Marvell Unveils Groundbreaking 2 nm Platform for Turbocharged Infrastructure Silicon

Marvell Technology, a prominent player in data infrastructure semiconductor solutions, has announced an extended collaboration with TSMC (Taiwan Semiconductor Manufacturing Company) to develop the industry’s first technology platform for producing 2 nm semiconductors optimized for accelerated infrastructure. This groundbreaking platform is backed by Marvell’s impressive IP portfolio, which encompasses a wide range of infrastructure requirements, including high-speed long-reach SerDes, processor subsystems, encryption engines, chip-to-chip interconnects, and various high-bandwidth physical layer interfaces.

The Marvell 2 nm platform will serve as the foundation for producing custom compute accelerators, Ethernet switches, optical and copper interconnect digital signal processors, and other devices that power AI clusters, cloud data centers, and other accelerated infrastructure. The company recognizes the importance of investing in platform components like interconnects and advanced packaging to address data bottlenecks and enhance system performance. These breakthroughs at the platform level not only reduce costs but also expedite the time-to-market for multichip solutions designed to run complex applications.

Sandeep Bharathi, Chief Development Officer at Marvell, highlights the significance of the 2 nm platform in meeting the demands of future AI workloads. He emphasizes the need for substantial improvements in performance, power efficiency, area utilization, and transistor density. Marvell’s partnership with TSMC on the 5 nm, 3 nm, and now 2 nm platforms has been instrumental in pushing the boundaries of silicon capabilities.

Kevin Zhang, Senior Vice President of Business Development at TSMC, expresses excitement about collaborating with Marvell to pioneer a platform for advancing accelerated infrastructure on TSMC’s cutting-edge 2 nm process technology. TSMC looks forward to continuing their partnership with Marvell in developing connectivity and compute products that leverage TSMC’s industry-leading process and packaging technologies.

Marvell has made significant strides in bringing advanced node technology to infrastructure silicon. The company has transitioned from being a fast follower to a leader in this space, starting with the successful deployment of its 5 nm platform. Following this achievement, Marvell introduced several 5 nm designs and became the first to offer a portfolio for infrastructure silicon on TSMC’s 3 nm processes.

Sandeep Bharathi explains Marvell’s approach to semiconductor design R&D, emphasizing their focus on qualifying foundational analog, mixed-signal IP, and advanced packaging that can be utilized across a wide range of devices. This modular approach allows Marvell to bring manufacturing advances to market more rapidly, ensuring they stay at the forefront of innovation in the industry.

Background Information

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About TSMC: TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a prominent player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its cutting-edge semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.