Intel Set to Mass Produce 15th Gen Arrow Lake CPUs on 2nm (20A) Process by 2024

Intel plans to revolutionize the world of CPUs with its upcoming 15th Gen Arrow Lake processors, utilizing 2nm (20A) technology and incorporating advanced features such as RibbonFET transistors and PowerVia for enhanced performance and efficiency.

Revolutionizing the world of CPUs with the 15th Gen Arrow Lake processors
Mass production using 2nm (20A) process by 2024
Incorporation of RibbonFET transistors for improved performance and efficiency

Intel is gearing up to revolutionize the world of CPUs with its upcoming 15th Gen Arrow Lake processors. The chipmaker plans to mass produce these powerful CPUs using the 2nm (20A) process by 2024. This move comes after the successful launch of the 1st Gen Core Ultra processors on the 4nm-class Intel 4 node, solidifying Intel’s commitment to maintaining its position as a leader in processor technology.

In an interview with Nikkei, Sanjay Natarajan, the Senior Vice President and Executive of Intel’s Technology Department, shed light on the company’s ambitious plans. The mass production of the 2nm-class 20A chips will mark a significant milestone for Intel, as it aims to further enhance yields and production capacity by utilizing EUV lithography. This technology has already proven its worth in the 4nm-class Intel 4 process and will continue to play a crucial role in the development of the 2nm chips.

One of the most exciting aspects of the 2nm (20A) process is the incorporation of RibbonFET transistors, also known as Gate All Around (GAA). These transistors are set to replace the current FinFET technology and are expected to deliver even better performance and efficiency. Intel is constantly pushing the boundaries of innovation, and the adoption of RibbonFET transistors in their 15th Gen Arrow Lake processors is a testament to their commitment to staying ahead of the curve.

To further optimize power and frequency, Intel has introduced PowerVia, a backside power delivery technology. Internal tests conducted by the chipmaker have shown that PowerVia can deliver more than a 5% improvement in frequency and over 90% cell density on Intel 4. This means that users can expect enhanced performance and efficiency from the upcoming Arrow Lake processors.

The first 20A chips are set to launch alongside the 15th Gen Arrow Lake processors in the latter half of 2024. This new generation of CPUs will be exclusively available to the 15th Gen client family, ensuring that users can experience the full potential of this technology.

While the 15th Gen Arrow Lake processors are stealing the spotlight, Intel has also revealed its plans for other processor families. The Granite Rapids and Sierra Forest families are expected to utilize Intel 3, while Clearwater Forest will make use of the 18A process. These upcoming releases demonstrate Intel’s commitment to providing a diverse range of processors to cater to different needs and requirements.

Intel’s announcement of mass producing 15th Gen Arrow Lake CPUs on the 2nm (20A) process marks an exciting chapter in the world of processor technology. With advancements in lithography, transistor technology, and power delivery, users can look forward to a new era of performance and efficiency. As Intel continues to push the boundaries of innovation, it is clear that the future of CPUs is in safe hands.

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

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Technology Explained

EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.