems, by automating various aspects of the design process. These tools encompass a wide range of functionalities, including schematic capture, simulation, layout design, verification, and testing.

Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).