AMD’s Ryzen 9000X3D CPUs with “Zen 5 3D V-Cache” rumored to debut in Jan 2025

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AMD is gearing up to release its highly anticipated next-generation Ryzen 9000 processors, which are expected to bring significant performance improvements compared to the current Ryzen 7000 CPUs. These new processors will be based on the Zen 5 core architecture and manufactured using TSMC’s advanced 4nm/3nm process node.

While AMD has not officially announced the Ryzen 9000 chips, rumors have already started circulating about their 3D V-Cache variants. According to industry insiders, the Ryzen 9000X3D processors, featuring the innovative “Zen 5 3D V-Cache” technology, will be launched at CES 2025, scheduled to take place in January of that year.

The timing of the potential release of the 3D V-Cache variants aligns with the expected launch window of the standard Ryzen 9000 “Zen 5” CPUs, which is projected to be between June and September of 2024. If this holds true, a six-month gap between the two versions seems reasonable.

One of the reasons behind AMD’s introduction of the 3D V-Cache variants could be Intel’s upcoming 15th Gen Arrow Lake family, set to debut in late 2024. This new chip lineup represents Intel’s first major design overhaul in years, and it is likely that AMD would want to respond with a competitive offering featuring 3D-stacked technology.

While details about the Zen 5 core architecture are still scarce, some rumors suggest that it will focus on enhancing the front end, particularly the cache and integer pipeline. The existing Ryzen cores utilize a dated 4-way decoder, which Zen 5 is expected to improve upon. Speculations also point towards a branched frontend similar to Intel’s Atom cores and design choices reminiscent of the ill-fated Bulldozer architecture. However, these details remain vague and cryptic at this stage.

What we do know is that Zen 5 will feature a wider 8-way dispatch and retain the same 32KB L1 Instruction Cache. In terms of the backend, AMD is beefing up the integer execution capabilities by adding two more Arithmetic Logic Units (ALUs) and a wider unified scheduler. The load-store unit is also receiving enhancements. Another intriguing aspect of Zen 5 is the upgraded core interconnect, known as the Ladder L3 Fabric, which is expected to improve communication between cores.

According to AdoredTV, the Ryzen 9000 CPUs are already in mass production and should hit the retail market in the late summer months of 2024, specifically July or August. Good news for owners of 600-series motherboards, as these chipsets will be compatible with Zen 5 and at least two more generations of AMD processors.

As we eagerly await AMD’s official announcement and the subsequent release of the Ryzen 9000 processors, it’s clear that the company is continuing its commitment to pushing the boundaries of performance and innovation. With the Zen 5 architecture and the potential inclusion of 3D V-Cache technology, AMD is poised to deliver another lineup of CPUs that will undoubtedly excite enthusiasts and power users alike.

Background Information

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About AMD:

AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.

  

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

  

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

  

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Event Info

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About CES:

CES, the Consumer Electronics Show, is an annual event held in Las Vegas, Nevada, organized by the Consumer Technology Association (CTA). With a history dating back to 1967, it has become the world's premier platform for unveiling and exploring the latest innovations in consumer electronics and technology. Drawing exhibitors ranging from industry titans to startups across diverse sectors, including automotive, health and wellness, robotics, gaming, and artificial intelligence, CES transforms Las Vegas into a global tech hub, offering a glimpse into the future of technology through a wide array of showcases, from startup-focused Eureka Park to cutting-edge automotive and health tech exhibitions.

  

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