AMD CEO Dr. Lisa Su discusses the company's focus on AI and introduces their roadmap for the future of their Instinct lineup, including a new accelerator, the MI325X, and plans for two new CDNA architectures in 2025 and 2026.
- AMD's focus on AI and their plans for the future of their Instinct lineup show their commitment to staying competitive in the market.
- Their significant growth in sales and breaking records quarter after quarter demonstrate the success of their Instinct products.
- Their roadmap for the Instinct product lineup, including the announcement of a new accelerator and plans for future architectures, showcases their dedication to innovation and staying ahead of the competition.
In a recent presentation at Computex, AMD CEO Dr. Lisa Su discussed the company’s focus on AI and its plans for the future of their Instinct lineup of accelerators. AMD has seen significant growth in their Instinct products, with the MI300 surpassing sales projections and breaking growth records quarter after quarter. To stay competitive in the AI accelerator market, AMD is moving quickly to capitalize on market opportunities and keep up with other chipmakers.
During the presentation, AMD launched their roadmap for the Instinct product lineup, outlining their plans for both the short and long term. They announced a new accelerator, the MI325X, which features faster and denser HBM3E memory, allowing for accelerators with up to 288GB of memory and local memory bandwidths of 6TB/second.
Additionally, AMD showcased their CDNA architecture/Instinct product roadmap, revealing their plans through 2026. They will be launching two new CDNA architectures and associated Instinct products in 2025 and 2026. The MI350 series, powered by CDNA 4, will be released in 2025, followed by the MI400 series based on the CDNA “Next” architecture in 2026.
The MI325X accelerator is a mid-generation refresh of the MI300X, taking advantage of the availability of newer HBM3E memory. While the memory swap is the main change, the rest of the specifications remain unchanged from the original CDNA 3 architecture. The MI325X is expected to launch in Q4 of this year.
Looking ahead, AMD’s CDNA 4 architecture, built on a 3nm process, will power the MI350 series in 2025. It will bring native support for lower precision data formats and offer improved compute performance. Following CDNA 4, the CDNA “Next” architecture will be released in 2026 and will feature a significant architectural upgrade over CDNA 4.
Overall, AMD is committing to an annual CDNA roadmap cadence starting in 2024, reflecting their growing presence in the accelerator industry. With their latest announcements, AMD is poised to compete with other chipmakers and continue their success in the AI accelerator space.
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Background Information
About AMD:
AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.
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Event Info
About Computex:
Computex, held annually in Taipei, Taiwan, stands as one of the world's leading technology trade shows, showcasing cutting-edge innovations in computing hardware, software, and emerging technologies. With a focus on industry trends and product launches, it serves as a pivotal platform for tech giants and startups alike to unveil their latest advancements and forge key partnerships, attracting a global audience of industry professionals, enthusiasts, and media representatives.Latest Articles about Computex
Technology Explained
HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.
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