Intel introduces Revolutionary Optical IO Chiplet, a Game-Changer in Integration Technology

Intel Corporation has just made a achievement in integrated photonics technology for high-speed data transmission, and it’s got tech enthusiasts buzzing. At the Optical Fiber Communication Conference (OFC) 2024, Intel’s Integrated Photonics Solutions (IPS) Group showcased the industry’s most advanced and first-ever fully integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU. Not only that, but the chiplet was running live data, demonstrating its capabilities in real-time.

So, what does this mean for the world of technology? Well, Intel’s OCI chiplet is a game-changer when it comes to high-bandwidth interconnect. It enables co-packaged optical input/output (I/O) in emerging AI infrastructure for data centers and high-performance computing (HPC) applications. In simpler terms, it allows for faster and more efficient data transfer between servers, which is crucial in today’s data-driven world.

Thomas Liljeberg, senior director of Product Management and Strategy at Intel’s IPS Group, explained the significance of this achievement. He said, “The ever-increasing movement of data from server to server is straining the capabilities of today’s data center infrastructure, and current solutions are rapidly approaching the practical limits of electrical I/O performance. However, Intel’s achievement empowers customers to seamlessly integrate co-packaged silicon photonics interconnect solutions into next-generation compute systems. Our OCI chiplet boosts bandwidth, reduces power consumption, and increases reach, enabling ML workload acceleration that promises to revolutionize high-performance AI infrastructure.”

The OCI chiplet is designed to support 64 channels of 32 gigabits per second (Gbps) data transmission in each direction on up to 100 meters of fiber optics. This addresses the growing demands of AI infrastructure for higher bandwidth, lower power consumption, and longer reach. It also opens up possibilities for future scalability of CPU/GPU cluster connectivity and innovative compute architectures.

But why is this development so crucial? Well, as AI-based applications continue to expand globally, the need for larger and more efficient machine learning (ML) models is growing. And to support these models, computing platforms need to be able to handle the exponential growth in I/O bandwidth and longer reach. This is where Intel’s OCI chiplet comes in.

Currently, electrical I/O (copper trace connectivity) offers high bandwidth density and low power consumption but has limited reach. Pluggable optical transceiver modules can increase reach but at a cost and power level that is not sustainable for AI workloads. The OCI chiplet, on the other hand, provides a solution that supports higher bandwidths with improved power efficiency, low Latency, and longer reach. It’s like going from using horse carriages to using cars and trucks to distribute goods – a significant leap in performance and energy efficiency.

So, how does the OCI chiplet work? It leverages Intel’s field-proven silicon photonics technology and integrates a silicon photonics integrated circuit (PIC) with an electrical IC. The chiplet demonstrated at OFC was co-packaged with an Intel CPU but can also be integrated with other CPUs, GPUs, IPUs, and system-on-chips (SoCs).

The live optical link demonstration at OFC showcased a transmitter (Tx) and receiver (Rx) connection between two CPU platforms over a single-mode fiber patch cord. The CPUs generated and measured the optical Bit Error Rate (BER), demonstrating the chiplet’s strong signal quality.

In terms of specifications, the current OCI chiplet supports up to 4 terabits per second (Tbps) bidirectional data transfer, compatible with peripheral component interconnect express (PCIe) Gen5. It supports 64 channels of 32 Gbps data transmission in each direction up to 100 meters. It utilizes eight fiber pairs, each carrying eight dense wavelength division multiplexing (DWDM) wavelengths. And the best part? It’s remarkably energy-efficient, consuming only 5 pico-Joules (pJ) per bit compared to pluggable optical transceiver modules at about 15 pJ/bit.

Intel’s expertise in silicon photonics is what sets them apart from the competition. With over 25 years of internal research and development, Intel has pioneered integrated photonics and delivered reliable silicon photonics-based connectivity products at high volumes to major cloud service providers. Their approach of hybrid laser-on-wafer technology and direct integration ensures higher reliability and lower costs.

Intel’s commitment to innovation doesn’t stop there. They are implementing a new silicon photonics fab process node with state-of-the-art device performance, higher density, better coupling, and improved economics. They continue to make advancements in on-chip laser and SOA performance, cost, and power.

It’s important to note that the current OCI chiplet is still a prototype. Intel is working with select customers to co-package OCI with their system-on-chips (SoCs) as an optical I/O solution. This is just the beginning of what Intel has in store for high-speed data transmission.

In conclusion, Intel’s OCI chiplet represents a significant leap forward in high-speed data transmission for AI infrastructure. As the demands of AI acceleration workloads continue to grow, Intel remains at the forefront of driving innovation and shaping the future of connectivity. With their revolutionary integrated photonics technology, they are empowering customers to seamlessly integrate co-packaged silicon photonics interconnect solutions into next-generation compute systems. It’s an exciting time for the world of technology, and Intel is leading the way.

Background Information

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

  

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GPU: GPU stands for Graphics Processing Unit and is a specialized type of processor designed to handle graphics-intensive tasks. It is used in the computer industry to render images, videos, and 3D graphics. GPUs are used in gaming consoles, PCs, and mobile devices to provide a smooth and immersive gaming experience. They are also used in the medical field to create 3D models of organs and tissues, and in the automotive industry to create virtual prototypes of cars. GPUs are also used in the field of artificial intelligence to process large amounts of data and create complex models. GPUs are becoming increasingly important in the computer industry as they are able to process large amounts of data quickly and efficiently.

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PCIe: PCIe (Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard for connecting components such as graphics cards, sound cards, and network cards to a motherboard. It is the most widely used interface in the computer industry today, and is used in both desktop and laptop computers. PCIe is capable of providing up to 16 times the bandwidth of the older PCI standard, allowing for faster data transfer speeds and improved performance. It is also used in a variety of other applications, such as storage, networking, and communications. PCIe is an essential component of modern computing, and its applications are only expected to grow in the future.

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