Intel introduces Fab 9 Foundry in New Mexico, Revolutionizing Semiconductor Production

Intel, the technology giant, marked a significant milestone today with the grand opening of Fab 9, its state-of-the-art factory in Rio Rancho, New Mexico. This momentous occasion is part of Intel’s previously announced $3.5 billion investment aimed at equipping its New Mexico operations for the production of advanced semiconductor packaging technologies. One of the key innovations showcased at Fab 9 is Intel’s 3D packaging technology called Foveros, which revolutionizes the combination of multiple chips to deliver optimal power, performance, and cost.

In a statement, Keyvan Esfarjani, Intel’s executive vice president and chief global operations officer, expressed his excitement about the new facility, saying, “Today, we celebrate the opening of Intel’s first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale. This technology sets Intel apart and gives our customers real advantages in performance, form factor, and flexibility in design applications, all within a resilient supply chain.”

Intel’s global factory network serves as a competitive advantage, allowing the company to optimize its products, achieve economies of scale, and ensure a robust supply chain. The Fab 9 and Fab 11x facilities in Rio Rancho represent a significant milestone as they are the first operational sites for mass production of Intel’s 3D advanced packaging technology. Moreover, they are Intel’s first co-located high-volume advanced packaging sites, enabling an end-to-end manufacturing process that streamlines the supply chain from demand to final product.

Fab 9 is poised to drive Intel’s future innovations in advanced packaging technologies. As the semiconductor industry enters the era of heterogeneous computing utilizing multiple “chiplets” in a single package, advanced packaging technologies like Foveros and EMIB (embedded multi-die interconnect bridge) offer a faster and more cost-efficient path towards achieving the ambitious goal of fitting 1 trillion transistors on a single chip and extending Moore’s Law well beyond 2030.

Foveros, Intel’s 3D advanced packaging technology, allows for the stacking of compute tiles vertically, rather than side-by-side, in the construction of processors. This unique approach also enables Intel and its Foundry customers to mix and match compute tiles to achieve optimal cost and power efficiency.

The impact of Intel’s investment in Rio Rancho extends beyond the technological realm. Governor Michelle Lujan Grisham expressed her appreciation for Intel’s commitment to bringing manufacturing back to America, stating, “This investment by Intel underscores New Mexico’s continued dedication to bring manufacturing back home to America. Intel continues to play a key role in the state’s technology landscape and strengthen our workforce, supporting thousands of New Mexico families.”

Indeed, the $3.5 billion investment has not only created hundreds of high-tech Intel jobs but also generated over 3,000 construction jobs and an additional 3,500 jobs across the state, further solidifying Intel’s position as a significant contributor to the local economy.

Background Information

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

  

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Technology Explained

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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