NVIDIA’s HBM3e Verification Nears Completion; HBM4 Launch Set for 2026

According to the latest research from TrendForce, nVidia is looking to diversify its suppliers in the High Bandwidth Memory (HBM) market to improve supply chain management. The company is expected to complete verification of Samsung’s HBM3 (24 GB) by December this year. The timeline for the progress of HBM3E shows that Micron provided samples to NVIDIA in July, followed by SK hynix in August, and Samsung in October. TrendForce predicts that some manufacturers may receive preliminary HBM3e results by the end of 2023, with definite results expected by the first quarter of 2024. These outcomes will influence NVIDIA’s procurement decisions for 2024.

As NVIDIA continues to dominate the high-end chip market, the company is expanding its lineup of advanced AI chips. In 2024, NVIDIA plans to introduce new models such as the H200, which will use 6 HBM3e chips, and the B100, which will use 8 HBM3e chips. The company will also integrate its own ARM-based CPUs and GPUs to launch the GH200 and GB200, offering more specialized and powerful AI solutions.

On the other hand, AMD’s focus for 2024 is on the MI300 series with HBM3, transitioning to HBM3e for the next-generation MI350. Intel Habana, on the other hand, launched the Gaudi 2 in the second half of 2022, which utilizes 6 HBM2E stacks. The upcoming Gaudi 3, expected in mid-2024, will continue to use HBM2E but will be upgraded to 8 stacks.

TrendForce believes that NVIDIA is well-positioned to maintain its leading position in the GPU segment and the competitive AI chip market due to its HBM specifications, product readiness, and strategic timeline.

Looking ahead, HBM4 is expected to launch in 2026 with enhanced specifications and performance tailored to future products from NVIDIA and other chip suppliers. HBM4 will be the first to use a 12 nm process wafer for its base die, supplied by foundries. This collaboration between foundries and memory suppliers reflects the evolving landscape of high-speed memory technology.

With the demand for higher computational performance, HBM4 will expand from the current 12-layer stacks to 16-layer stacks, driving the need for new hybrid bonding techniques. The market for HBM4 is also seeing a shift towards customization, with buyers seeking custom specifications and exploring options like stacking HBM directly on top of the System-on-Chip (SoC). This trend towards customization is expected to bring about unique design and pricing strategies, signaling a departure from traditional frameworks and ushering in a new era of specialized production in HBM technology.

Background Information

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About AMD:

AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.

  

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About ARM:

ARM, originally known as Acorn RISC Machine, is a British semiconductor and software design company that specializes in creating energy-efficient microprocessors, system-on-chip (SoC) designs, and related technologies. Founded in 1990, ARM has become a important player in the global semiconductor industry and is widely recognized for its contributions to mobile computing, embedded systems, and Internet of Things (IoT) devices. ARM's microprocessor designs are based on the Reduced Instruction Set Computing (RISC) architecture, which prioritizes simplicity and efficiency in instruction execution. This approach has enabled ARM to produce highly efficient and power-saving processors that are used in a vast array of devices, ranging from smartphones and tablets to IoT devices, smart TVs, and more. The company does not manufacture its own chips but licenses its processor designs and intellectual property to a wide range of manufacturers, including Qualcomm, Apple, Samsung, and NVIDIA, who then integrate ARM's technology into their own SoCs. This licensing model has contributed to ARM's widespread adoption and influence across various industries.

  

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About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

  

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About nVidia:

NVIDIA has firmly established itself as a leader in the realm of client computing, continuously pushing the boundaries of innovation in graphics and AI technologies. With a deep commitment to enhancing user experiences, NVIDIA's client computing business focuses on delivering solutions that power everything from gaming and creative workloads to enterprise applications. for its GeForce graphics cards, the company has redefined high-performance gaming, setting industry standards for realistic visuals, fluid frame rates, and immersive experiences. Complementing its gaming expertise, NVIDIA's Quadro and NVIDIA RTX graphics cards cater to professionals in design, content creation, and scientific fields, enabling real-time ray tracing and AI-driven workflows that elevate productivity and creativity to unprecedented heights. By seamlessly integrating graphics, AI, and software, NVIDIA continues to shape the landscape of client computing, fostering innovation and immersive interactions in a rapidly evolving digital world.

  

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About Samsung:

Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

  

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About SK hynix:

SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

  

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Technology Explained

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GPU: GPU stands for Graphics Processing Unit and is a specialized type of processor designed to handle graphics-intensive tasks. It is used in the computer industry to render images, videos, and 3D graphics. GPUs are used in gaming consoles, PCs, and mobile devices to provide a smooth and immersive gaming experience. They are also used in the medical field to create 3D models of organs and tissues, and in the automotive industry to create virtual prototypes of cars. GPUs are also used in the field of artificial intelligence to process large amounts of data and create complex models. GPUs are becoming increasingly important in the computer industry as they are able to process large amounts of data quickly and efficiently.

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HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

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SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.

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