Micron Commences HBM3E Memory Production, Paving the Way for Advanced Data Storage

Micron Technology has announced the commencement of volume production for its HBM3E memory. This new memory technology will be utilized in nVidia’s H200 compute GPU, which is designed for artificial intelligence (AI) and high-performance computing (HPC) applications. The Nvidia H200 GPU is expected to be released in the second quarter of 2024.

Micron’s HBM3E memory devices have a capacity of 24 GB and feature an impressive data transfer rate of 9.2 GT/s, providing a peak memory bandwidth of over 1.2 TB/s per device. Compared to its predecessor, HBM3, HBM3E offers a 44% increase in data transfer rate and peak memory bandwidth. This enhancement is particularly beneficial for processors like Nvidia’s H200 that require high bandwidth capabilities.

The Nvidia H200 GPU is based on the Hopper architecture and delivers the same level of computing performance as the H100. However, it comes equipped with 141 GB of HBM3E memory, offering a substantial upgrade from the previous 80 GB of HBM3 memory found in the H100. The HBM3E memory in the H200 GPU provides a bandwidth of up to 4.8 TB/s, compared to the 3.35 TB/s bandwidth of the H100.

Looking ahead, Micron has plans to release a 36 GB 12-Hi HBM3E product in March 2024, further solidifying its memory roadmap for AI applications. The specific use cases for these upcoming devices have yet to be revealed.

Micron’s achievement in utilizing its advanced 1β (1-beta) process technology for the production of HBM3E is noteworthy. This signifies the company’s ability to leverage its latest production node for data center-grade products, showcasing its manufacturing expertise.

The fact that Micron has initiated mass production of HBM3E memory ahead of competitors SK hynix and Samsung is a significant milestone. Currently holding a 10% market share in the HBM sector, this move allows Micron to introduce a premium product earlier than its rivals. This strategic advantage has the potential to boost the company’s revenue and profit margins while also expanding its market share.

Sumit Sadana, Executive Vice President and Chief Business Officer at Micron Technology, expressed his confidence in the company’s HBM3E milestone. He stated, “Micron is delivering a trifecta with this HBM3E milestone: time-to-market leadership, best-in-class industry performance, and a differentiated power efficiency profile.” Sadana emphasized the importance of memory bandwidth and capacity for AI workloads and highlighted Micron’s strong position in supporting the growing AI market with its HBM3E and HBM4 roadmap, as well as its comprehensive portfolio of DRAM and NAND solutions.

Source: Micron

Background Information

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About Micron Technology:

Micron Technology, headquartered in Boise, Idaho, is a global leader in innovative memory and storage solutions. Founded in 1978 by Ward Parkinson, Joe Parkinson, Dennis Wilson, and Doug Pitman, Micron has played a pivotal role in advancing semiconductor technology. The company produces dynamic random-access memory (DRAM), flash memory, and USB flash drives. Micron’s products cater to various applications, including AI, automotive, mobile devices, data centers, and client PCs. Their commitment to innovation and memory technology has positioned them as a key player in the industry.

  

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About nVidia:

NVIDIA has firmly established itself as a leader in the realm of client computing, continuously pushing the boundaries of innovation in graphics and AI technologies. With a deep commitment to enhancing user experiences, NVIDIA's client computing business focuses on delivering solutions that power everything from gaming and creative workloads to enterprise applications. for its GeForce graphics cards, the company has redefined high-performance gaming, setting industry standards for realistic visuals, fluid frame rates, and immersive experiences. Complementing its gaming expertise, NVIDIA's Quadro and NVIDIA RTX graphics cards cater to professionals in design, content creation, and scientific fields, enabling real-time ray tracing and AI-driven workflows that elevate productivity and creativity to unprecedented heights. By seamlessly integrating graphics, AI, and software, NVIDIA continues to shape the landscape of client computing, fostering innovation and immersive interactions in a rapidly evolving digital world.

  

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About Samsung:

Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

  

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About SK hynix:

SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

  

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Technology Explained

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GPU: GPU stands for Graphics Processing Unit and is a specialized type of processor designed to handle graphics-intensive tasks. It is used in the computer industry to render images, videos, and 3D graphics. GPUs are used in gaming consoles, PCs, and mobile devices to provide a smooth and immersive gaming experience. They are also used in the medical field to create 3D models of organs and tissues, and in the automotive industry to create virtual prototypes of cars. GPUs are also used in the field of artificial intelligence to process large amounts of data and create complex models. GPUs are becoming increasingly important in the computer industry as they are able to process large amounts of data quickly and efficiently.

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HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

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HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.

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NAND: NAND technology is a type of non-volatile memory that is used in many computer applications. It is a type of flash memory that is used to store data in a non-volatile manner, meaning that the data is not lost when the power is turned off. NAND technology is used in many computer applications, such as solid-state drives, USB flash drives, digital cameras, and memory cards. It is also used in many embedded systems, such as cell phones, tablets, and other consumer electronics. NAND technology is a reliable and cost-effective way to store data, making it a popular choice for many computer applications.

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