xMEMS introduces Ultra-Slim Micro-Cooling Fan Chip for Enhanced Performance


August 21, 2024 by our News Team

xMEMS Labs introduces the XMC-2400 µCooling chip, a compact and efficient solution for thermal management in ultramobile devices, potentially revolutionizing the performance and design of smartphones and tablets.

  • Revolutionary solution for thermal management in ultramobile devices
  • Compact size and lightweight, making it ideal for smartphones and tablets
  • Uses advanced fabrication techniques for precision and reliability


In the fast-paced world of mobile technology, where every millimeter counts and heat management can make or break device performance, xMEMS Labs is stepping up with an innovation that could redefine thermal management in ultramobile devices. Enter the xMEMS XMC-2400 µCooling chip—a mouthful, sure, but also a game-changer. This is the first all-silicon, active micro-cooling fan designed specifically for the sleek smartphones and Tablets we can’t seem to live without.

Imagine this: you’re deep into a gaming session on your smartphone, or perhaps you’re running a complex AI application, and suddenly your device starts to throttle. It’s a common experience that can turn a smooth experience into a frustrating one. The XMC-2400 aims to tackle that issue head-on. Joseph Jiang, xMEMS CEO and co-founder, describes it as a “fan-on-a-chip” solution that arrives at a crucial moment when mobile computing is pushing the boundaries of what our devices can handle.

At just 1 millimeter thick, the XMC-2400 is remarkably compact. To put that in perspective, it measures 9.26 x 7.6 x 1.08 millimeters and weighs less than a paperclip—about 150 milligrams. It’s 96% smaller and lighter than traditional cooling solutions, which often resemble miniature fans that you’d find in a desktop computer. But don’t let its size fool you; this tiny chip can move up to 39 cubic centimeters of air per second, all while maintaining a whisper-quiet operation. Talk about a breath of fresh air for your devices!

What’s even more intriguing is how this chip is built. xMEMS employs the same fabrication techniques that brought us their award-winning micro speakers, which are already stirring up the world of wireless earbuds. If you’ve ever marveled at the sound quality of those devices, you can appreciate the level of precision and reliability that goes into creating the XMC-2400.

But why does this matter? As our devices become increasingly powerful, they generate more heat. Just think back to the last time you noticed your phone getting uncomfortably warm. With the rise of AI-driven applications, this challenge is only going to intensify. The XMC-2400 could be the answer, allowing manufacturers to integrate active cooling into even the thinnest smartphones and tablets without adding bulk or noise.

Jiang is optimistic about the impact this technology will have. “We are changing people’s perception of thermal management,” he says. “It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.” It’s an exciting prospect, and one that could pave the way for more advanced, AI-ready mobile devices that don’t sacrifice performance for form.

If you’re curious about how this technology will be received, xMEMS plans to showcase the XMC-2400 at their upcoming events in Shenzhen and Taipei this September. It’s a chance for industry leaders and tech enthusiasts alike to get a firsthand look at what’s next in mobile thermal management.

So, as we stand on the brink of this new era in ultramobile devices, one has to wonder: will the XMC-2400 become a standard feature in our future smartphones? Only time will tell, but with innovations like this, the future of mobile technology is certainly looking cooler.

xMEMS introduces Ultra-Slim Micro-Cooling Fan Chip for Enhanced Performance

xMEMS introduces Ultra-Slim Micro-Cooling Fan Chip for Enhanced Performance

xMEMS introduces Ultra-Slim Micro-Cooling Fan Chip for Enhanced Performance

xMEMS introduces Ultra-Slim Micro-Cooling Fan Chip for Enhanced Performance

xMEMS introduces Ultra-Slim Micro-Cooling Fan Chip for Enhanced Performance

xMEMS introduces Ultra-Slim Micro-Cooling Fan Chip for Enhanced Performance

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Background Information


About xMEMS:

xMEMS is a global leader in the design and manufacturing of integrated systems for the computer, IT, and electronics industry. With over 25 years of experience in the technology fields, xMEMS provides a comprehensive portfolio of innovative products and solutions to satisfy the needs of the most demanding customers. Not only do they provide high-quality components, xMEMS is proactive in their approach to technology, with their team of experts taking initiative to create solutions to the most difficult problems in the IT and electronics industry. They pride themselves on staying ahead of the competition by continually introducing new and improved products to the market, offering excellent customer service, and providing comprehensive technical support. For anyone in the tech industry looking for high-quality components and solutions, xMEMS is an excellent option.

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