SK hynix CEO Kwak Noh-Jung shared exciting developments at the SK AI Summit, including the world's first 48 GB 16-high HBM3E memory and their ambitious vision to become a "Full Stack AI Memory Provider," showcasing their commitment to technological stability and redefining what's possible in memory technology for the future of AI.
- World's first 48 GB 16-high HBM3E memory
- SK hynix's ambitious vision to become a "Full Stack AI Memory Provider"
- Advancements in AI will expand memory into realms of "creativity and experience"
At the recent SK AI Summit in Seoul, SK hynix CEO Kwak Noh-Jung took the stage and dropped some serious knowledge bombs about the future of memory technology. His keynote, aptly titled “A New Journey in Next-Generation AI Memory: Beyond Hardware to Daily Life,” highlighted an exciting development: the world’s first 48 GB 16-high HBM3E memory. Yes, that’s right—the highest number of layers ever achieved! This innovation is a leap forward from their previous 12-high products, and it’s all part of SK hynix’s ambitious vision to become a “Full Stack AI Memory Provider.”
But what does that even mean? Essentially, they want to offer a comprehensive suite of memory products that span both DRAM and NAND technologies, all while collaborating closely with partners in the industry. It’s a bold move that could reshape how we think about memory and its role in our daily lives.
Kwak pointed out that memory has evolved significantly. Remember when it was all about storing data on personal computers or smartphones? Those days are long gone. We’ve entered a “connected” era, thanks to cloud services and social media. But the future looks even brighter. With advancements in AI, memory will expand into realms of “creativity and experience.” Imagine a world where memory isn’t just about storage but also about enhancing our creative processes and experiences in real time. Sounds exciting, right?
To make this “Creative Memory” a reality, SK hynix is banking on next-generation semiconductor memory that can handle robust computing power. They’re not just resting on their laurels, either. Kwak revealed that the company has been working on several “World First” products, aiming for products that are not just the best but also “Beyond Best.” This means they’re focused on “Optimal Innovation” tailored for the AI era.
Looking ahead, the market for 16-high HBM is expected to kick off with the HBM4 generation, but SK hynix is already ahead of the game with their 48 GB 16-high HBM3E. They plan to roll out samples to customers early next year, showcasing their commitment to technological stability. They’re also utilizing an Advanced MR-MUF process, which was key in mass-producing their 12-high products, and are developing hybrid bonding technology as a backup.
What’s more, these 16-high products are no slouches when it comes to performance. They boast an impressive 18% improvement in training and a whopping 32% boost in inference compared to their 12-high counterparts. With the market for AI accelerators expected to grow, these advancements could solidify SK hynix’s position as a leader in AI memory.
The company isn’t stopping there, either. They’re working on the LPCAMM2 module for PCs and data centers, along with low-power, high-performance LPDDR5 and LPDDR6 chips. And let’s not forget about their plans for a PCIe 6th generation SSD and high-capacity QLC-based eSSD. It’s clear that SK hynix is on a mission to redefine what’s possible in memory technology.
In a significant move, they’re also collaborating with a top global logic Foundry to adopt a logic process for the HBM4 generation. This partnership aims to deliver customized HBM products that meet diverse customer demands for capacity, bandwidth, and functionality. It’s all about paving the way for a new paradigm in AI memory.
As AI systems require increasingly larger memory capacities, SK hynix is preparing CXL Fabrics to connect various memories, enabling high capacity in servers. They’re also developing ultra-high-capacity eSSD solutions that allow for more data in less space—all while consuming less power.
And here’s where it gets really interesting: SK hynix is working on technologies that integrate computational functions into memory. This could help tackle the so-called “memory wall,” a bottleneck that limits performance in data processing. Innovations like Processing Near Memory (PNM), Processing in Memory (PIM), and Computational Storage are set to transform the structure of next-generation AI systems.
So, what does all this mean for the future of AI? If SK hynix has its way, we’re looking at a landscape where memory isn’t just a passive storage solution but an active participant in the creative and processing tasks of tomorrow’s AI-driven world. It’s a thrilling time for tech enthusiasts, and we can’t wait to see how these advancements unfold. What do you think? Are we ready for a memory revolution?
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Background Information
About SK hynix:
SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.
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Technology Explained
Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).
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HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.
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LPDDR5: LPDDR5 is a type of computer memory technology that is used in many modern computers. It stands for Low Power Double Data Rate 5 and is the latest version of the LPDDR memory standard. It is a type of dynamic random access memory (DRAM) that is designed to be more power efficient than its predecessors. It is used in many modern laptops, tablets, and smartphones to provide faster performance and longer battery life. LPDDR5 is also used in some high-end gaming PCs and workstations to provide faster loading times and smoother gaming experiences. It is also used in some servers and data centers to provide faster data processing and storage.
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NAND: NAND technology is a type of non-volatile memory that is used in many computer applications. It is a type of flash memory that is used to store data in a non-volatile manner, meaning that the data is not lost when the power is turned off. NAND technology is used in many computer applications, such as solid-state drives, USB flash drives, digital cameras, and memory cards. It is also used in many embedded systems, such as cell phones, tablets, and other consumer electronics. NAND technology is a reliable and cost-effective way to store data, making it a popular choice for many computer applications.
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PCIe: PCIe (Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard for connecting components such as graphics cards, sound cards, and network cards to a motherboard. It is the most widely used interface in the computer industry today, and is used in both desktop and laptop computers. PCIe is capable of providing up to 16 times the bandwidth of the older PCI standard, allowing for faster data transfer speeds and improved performance. It is also used in a variety of other applications, such as storage, networking, and communications. PCIe is an essential component of modern computing, and its applications are only expected to grow in the future.
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SSD: A Solid State Drive (SSD) is a modern data storage device that employs flash memory technology to store data electronically. Unlike traditional hard disk drives (HDDs), SSDs have no moving parts, resulting in significantly faster read and write speeds. This leads to quicker boot times, faster application loading, and smoother overall system performance. SSDs are known for their durability, shock resistance, and energy efficiency, making them ideal for laptops, ultrabooks, and other portable devices. They come in various form factors, including 2.5-inch, M.2, and PCIe cards, and are favored for their reliability, quiet operation, and reduced heat generation
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