Samsung introduces HBM3E ‘Shinebolt’ Memory, Revolutionizing AI Applications

Samsung Electronics recently held its Memory Tech Day 2023 event, where it launched a range of new innovations aimed at leading the hyperscale AI era. These innovations include the HBM3E Shinebolt, LPDDR5X CAMM2, and Detachable AutoSSD, all designed to accelerate innovation for future computing requirements.

One of the highlights of the event was the introduction of Samsung’s HBM3E DRAM, named Shinebolt. This next-generation memory technology is specifically designed to power next-generation AI applications, improving total cost of ownership and speeding up AI-model training and inference in data centers. With an impressive speed of 9.8 gigabits-per-second (Gbps) per pin, the HBM3E can achieve transfer rates exceeding 1.2 terabytes-per-second (TBps). Samsung has also optimized its non-conductive film (NCF) technology to enable higher layer stacks and improve thermal characteristics.

Samsung’s 8H and 12H HBM3 products are already in mass production, and samples of Shinebolt are already being shipped to customers. In addition to its memory solutions, Samsung plans to offer a custom turnkey service that combines next-generation HBM, advanced packaging technologies, and Foundry products.

The event also showcased other notable products, such as the industry’s highest-capacity 32Gb DDR5 DRAM, the industry’s first 32Gbps GDDR7, and the petabyte-scale PBSSD, which significantly boosts storage capabilities for server applications.

Recognizing the need for powerful form factors in processing data-intensive tasks, Samsung introduced a range of memory solutions that support high-performance, high-capacity, low-power, and small form factors at the edge. These solutions include the industry’s first 7.5Gbps LPDDR5X CAMM21, expected to revolutionize the next-generation PC and laptop DRAM market, as well as the 9.6Gbps LPDDR5X DRAM, LLW2 DRAM for on-device AI, next-generation Universal Flash Storage (UFS), and the high-capacity Quad-Level Cell (QLC) SSD BM9C1 for PCs.

In the automotive sector, Samsung presented its Detachable AutoSSD, which allows data access from a single SSD to multiple System on Chips (SoCs) through virtual storage. With a sequential read speed of up to 6,500 megabytes-per-second (MBps) and 4TB of capacity, the Detachable AutoSSD provides ease of upgrades and adjustments for vehicle users and manufacturers. Samsung also showcased other automotive memory solutions, including high-bandwidth GDDR7 and LPDDR5X with a more compact package size.

Samsung is also committed to minimizing environmental impact and highlighted various innovations within its semiconductor operations that contribute to increased energy efficiency. The company plans to develop ultra-low-power memory technologies to decrease power consumption in data centers, PCs, and mobile devices. Additionally, Samsung aims to use recycled materials in portable SSD products to reduce its carbon footprint. Its next-generation solutions, such as the PBSSD, will also help reduce energy usage for server systems by maximizing space efficiency and rack capacity.

Samsung’s semiconductor business is actively collaborating with stakeholders across the value chain to address global climate issues through its sustainability initiative, “technology that makes technology sustainable.”

Background Information

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About Samsung:

Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

  

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Technology Explained

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DDR5: DDR5 (Double Data Rate 5) is the next generation of memory technology for the computer industry. It is a modern day improvement on earlier DDR technologies, with faster speeds, greater bandwidth and higher capacities. DDR5 enables higher resolution, seamless gaming experiences and faster data transfer rates, making it an ideal choice for high-performance computing and 4K gaming. With its greater RAM compatibility, DDR5 provides faster buffering times and raised clock speeds, giving users an improved overall work system. DDR5 is also optimized for multi-tasking, allowing users to multitask without experiencing a significant drop in performance, increasing the productivity of digital tasks. As an ever-evolving technology, DDR5 is paving the way for the computer industry into a new and powerful era.

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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GDDR7: GDDR7 (Graphics Double Data Rate 7) is the seventh generation of graphics double data rate (GDDR) memory. It is a type of dynamic random-access memory (DRAM) that is specifically designed for use in graphics cards. GDDR7 memory offers a number of advantages over previous generations of GDDR memory. GDDR7 is a significant improvement over previous generations of GDDR memory. It offers faster speeds up to 32 gigabits per second (Gbps) per pin, lower power consumption, and improved error correction. This makes it ideal for use in high-performance graphics cards and other applications that require high bandwidth and low latency.

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HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

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LPDDR5X: LPDDR5X is a type of computer memory technology that is used in many modern computers. It stands for Low Power Double Data Rate 5X and is a type of Random Access Memory (RAM). It is designed to be more efficient than its predecessors, allowing for faster data transfer speeds and lower power consumption. This makes it ideal for use in laptops, tablets, and other mobile devices. It is also used in gaming consoles and other high-end computers. LPDDR5X is capable of transferring data at up to 8400 megabits per second, making it one of the fastest types of RAM available. This makes it ideal for applications that require high performance, such as gaming, video editing, and 3D rendering.

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SSD: A Solid State Drive (SSD) is a modern data storage device that employs flash memory technology to store data electronically. Unlike traditional hard disk drives (HDDs), SSDs have no moving parts, resulting in significantly faster read and write speeds. This leads to quicker boot times, faster application loading, and smoother overall system performance. SSDs are known for their durability, shock resistance, and energy efficiency, making them ideal for laptops, ultrabooks, and other portable devices. They come in various form factors, including 2.5-inch, M.2, and PCIe cards, and are favored for their reliability, quiet operation, and reduced heat generation

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