TSMC

TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a prominent player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its cutting-edge semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

December 2024

10 DecemberLattice Expands Low-Power FPGA Lineup with New Small and Mid-Range Options

10 DecemberTSMC’s November 2024 Revenue Surges 34% Year-Over-Year, Reflecting Industry Trends

6 DecemberBroadcom introduces 3.5D F2F Tech for Next-Gen AI Processing Units

2 DecemberSnapdragon 8 Elite Gen 2 releases HyperOS 2 Source Code Surge

November 2024

7 NovemberM31 introduces USB4 IP Designed for TSMC’s Advanced 5nm Process

October 2024

30 OctoberHBM5 20hi Stack Embraces Hybrid Bonding, Shaping Future Business Strategies

30 OctoberOpenAI and Broadcom Collaborate to Develop Specialized AI Chip

28 OctoberSamsung and Apple reportedly eyeing Intel acquisition, potential tech industry shakeup.

22 OctoberDeepComputing and Andes Team Up for Innovative RISC-V AI PC with Ubuntu Desktop

21 OctoberTSMC’s CoWoS Capacity Doubles Over Two Years, Yet Demand Outpaces Supply: TrendForce

17 OctoberTSMC’s Q3 Earnings Reveal Strong Margins Ahead of 2024 Projections

14 OctoberCredo introduces PCIe 6/7 and CXL 3.x Retimers at OCP Summit 2024

12 OctoberCOLORFUL introduces Vibrant Intel Z890 Motherboard Lineup for the Intel Core Ultra 200...

11 OctoberCOLORFUL introduces New Intel Z890 Motherboards for Core Ultra 200 Series

9 OctoberMediaTek introduces Dimensity 9400: A New Era for Flagship SoCs with Big Core Design

9 OctoberNVIDIA’s cuLitho Platform Enters Production Phase at TSMC, Advancing Lithography...

5 OctoberAmkor and TSMC Strengthen Ties for Advanced Packaging Collaboration in Arizona

September 2024

27 SeptemberSynopsys and TSMC Collaborate on Next-Gen AI and Multi-Die Chip Innovations

6 SeptemberMicron introduces 12-High HBM3E Memory: 36 GB Capacity, 1.2 TB/s Bandwidth

August 2024

27 AugustFuriosaAI Introduces Energy-Efficient RNGD AI Processor at Hot Chips 2024

11 AugustAmkor and SKhynix Secure $1.5B Deals for Chip Packaging Plants, Boosting U.S. Tech...

6 AugustSilicon Motion introduces Power-Saving PCIe Gen 5 SSD Controller for Enhanced Performance

5 AugustSilicon Motion introduces PCIe Gen 5 SSD Controller for Superior Performance Efficiency

July 2024

30 JulyAlphawave Semi pioneers 3nm UCIe IP, revolutionizing with TSMC CoWoS packaging.

22 JulyAvnet ASIC Team introduces Ultra-Low-Power Design Services for TSMC’s 4nm Nodes

17 JulyAI Server Demand Surge to Propel 2024 Market Value to $187B; Dominates Server Market

9 JulyApplied Materials Reveals Chip Wiring Advances for Greener Computing

4 JulyAMD and NVIDIA Fuel FOPLP Development, Mass Production Set for 2027-2028

June 2024

18 JuneSemiconductor Fab Capacity Set to Surge: 6% Growth in 2024, 7% in 2025

8 JuneIntel’s P-Core Architectures Compared: Skylake, Sunny Cove, Golden Cove, Redwood...

6 JuneTaiwanese Chipmakers Seize Global Opportunities Amidst Shifting Geopolitics and...

5 JuneIntel’s Panther Lake shines at Computex 2024, while Intel gears up for 18A wafer...

4 JuneIntel Introduces Lunar Lake Architecture: Enhanced P and E Cores, Xe2-LPG Graphics,...

3 JuneAMD introduces Zen 5-powered EPYC “Turin” CPUs: Boasting 192 Cores, Arriving...

3 JuneAMD Introduces Ryzen 9000 Processors for Desktop, Zen 5 Steals Spotlight at Computex 2024

May 2024

31 MayTSMC’s 3D Stacked SoIC Packaging Advances Rapidly, Aims for Ultra-Dense 3μm Pitch...

31 MayTSMC Nears 2nm Milestone: On Track for Mass Production in 2025

30 MayBlackwell Shipments Set to Boost CoWoS Capacity, Anticipated 70% Surge by 2025

25 MayRapidus Incorporates Chip Packaging Services into $32B 2nm Fab Blueprint

24 MayIntel’s 2024 CPU Roadmap: Lunar Lake & Arrow Lake Forge Path to Innovation

23 MayTSMC introduces Future Roadmap: N3X, N2P, A16 Set to Debut in 2025/2026

23 MayTSMC introduces ‘Global Gigafab’ Program, Provides Glimpse into Revolutionary...

19 MayLeaked: Intel’s Lunar Lake-Powered Handheld Gaming PC Boasts Impressive 1200p...

17 MayTSMC’s EUV Triumph: Amplifying Tools, Boosting Wafers, and Unmatched Pellicles

17 MayTSMC’s Specialized Capacity to Surge by 50%, Unveiling 4nm N4e Low-Power Node

16 MayTSMC Prepares Next-Gen HBM4 Base Dies, Leveraging 12nm and 5nm Nodes

16 MayTSMC’s 3nm N3P Process Aims for Mass Production in 2022, Promising Enhanced...

16 MayAMD Zen 6 Embraces TSMC’s 2nm Process: Unveiling Standard, Dense Classic &...

12 MayApple introduces M4 SoC for 2024 iPad Pro: A Technological Marvel Emerges

11 MayIntel’s 15th Gen CPUs: Unveiling 3 Intriguing Architectures Within a Single...

11 MayIntel introduces Arrow Lake Specs: Core Ultra 9 285K, Core Ultra 7 265K, and Core Ultra 5...

2 MaySamsung’s Latest Foundry Update: June Reveal of 2nm, Production of Second-Gen SF3...

2 MayIntel’s 15th Gen Arrow Lake CPUs Launched: Introducing Core Ultra 9 285K, Ultra 7...

April 2024

30 AprilTSMC Prepares Massive 8x Reticle Super Carrier Interposer for Next-Gen Chips,...

30 AprilIntel’s 15th Gen Core i5-15400F (Core Ultra 5 240F) Specs Leak: A Glimpse into...

29 AprilTSMC introduces Affordable 4nm N4C Process, Targeting 8.5% Cost Cut by 2025

28 AprilTSMC Ventures into Silicon Photonics, introduces 12.8 Tbps COUPE On-Package Interconnect...

27 AprilTSMC introduces CoW-SoW: A 3D System-on-Wafer Platform for Stacked Chip Innovation

26 AprilTSMC’s 30th North America Technology Symposium: Silicon Leadership Empowers AI...

26 AprilTSMC introduces 1.6nm Tech for Late 2026: A16 Empowered by “Super Power Rail”