Intel Foundry Services and Cadence Design Systems strengthen collaboration for SoC design.

Intel Foundry Services and Cadence Design Systems have formed a partnership to develop customized IP and design solutions for Intel's 18A process technology, with the goal of accelerating the development of high-performance SoCs for AI, HPC, and premium mobile applications.

Accelerates development of system-on-chip projects for AI, HPC, and premium mobile applications
Comprehensive portfolio of key IP and advanced design solutions
Aligned with Intel's IDM 2.0 strategy to expand foundry business and provide advanced manufacturing capabilities to external customers

Intel Foundry Services (IFS) and Cadence Design Systems Inc. have announced a strategic agreement to collaborate on the development of customized intellectual property (IP) and optimized design flows for Intel’s 18A process technology. This partnership aims to accelerate the development of system-on-chip (SoC) projects for artificial intelligence, high-performance computing, and premium mobile applications.

Under this multiyear agreement, joint customers of IFS and Cadence will benefit from a comprehensive portfolio of key IP and advanced design solutions. By leveraging Cadence’s expertise in IP and design software, customers will be able to deliver high-volume, high-performance, and power-efficient SoCs on Intel’s process technologies.

The collaboration between IFS and Cadence is aligned with Intel’s IDM 2.0 strategy, which focuses on expanding its foundry business and providing advanced manufacturing capabilities to external customers. By partnering with Cadence, Intel aims to strengthen its IP ecosystem and offer more choices to its customers.

Fast-growing market segments such as artificial intelligence/machine learning, HPC, and premium mobile computing demand the latest standards in IP to fully utilize advanced packaging and silicon process technologies. Cadence’s implementation of industry-leading standards, including advanced memory protocols and PCI Express, enables joint customers to develop scalable and high-performance designs that can be rapidly brought to market using IFS’ advanced silicon technologies and 3D-IC packaging capabilities.

This strategic collaboration between IFS and Cadence represents a significant step forward in enabling the development of innovative SoCs for emerging technologies. By combining their respective expertise, these companies are poised to drive advancements in performance, power efficiency, area optimization, bandwidth, and Latency for next-generation applications.

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Background Information

About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

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Technology Explained

Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.

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IDM 2.0: Intel IDM 2.0 is Intel's integrated device manufacturing (IDM) strategy introduced at 2021. It is a major evolution of the company's traditional IDM model, which has been in place since its founding in 1968. Under the IDM 2.0 strategy, Intel will continue to design and manufacture its own chips, but it will also become a major provider of foundry services to other companies. This will allow Intel to tap into the growing demand for semiconductor manufacturing capacity, while also generating new revenue streams.

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Latency: Technology latency is the time it takes for a computer system to respond to a request. It is an important factor in the performance of computer systems, as it affects the speed and efficiency of data processing. In the computer industry, latency is a major factor in the performance of computer networks, storage systems, and other computer systems. Low latency is essential for applications that require fast response times, such as online gaming, streaming media, and real-time data processing. High latency can cause delays in data processing, resulting in slow response times and poor performance. To reduce latency, computer systems use various techniques such as caching, load balancing, and parallel processing. By reducing latency, computer systems can provide faster response times and improved performance.

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SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.