OPENEDGES achieves successful validation of 7nm HBM3 testchip, a major breakthrough.

OPENEDGES Technology, Inc, the memory subsystem IP provider, has some exciting news to share. Its subsidiary, The Six Semiconductor Inc (TSS), has successfully brought-up and validated its HBM3 testchip in 7 nm process technology. Now, I know what you’re thinking: “What on earth is a testchip and why should I care?” Well, let me break it down for you.

HBM3 stands for High Bandwidth Memory 3, and it’s a cutting-edge technology that offers blazing-fast speeds and high capacity. The HBM3 testchip is like a prototype that allows engineers to test and validate the performance of the HBM3 memory subsystem before it goes into production. It’s a crucial step in the development process, and not many companies have been able to achieve this feat.

But OPENEDGES is proud to be one of the few companies that have successfully demonstrated an HBM3 memory subsystem in silicon. Farhad Haghighi Zadeh, TSS Principal Engineer and project lead for the HBM3 PHY and testchip, expressed his confidence in the engineering team’s capabilities, which allowed them to take on this challenging task.

Now, let’s talk about the HBM3 PHY. PHY stands for Physical Layer, and it’s responsible for handling the electrical signals that flow between the memory controller and the memory chips. The HBM3 PHY developed by OPENEDGES utilizes state-of-the-art architecture to ensure optimal performance even in the face of process, voltage, and temperature variations. It supports up to 16 independent and asynchronous channels, each with 2×32-bit DWORD pseudo-channels. In simpler terms, it’s designed to handle a lot of data at once and make sure it gets to where it needs to go without any hiccups.

What’s even more impressive is that the HBM3 PHY has additional features like fast frequency switching, transient error handling, and lane repair. Fast frequency switching allows for multiple frequency set points, which means the memory subsystem can adapt to different performance requirements. Transient error handling, on the other hand, ensures data integrity by using techniques like ECC (Error Correction Code) and parity checks. And finally, lane repair automatically detects and fixes any issues with the interconnects, making sure that everything runs smoothly.

Now, developing an HBM3 memory subsystem is no walk in the park. It’s a complex process that involves integrating the memory controller/PHY SoC (System-on-Chip) with the HBM3 die stack, silicon interposer, and package Substrate. There are thousands of tiny micro-bumps that need to be assigned, connected, and verified correctly. It requires careful planning and design to make sure everything fits together perfectly. And let’s not forget about the power and ground delivery, which needs to be top-notch to ensure optimal performance.

But here’s the exciting part: the methodology used in developing the HBM3 PHY testchip can be applied to future chiplet designs. chiplets are small, modular chips that can be combined to create complex systems. So, by mastering the development of an advanced memory subsystem chiplet, OPENEDGES is positioning itself as the go-to memory subsystem IP vendor for the chiplet space.

Richard Fung, CEO of TSS, expressed his pride in the successful bring-up of the HBM3 testchip and its outstanding performance. He also emphasized that OPENEDGES’ lineup of advanced memory subsystem IPs is perfect for anyone looking to build an IO chiplet with memory interfaces. Their memory controllers and PHYs are fully integrated, fully verified, and ready to be deployed in customers’ chiplet products.

Sean Lee, CEO of OPENEDGES Technology, added that the successful validation of the HBM3 testchip is not just a milestone but a testament to the value of their technology. They are committed to empowering their partners with superior performance and reliability.

So, there you have it. OPENEDGES Technology and its subsidiary TSS have achieved something remarkable with the successful bring-up and validation of their HBM3 testchip. It’s a testament to their expertise, dedication, and commitment to pushing the boundaries of memory subsystem technology. And with their proven design methodology and complete portfolio of memory subsystem IPs, they are ready to take on the chiplet space and revolutionize the way we think about memory interfaces.

Technology Explained

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

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SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.

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Substrate: The technology substrate is a layer of material that provides a foundation for the components of a computer system. It is the foundation upon which the components of a computer system are built. It is usually made of a material such as silicon, which is a semiconductor material. The technology substrate is used to create the circuits and pathways that allow the components of a computer system to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components. The technology substrate is essential for the functioning of a computer system, as it provides the necessary pathways for the components to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components.