Blue Cheetah introduces High-Performance Chiplet Interconnect IP via Samsung’s SF4X Process

Blue Cheetah Takes a Leap with BlueLynx PHY

In a bold move that’s sure to shake up the chip design landscape, Blue Cheetah Analog Design has just launched the successful tape-outs of its next-gen BlueLynx die-to-die (D2D) PHY. This latest innovation, crafted using Samsung Foundry’s SF4X 4 nm manufacturing process, is making waves with its impressive capabilities. Imagine a chiplet technology that can handle over 100 Tbps of aggregate throughput while keeping its silicon footprint and power consumption in check. Sounds impressive, right?

Flexibility Meets Performance

What’s particularly exciting about the BlueLynx D2D subsystem IP is its ability to cater to both advanced and standard chiplet packaging. This flexibility is a game-changer for chip architects who are constantly juggling the demands of bandwidth density and environmental robustness. The goal? Ensuring that their designs are not just theoretical but ready for real-world production. With the BlueLynx PHY, they can adapt their designs to various use cases without missing a beat.

And here’s where things get even more interesting: the BlueLynx PHY supports both standard 2D and advanced 2.5D packages. This means system designers can easily switch packaging technologies for current and future projects. It’s like having a Swiss Army knife for chip design—a tool that evolves with your needs.

What’s Next for Blue Cheetah?

Looking ahead, deliveries to customers began in 2024, with silicon characterization for both advanced and standard packaging expected to kick off in early Q2 2025. This timeline is crucial for companies eager to get their hands on customizable IP solutions that are already stirring up sectors like AI/ML, high-performance computing, networking, and mobile applications. Blue Cheetah’s products are designed for advanced process nodes, ensuring they remain at the forefront of technology.

Moreover, the BlueLynx PHY solutions are compatible with Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project (OCP) Bunch of Wires (BoW) interfaces. And if you’re wondering about connectivity, there’s an optional link layer that connects to on-die buses and Networks-on-Chip (NoCs) using various standards, including AXI4, AXI5 Lite, ACE, and CHI. The versatility here is impressive!

Industry Leaders Weigh In

Ben Hyo Gyuem Rhew, vice president and head of the IP Development Team at Samsung Electronics, emphasized the significance of this partnership, stating, “Samsung Electronics offers a robust portfolio of advanced foundry process technologies optimized for generative AI and HPC chips.” He highlighted how Blue Cheetah’s BlueLynx PHY technology empowers customers to unlock the full potential of their chiplet-based designs, accelerating time to market with silicon-proven IP.

Elad Alon, Blue Cheetah’s CEO and co-founder, echoed this sentiment, saying, “Die-to-die interconnect technology is a crucial component of any chiplet design.” His enthusiasm for the customizable, state-of-the-art interconnect solutions on Samsung’s advanced logic process nodes is palpable. It’s clear that both companies are poised to make significant strides in the chip design arena.

The Future is Bright

As we look ahead, it’s evident that the collaboration between Blue Cheetah and Samsung is not just about technology; it’s about shaping the future of chip design. With innovations like the BlueLynx PHY, we’re witnessing a pivotal moment in the industry—one that promises to enhance performance, flexibility, and efficiency. So, what do you think? Are we on the brink of a new era in chiplet technology? Only time will tell, but one thing is for sure: the future looks bright.

Background Information

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About Samsung:

Samsung, a South Korean multinational conglomerate, has established itself as a global leader in various industries, including electronics, technology, and more. Founded in 1938, Samsung's influence spans from smartphones and consumer electronics to semiconductors and home appliances. With a commitment to innovation, Samsung has contributed products like the Galaxy series of smartphones, QLED TVs, and SSDs that have revolutionized the way we live and work.

  

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Technology Explained

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.

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