VIA introduces Three Platforms Empowering Advanced Edge AI Capabilities


August 1, 2024 by our News Team

VIA Technologies, Inc. has launched its latest lineup of edge AI solutions, including the SOM-5000, VAB-5000, and ARTiGO A5000, which offer advanced processing capabilities, versatile connectivity options, and compact form factors for a wide range of industrial, commercial, and consumer applications.

  • Advanced processing capabilities for efficient edge AI tasks
  • Versatile connectivity options for seamless integration
  • Compact form factors for easy deployment in various industries


VIA Technologies, Inc., the innovator in embedded platforms and systems, has just launched its latest lineup of edge AI solutions: the SOM-5000, VAB-5000, and ARTiGO A5000. These powerful platforms are specifically designed to cater to the growing demand for intelligent edge computing in a wide range of industrial, commercial, and consumer applications.

Epan Wu, the General Manager of VIA Intelligent Solutions, couldn’t contain his excitement about these new platforms, stating, “These new platforms represent a significant leap forward in edge AI technology. With their advanced processing capabilities and versatile connectivity options, the SOM-5000, VAB-5000, and ARTiGO A5000 enable our customers to develop innovative and efficient edge AI applications.”

Let’s take a closer look at each of these solutions and see what they bring to the table.

First up, we have the VIA SOM-5000, a fanless system-on-module that packs a punch when it comes to advanced edge AI applications. Powered by the MediaTek Genio 700 Octa-Core SoC, this module boasts an integrated AI processor that ensures high-efficiency edge AI tasks. It also supports 4K hardware-accelerated H.265/H.264 video processing, dual displays, and dual MIPI CSI-2 cameras. And if that’s not enough, it even offers optional 4G LTE mobile broadband with onboard M.2 and SIM card slots, taking connectivity to a whole new level.

Next in line is the VIA VAB-5000, a versatile Pico-ITX board that’s tailor-made for flexible Edge AI deployments. Equipped with the MediaTek Genio 700 Octa-Core SoC, this board features the MediaTek Deep Learning Accelerator 3.0 and Vision Processor 6 APU for advanced AI processing. It also supports 4K hardware-accelerated H.265/H.264 video encoding and decoding, making it a powerhouse for multimedia applications. With compatibility for MIPI CSI, AHD cameras, and eDP/LVDS displays, as well as a 40-pin Raspberry Pi-type GPIO header for extensive I/O options, the VAB-5000 is a force to be reckoned with.

Last but certainly not least, we have the VIA ARTiGO A5000, an ultra-compact system that’s perfect for edge AI applications. Powered by the MediaTek Genio 700 Octa-Core processor, this tiny device doesn’t compromise on performance. It offers an integrated AI processor for sophisticated edge AI applications, 4K hardware-accelerated H.265/H.264 video encoding and decoding, and dual-band Wi-Fi 6 and Bluetooth 5.2 for robust connectivity. And with HDMI, USB 3.1, and a MicroSD card slot, the ARTiGO A5000 ensures that you have all the I/O options you need in a compact package.

These three new edge AI solutions from VIA Technologies are certainly pushing the boundaries of what’s possible in the world of edge computing. With their impressive processing capabilities, versatile connectivity options, and compact form factors, they are poised to revolutionize a wide range of industries.

So, whether you’re in the industrial, commercial, or consumer space, it’s time to embrace the future of edge AI with VIA’s SOM-5000, VAB-5000, and ARTiGO A5000. Get ready to unlock a whole new level of innovation and efficiency in your edge AI applications. The possibilities are endless!

VIA introduces Three Platforms Empowering Advanced Edge AI Capabilities

VIA introduces Three Platforms Empowering Advanced Edge AI Capabilities

VIA introduces Three Platforms Empowering Advanced Edge AI Capabilities

VIA introduces Three Platforms Empowering Advanced Edge AI Capabilities

VIA introduces Three Platforms Empowering Advanced Edge AI Capabilities

VIA introduces Three Platforms Empowering Advanced Edge AI Capabilities

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Background Information


About MediaTek:

MediaTek Inc. is a Taiwanese semiconductor company that designs and manufactures a wide range of system-on-chip (SoC) solutions for various consumer electronics, including smartphones, tablets, smart TVs, wearables, and IoT (Internet of Things) devices. Founded in 1997, MediaTek has become a important player in the semiconductor industry, known for its innovative chipsets that offer a balance of performance, power efficiency, and affordability.

MediaTek website  MediaTek LinkedIn
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About VIA Technologies:

VIA Technologies, Inc. is a global leader in connecting businesses to advanced AI, IoT, and computer vision technology with intelligent automotive, edge, industrial, and building solutions that transform operational safety and efficiency. Headquartered in Taipei, Taiwan, VIA has a global network that links the high-tech centers of the US, Asia, and Europe and spans a customer base that includes many of the world’s leading hi-tech, manufacturing, and transportation enterprises

VIA Technologies website
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Technology Explained


APU: An APU, or Accelerated Processing Unit, is a type of processor that combines a CPU and a GPU on a single chip. This type of processor is becoming increasingly popular in the computer industry due to its ability to provide both computing and graphics processing power in a single package. APUs are used in a variety of applications, from gaming PCs to high-end workstations. They are also used in embedded systems, such as those found in smartphones and tablets. The combination of CPU and GPU on a single chip allows for more efficient power consumption and better performance than traditional CPUs. Additionally, APUs are often used in conjunction with other components, such as RAM and storage, to create powerful and efficient systems.

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ITX: ITX (Information Technology eXtended) is a form factor for motherboards and other computer components. It is a small form factor that is designed to be more compact than traditional ATX motherboards. ITX motherboards are typically used in small form factor PCs, such as those used in home theater PCs, media centers, and other small form factor applications. ITX motherboards are also used in embedded systems, such as those used in industrial automation, medical equipment, and other embedded applications. ITX motherboards offer a number of advantages over traditional ATX motherboards, such as lower power consumption, smaller size, and improved cooling. Additionally, ITX motherboards are often more affordable than their ATX counterparts, making them a popular choice for budget-conscious consumers.

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M.2: M.2, also known as Next Generation Form Factor (NGFF), is a computer expansion card format that is designed to replace the outdated mSATA standard. It is thinner and longer than mSATA, which gives it a much higher data transfer rate. The M.2 format measures 22mm in width and can measure up to 110mm in length. It uses the M-key and B-key connectors to interface with PC host systems, and can connect to both SATA III and PCIe for data transfer. Due to its small size, M.2 is often used for ultra-slim laptops and netbooks, as well as in embedded SSDs for tablets and other mobile devices. It is also becoming increasingly popular in the desktop computer industry, thanks to its compactness and fast transfer speeds. This makes M.2 ideal for gaming PCs, workstations, and other demanding applications that require high levels of data throughput.

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SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.

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