Intel Introduces Cutting-Edge Glass Substrates to Satisfy Growing Compute Needs

Intel has unveiled one of the industry's first glass substrates, a breakthrough achievement that will revolutionize the scaling of transistors in a package and propel Moore's Law forward to enable data-centric applications.

Glass substrates offer unique properties such as ultra-low flatness, improved thermal and mechanical stability, and higher interconnect density.
Glass substrates possess superior mechanical, physical, and optical properties that allow for more transistors to be connected in a package.
Glass substrates enable a 10x increase in interconnect density and allow for ultra-large form-factor packages with high assembly yields.

Intel has made a significant announcement in the world of advanced packaging with the introduction of one of the industry’s first glass Substrate. This breakthrough achievement is set to revolutionize the scaling of transistors in a package and propel Moore’s Law forward to enable data-centric applications.

Compared to the organic substrates currently in use, glass offers unique properties such as ultra-low flatness, improved thermal and mechanical stability, and higher interconnect density. These advantages will empower chip architects to create high-density, high-performance chip packages for data-intensive workloads like artificial intelligence.

The semiconductor industry is approaching its limits in scaling transistors on silicon packages using organic materials. These materials consume more power and come with limitations such as shrinkage and warping. Scaling is crucial for the progress of the semiconductor industry, and glass substrates present a viable and essential next step for the future of semiconductors.

Glass substrates possess superior mechanical, physical, and optical properties that allow for more transistors to be connected in a package, enabling better scaling and assembly of larger chiplet complexes. Chip architects will have the flexibility to pack more chiplets in a smaller footprint on one package, achieving performance and density gains while reducing overall cost and power usage.

Glass substrates will initially find their place in applications and workloads that require larger form factor packages, such as data centers, AI, and graphics. With their ability to tolerate higher temperatures, offer reduced pattern distortion, and provide ultra-low flatness, glass substrates bring significant benefits. They enable a 10x increase in interconnect density and allow for ultra-large form-factor packages with high assembly yields.

The tolerance to higher temperatures also gives chip architects the flexibility to set design rules for power delivery and signal routing. This opens up possibilities for seamless integration of optical interconnects and embedding inductors and capacitors into the glass at higher temperature processing. The result is better power delivery solutions and high-speed signaling at lower power.

Intel has been researching and evaluating the reliability of glass substrates for over a decade. The company has a strong track record in enabling next-generation packaging, having led the industry in various transitions and innovations. Intel’s ongoing innovation in advanced packaging, including glass substrates, is part of its commitment to achieving 1 trillion transistors on a package by 2030.

With recent breakthroughs like PowerVia and RibbonFET, Intel is demonstrating its forward focus and vision for the future of computing beyond the Intel 18A process node. The introduction of industry-leading glass substrates for advanced packaging is a testament to Intel’s dedication to pushing the boundaries of technology.

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Background Information

About Intel: Intel Corporation, a global technology leader, is renowned for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of groundbreaking advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

Technology Explained

chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

Substrate: The technology substrate is a layer of material that provides a foundation for the components of a computer system. It is the foundation upon which the components of a computer system are built. It is usually made of a material such as silicon, which is a semiconductor material. The technology substrate is used to create the circuits and pathways that allow the components of a computer system to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components. The technology substrate is essential for the functioning of a computer system, as it provides the necessary pathways for the components to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components.