SK hynix begins HBM3E volume production for NVIDIA GH200 Grace Hopper.

. SK hynix Inc. has successfully developed HBM3E, the highest-specification DRAM for AI applications, offering industry-leading performance, capacity, heat dissipation, and user-friendliness.

HBM3E offers industry-leading speed of up to 1.15 terabytes per second
Advanced Mass Reflow Molded Underfill (MR-MUF) technology for 10% improvement in heat dissipation
Backward compatibility, allowing for easy adoption onto existing systems

SK hynix Develops World’s Best Performing HBM3E, Provides Samples to Customer for Performance Evaluation

SK hynix Inc. announced today the successful development of HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available. The company is currently undergoing a customer evaluation of samples.

HBM3E not only meets the industry’s highest standards of speed, but also excels in capacity, heat dissipation, and user-friendliness. With a processing speed of up to 1.15 terabytes per second, HBM3E can handle data equivalent to more than 230 Full-HD movies of 5GB each in just one second.

In addition, HBM3E incorporates the technology of Advanced Mass Reflow Molded Underfill (MR-MUF), resulting in a 10% improvement in heat dissipation. It also offers backward compatibility, allowing for easy adoption onto existing systems without the need for design or structure modifications.

“We have a long history of working with SK hynix on High Bandwidth Memory for leading edge accelerated computing solutions,” said Ian Buck, Vice President of Hyperscale and HPC Computing at nVidia. “We look forward to continuing our collaboration with HBM3E to deliver the next generation of AI computing.”

Sungsoo Ryu, Head of DRAM Product Planning at SK hynix, emphasized that the development of HBM3E strengthens the company’s market leadership and enhances the completeness of their HBM product lineup. As the demand for AI technology continues to grow, SK hynix aims to increase the supply share of high-value HBM products and achieve a fast business turnaround.

This latest development from SK hynix showcases their commitment to driving AI tech innovation with industry-leading performance. With the launch of HBM3E in 1H24, SK hynix solidifies its unrivaled leadership in the AI memory market, building on the success of HBM3. The expansion of HBM3E supply, following the industry’s largest scale of mass production of HBM, will further accelerate business growth.

This article is based on information by Videocardz.com

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Background Information

About nVidia:

NVIDIA has firmly established itself as a leader in the realm of client computing, continuously pushing the boundaries of innovation in graphics and AI technologies. With a deep commitment to enhancing user experiences, NVIDIA's client computing business focuses on delivering solutions that power everything from gaming and creative workloads to enterprise applications. for its GeForce graphics cards, the company has redefined high-performance gaming, setting industry standards for realistic visuals, fluid frame rates, and immersive experiences. Complementing its gaming expertise, NVIDIA's Quadro and NVIDIA RTX graphics cards cater to professionals in design, content creation, and scientific fields, enabling real-time ray tracing and AI-driven workflows that elevate productivity and creativity to unprecedented heights. By seamlessly integrating graphics, AI, and software, NVIDIA continues to shape the landscape of client computing, fostering innovation and immersive interactions in a rapidly evolving digital world.

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About SK hynix:

SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

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Technology Explained

HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.