DEEPX’s DX-M1 Chip Emerges as CES 2024’s Top AI of Things Innovation

CES Las Vegas

DEEPX, the pioneering AI semiconductor technology company, is stirring up the industry with its flagship chip solution, DX-M1. Boasting a unique combination of low power consumption, high efficiency and performance, and cost-effectiveness, DX-M1 has garnered the attention of over 40 customers worldwide. These customers, ranging from global corporations to domestic Korean enterprises across various sectors, have been given the opportunity to experience the solution through a hands-on trial.

To further engage with customers and provide early access to their technology, DEEPX has initiated the Early Engagement Customer Program (EECP). This program offers customers a sneak peek into DEEPX’s hardware and software, including the small camera module featuring DX-V1, the M.2 module featuring DX-M1, and DXNN, the company’s developer environment. By integrating these solutions into their mass-produced products, customers can validate DEEPX’s technology and leverage their technical support to drive AI innovations.

Currently, DX-M1 is undergoing pre-qualification testing in the mass production and development products of more than 40 global companies in sectors such as robotics and smart mobility, AI video security systems, and AI servers. Industries like robotics and smart mobility are increasingly demanding advanced AI chips like DX-M1 that offer state-of-the-art capabilities in a small form factor. This enables technologies like autonomous driving and cognition.

In the realm of physical security, where AI is rapidly gaining traction, it is crucial to have semiconductor-level AI functions such as object detection and intelligent video analysis. DEEPX’s DX-M1, built using a 5 nm process, stands out as the only chip of its kind in the market. It boasts an impressive power-to-performance ratio that surpasses existing products. With the ability to support real-time AI computational processing at over 30 frames-per-second (FPS) for more than 16 channels of multichannel video data on a single chip, DX-M1 can simultaneously process multiple AI algorithms like object recognition and image classification. Notably, it supports a wide spectrum of AI models, from popular ones like YOLOv5 to the latest YOLOv8 and vision transformer models. This unique combination of technologies positions DX-M1 as a market leader, excelling in efficiency, performance, power consumption, and cost-effectiveness – all crucial factors for customers seeking AI chips.

In a market where competing AI chips typically utilize 32 MB to 50 MB of cache memory, DX-M1 stands out by utilizing only a quarter of that amount. Despite the reduced cache memory, it still delivers exceptional computational processing power, compute accuracy, and support for a wide range of AI algorithms. Moreover, DX-M1 is available in a compact M.2 module, enabling seamless integration into existing embedded systems. This allows customers to effortlessly upgrade to low-power, high-performance AI solutions without the need for extensive system changes.

The recognition of DX-M1’s potential impact on the market is evident through its recent accolades. The chip was honored with CES Innovation Awards 2024 in both the Embedded Technology and Robotics categories, placing DEEPX alongside top-tier global brands.

As DEEPX continues its global expansion, the company will showcase the full potential of DX-M1 and more at CES 2024 in Las Vegas, NV. Visitors can experience DEEPX’s innovations firsthand at Booth #8953 in the North Hall from January 9-12, 2024.

Event Info

---

About CES: CES, the Consumer Electronics Show, is an annual event held in Las Vegas, Nevada, organized by the Consumer Technology Association (CTA). With a history dating back to 1967, it has become the world's premier platform for unveiling and exploring the latest innovations in consumer electronics and technology. Drawing exhibitors ranging from industry titans to startups across diverse sectors, including automotive, health and wellness, robotics, gaming, and artificial intelligence, CES transforms Las Vegas into a global tech hub, offering a glimpse into the future of technology through a wide array of showcases, from startup-focused Eureka Park to cutting-edge automotive and health tech exhibitions.

  

Technology Explained

---

M.2: M.2, also known as Next Generation Form Factor (NGFF), is a computer expansion card format that is designed to replace the outdated mSATA standard. It is thinner and longer than mSATA, which gives it a much higher data transfer rate. The M.2 format measures 22mm in width and can measure up to 110mm in length. It uses the M-key and B-key connectors to interface with PC host systems, and can connect to both SATA III and PCIe for data transfer. Due to its small size, M.2 is often used for ultra-slim laptops and netbooks, as well as in embedded SSDs for tablets and other mobile devices. It is also becoming increasingly popular in the desktop computer industry, thanks to its compactness and fast transfer speeds. This makes M.2 ideal for gaming PCs, workstations, and other demanding applications that require high levels of data throughput.