Synopsys and TSMC Collaborate to Simplify Multi-Die System Complexity on TSMC N3E Process

Synopsys and TSMC have collaborated to provide a powerful and comprehensive solution for multi-die system designs, including the 3DIC Compiler platform, UCIe PHY IP, and HBM3 IP, enabling designers to achieve higher productivity and lower integration risks.

Achievement of first-pass silicon success for Synopsys' Universal Chiplet Interconnect Express (UCIe) IP on TSMC's leading N3E process.
Integration of Synopsys' 3DIC Compiler and Ansys' multi-physics analysis technologies delivers signoff accuracy for system-level effects.
Complete IP solution for HBM3, addressing the high memory bandwidth requirements of multi-die systems.

In an exciting development for the world of multi-die system designs, Synopsys, Inc. has announced an extension of its collaboration with TSMC. This collaboration aims to advance the field by supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies. The result is the Synopsys Multi-Die System solution, which includes the powerful 3DIC Compiler platform.

The 3DIC Compiler is a unified exploration-to-signoff platform that offers designers unparalleled levels of design efficiency in terms of capacity and performance. With this solution, designers can explore, analyze, and sign off on multi-die system designs in a unified platform. This streamlines the design process from early architecture all the way to manufacturing.

One of the highlights of this collaboration is the achievement of first-pass silicon success for Synopsys’ Universal chiplet Interconnect Express (UCIe) IP on TSMC’s leading N3E process. This achievement allows for seamless die-to-die connectivity, a crucial aspect of multi-die system design. By integrating the UCIe PHY IP into their designs, designers can benefit from maximum power efficiency and performance at speeds of up to 16 Gbps, scalable to 24 Gbps.

The collaboration between Synopsys and TSMC has been highly beneficial for designers in various industries, including high-performance computing, data centers, and automotive applications. By leveraging the comprehensive and scalable solution provided by Synopsys and TSMC, designers can achieve unprecedented levels of performance and efficiency in their multi-die system designs.

Furthermore, Synopsys’ 3DIC Compiler is certified by TSMC and enables full-stack designs using the 3Dblox 2.0 standard and 3DFabric technologies. This platform allows for die/package exploration, co-design, and analysis, all within a unified environment. The integrated system analysis capability of the 3DIC Compiler enables designers to co-optimize thermal and power integrity, ensuring design feasibility.

To further enhance the accuracy of system-level effects, Synopsys continues to collaborate with Ansys. The integration of Synopsys’ 3DIC Compiler and Ansys’ multi-physics analysis technologies delivers signoff accuracy for system-level effects, providing designers with a comprehensive solution.

In addition to the UCIe PHY IP, Synopsys also offers a complete IP solution for HBM3, addressing the high memory bandwidth requirements of multi-die systems. This complete solution includes the UCIe controller, PHY, and verification IP, along with test, repair, and monitoring capabilities to ensure system reliability.

Overall, the collaboration between Synopsys and TSMC has resulted in a powerful and comprehensive solution for multi-die system designs. By leveraging the capabilities of the 3DIC Compiler and the UCIe PHY IP, designers can achieve higher productivity and lower integration risks. The availability of these solutions on TSMC processes further enhances their accessibility to designers in various industries.

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Background Information

About Synopsys:

Synopsys is a important American software company that specializes in electronic design automation (EDA) and semiconductor intellectual property. Founded in 1986, Synopsys provides tools and solutions for designing and testing complex integrated circuits and electronic systems. Their software aids in the development of semiconductors, electronic products, and software applications, playing a crucial role in advancing technological innovation across various industries. For more detailed information about their products and contributions, you can visit their official website at

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About TSMC:

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

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Technology Explained

chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.