TSMC shows Innovation Poised to Revolutionize 3D IC Technology

TSMC has collaborated with its OIP ecosystem partners to introduce the 3Dblox 2.0 open standard and the 3DFabric Alliance, enabling customers to leverage process and 3DFabric technologies to achieve superior performance and power efficiency in next-generation applications.

TSMC launched the new 3Dblox 2.0 open standard, which aims to enhance design efficiency for 3D ICs.
TSMC's partnership with its OIP ecosystem partners allows customers to leverage the company's process and 3DFabric technologies to achieve superior performance and power efficiency in next-generation applications.
TSMC is addressing testing challenges through collaboration with automatic test equipment (ATE) partners Advantest and Teradyne.

TSMC, the leading semiconductor manufacturer, made some exciting announcements at the TSMC 2023 OIP Ecosystem Forum. The company launched the new 3Dblox 2.0 open standard, which aims to enhance design efficiency for 3D ICs. Additionally, TSMC highlighted the achievements of its 3DFabric Alliance, which focuses on integrating memory, Substrate, testing, manufacturing, and packaging technologies.

Dr. L.C. Lu, TSMC fellow and vice president of Design and Technology Platform, emphasized the importance of collaboration in the industry’s shift towards 3D IC and system-level innovation. TSMC’s partnership with its OIP ecosystem partners allows customers to leverage the company’s process and 3DFabric technologies to achieve superior performance and power efficiency in next-generation applications like artificial intelligence (AI), high-performance computing (HPC), and mobile devices.

One of TSMC’s key collaborators, AMD, praised the advanced 3D packaging technology developed by TSMC. This technology enables AMD’s next-generation MI300 accelerators to deliver exceptional performance, memory footprint, and bandwidth for AI and supercomputing workloads. The collaboration between TSMC and its 3DFabric Alliance partners has played a crucial role in accelerating time-to-market for AMD’s 3D chiplet product portfolio.

The 3Dblox open standard, introduced last year, has become a critical design enabler for future advancements in 3D ICs. With contributions from a vast ecosystem of companies, 3Dblox aims to modularize and streamline 3D IC design solutions. The newly launched 3Dblox 2.0 takes this a step further by offering innovative early design solutions for power and thermal feasibility studies. Designers can now simulate power and thermal aspects for the entire 3D system, allowing for better decision-making during the design process. The chiplet design reuse features, such as chiplet mirroring, further enhance design productivity.

To ensure widespread adoption and interoperability, TSMC has established the 3Dblox Committee as an independent standard group. This committee, in collaboration with key members like Ansys, Cadence, Siemens, and Synopsys, aims to create an industry-wide specification that enables system design with chiplets from any vendors. Designers can access the latest 3Dblox specifications from the 3dblox.org website and explore tool implementations by EDA partners.

TSMC’s 3DFabric Alliance has experienced significant growth over the past year. This alliance brings together 21 partners from across the industry to collaborate and innovate in various areas of semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.

In terms of memory collaboration, TSMC has worked closely with key partners like Micron, Samsung Memory, and SK hynix to advance generative AI systems by delivering more memory capacity. This collaboration has focused on driving growth in HBM3 and HBM3E, which offer higher SRAM memory and DRAM memory bandwidth.

In substrate collaboration, TSMC has successfully worked with partners IBIDEN and UMTC to define a Substrate Design Tech file. This file facilitates substrate auto-routing, leading to significant efficiency and productivity gains. TSMC is also collaborating with substrate and EDA partners to achieve 10x productivity gains from automatic substrate routing. Additionally, the collaboration includes design for manufacturing (DFM) enhancement rules to reduce stress hotspots in substrate design.

TSMC is addressing testing challenges through collaboration with automatic test equipment (ATE) partners Advantest and Teradyne. The goal is to minimize yield loss and improve power delivery efficiency for chiplet testing. To achieve a 10x testing productivity boost, TSMC is working with Synopsys and ATE partners on a silicon demonstrator that enables high-speed test access for 3D stack testing through a functional interface. The company is also collaborating with all design-for-test (DFT) EDA partners to ensure effective and efficient interface testing.

TSMC’s commitment to collaboration and innovation is evident in its efforts to make 3D ICs and advanced packaging technologies more accessible to customers. With the introduction of the 3Dblox 2.0 open standard and the achievements of the 3DFabric Alliance, TSMC continues to push the boundaries of 3D IC innovation, empowering designers to unlock new levels of performance and power efficiency in their next-generation applications.

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Background Information

About AMD: AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.

About Samsung: Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

About SK hynix: SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

About Synopsys: Synopsys is a important American software company that specializes in electronic design automation (EDA) and semiconductor intellectual property. Founded in 1986, Synopsys provides tools and solutions for designing and testing complex integrated circuits and electronic systems. Their software aids in the development of semiconductors, electronic products, and software applications, playing a crucial role in advancing technological innovation across various industries. For more detailed information about their products and contributions, you can visit their official website at

About TSMC: TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

Technology Explained

chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

EDA: EDA stands for Electronic Design Automation, and it refers to a category of software tools and solutions used in the design and development of electronic systems and integrated circuits. EDA tools assist engineers and designers in creating complex electronic designs, from individual components to entire systems, by automating various aspects of the design process. These tools encompass a wide range of functionalities, including schematic capture, simulation, layout design, verification, and testing.

HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

Substrate: The technology substrate is a layer of material that provides a foundation for the components of a computer system. It is the foundation upon which the components of a computer system are built. It is usually made of a material such as silicon, which is a semiconductor material. The technology substrate is used to create the circuits and pathways that allow the components of a computer system to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components. The technology substrate is essential for the functioning of a computer system, as it provides the necessary pathways for the components to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components.